JPH0528766Y2 - - Google Patents
Info
- Publication number
- JPH0528766Y2 JPH0528766Y2 JP1988112708U JP11270888U JPH0528766Y2 JP H0528766 Y2 JPH0528766 Y2 JP H0528766Y2 JP 1988112708 U JP1988112708 U JP 1988112708U JP 11270888 U JP11270888 U JP 11270888U JP H0528766 Y2 JPH0528766 Y2 JP H0528766Y2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- polishing
- moved
- bonding head
- grindstone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988112708U JPH0528766Y2 (en:Method) | 1988-08-26 | 1988-08-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988112708U JPH0528766Y2 (en:Method) | 1988-08-26 | 1988-08-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0233436U JPH0233436U (en:Method) | 1990-03-02 |
| JPH0528766Y2 true JPH0528766Y2 (en:Method) | 1993-07-23 |
Family
ID=31351892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988112708U Expired - Lifetime JPH0528766Y2 (en:Method) | 1988-08-26 | 1988-08-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0528766Y2 (en:Method) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60246643A (ja) * | 1984-05-22 | 1985-12-06 | Shinkawa Ltd | テ−プボンダ |
-
1988
- 1988-08-26 JP JP1988112708U patent/JPH0528766Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0233436U (en:Method) | 1990-03-02 |
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