JPH0528496B2 - - Google Patents

Info

Publication number
JPH0528496B2
JPH0528496B2 JP60179091A JP17909185A JPH0528496B2 JP H0528496 B2 JPH0528496 B2 JP H0528496B2 JP 60179091 A JP60179091 A JP 60179091A JP 17909185 A JP17909185 A JP 17909185A JP H0528496 B2 JPH0528496 B2 JP H0528496B2
Authority
JP
Japan
Prior art keywords
substrate
heater block
recognition mark
light
wire bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60179091A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6239020A (ja
Inventor
Juji Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP60179091A priority Critical patent/JPS6239020A/ja
Publication of JPS6239020A publication Critical patent/JPS6239020A/ja
Publication of JPH0528496B2 publication Critical patent/JPH0528496B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP60179091A 1985-08-14 1985-08-14 ワイヤボンデイング装置 Granted JPS6239020A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60179091A JPS6239020A (ja) 1985-08-14 1985-08-14 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60179091A JPS6239020A (ja) 1985-08-14 1985-08-14 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS6239020A JPS6239020A (ja) 1987-02-20
JPH0528496B2 true JPH0528496B2 (enExample) 1993-04-26

Family

ID=16059904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60179091A Granted JPS6239020A (ja) 1985-08-14 1985-08-14 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS6239020A (enExample)

Also Published As

Publication number Publication date
JPS6239020A (ja) 1987-02-20

Similar Documents

Publication Publication Date Title
JPH0528496B2 (enExample)
DE69802034D1 (de) System zum Entfernen von Lötmaterial
JP2000040712A (ja) ボンディング装置
JP2010050344A (ja) リワーク装置
JP2000059098A (ja) 部品実装装置
JP2644741B2 (ja) プロキシミティ露光方法およびその装置
JPH068634A (ja) マーキング方法
JPH01133672A (ja) はんだの吸取治具
JP2004264063A (ja) 撮像装置
JPH08323489A (ja) レーザ加工装置
EP0336114A3 (de) Vorrichtung zur Lageerfassung der Anschlusskontakte elektrischer oder elektronischer Bauelemente
JPH01297534A (ja) 面発光装置
JP3031956B2 (ja) 半田量検査方法
JPH0555740A (ja) 電子部品半田付け方法および装置
JPH04350706A (ja) 照明装置
JP4118400B2 (ja) フィルム転写修正装置
JPH0832226A (ja) レーザーリフロー装置及び方法
JPH03192800A (ja) プリント基板の部品実装認識方法
JPH084926B2 (ja) 回路基板の自動はんだ付け装置
JPS62113864U (enExample)
JPH069215B2 (ja) 位置決め装置
KR20250157004A (ko) Ipl 광소결을 이용한 기판-리드 부착 방법
JPH0388374U (enExample)
JPH0239649Y2 (enExample)
JPH0623529A (ja) ハンダ付方法及び装置