JPH0527971B2 - - Google Patents

Info

Publication number
JPH0527971B2
JPH0527971B2 JP15227684A JP15227684A JPH0527971B2 JP H0527971 B2 JPH0527971 B2 JP H0527971B2 JP 15227684 A JP15227684 A JP 15227684A JP 15227684 A JP15227684 A JP 15227684A JP H0527971 B2 JPH0527971 B2 JP H0527971B2
Authority
JP
Japan
Prior art keywords
layer
type
etching
silicon substrate
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP15227684A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6130039A (ja
Inventor
Masaki Hirata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP15227684A priority Critical patent/JPS6130039A/ja
Publication of JPS6130039A publication Critical patent/JPS6130039A/ja
Publication of JPH0527971B2 publication Critical patent/JPH0527971B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Sensors (AREA)
  • Weting (AREA)
JP15227684A 1984-07-23 1984-07-23 エツチングの方法 Granted JPS6130039A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15227684A JPS6130039A (ja) 1984-07-23 1984-07-23 エツチングの方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15227684A JPS6130039A (ja) 1984-07-23 1984-07-23 エツチングの方法

Publications (2)

Publication Number Publication Date
JPS6130039A JPS6130039A (ja) 1986-02-12
JPH0527971B2 true JPH0527971B2 (enrdf_load_stackoverflow) 1993-04-22

Family

ID=15536966

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15227684A Granted JPS6130039A (ja) 1984-07-23 1984-07-23 エツチングの方法

Country Status (1)

Country Link
JP (1) JPS6130039A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61137329A (ja) * 1984-12-10 1986-06-25 Yokogawa Electric Corp 半導体の微細加工方法
JPH01145873A (ja) * 1987-12-02 1989-06-07 Yokogawa Electric Corp 半導体圧力センサの製造方法
EP0567075B1 (en) * 1992-04-22 2001-10-24 Denso Corporation A method for producing semiconductor device

Also Published As

Publication number Publication date
JPS6130039A (ja) 1986-02-12

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term