JPH0526741Y2 - - Google Patents

Info

Publication number
JPH0526741Y2
JPH0526741Y2 JP14257088U JP14257088U JPH0526741Y2 JP H0526741 Y2 JPH0526741 Y2 JP H0526741Y2 JP 14257088 U JP14257088 U JP 14257088U JP 14257088 U JP14257088 U JP 14257088U JP H0526741 Y2 JPH0526741 Y2 JP H0526741Y2
Authority
JP
Japan
Prior art keywords
package
attachment
integrated circuit
molding
male connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP14257088U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0262721U (US20100012521A1-20100121-C00001.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14257088U priority Critical patent/JPH0526741Y2/ja
Publication of JPH0262721U publication Critical patent/JPH0262721U/ja
Application granted granted Critical
Publication of JPH0526741Y2 publication Critical patent/JPH0526741Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP14257088U 1988-10-31 1988-10-31 Expired - Lifetime JPH0526741Y2 (US20100012521A1-20100121-C00001.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14257088U JPH0526741Y2 (US20100012521A1-20100121-C00001.png) 1988-10-31 1988-10-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14257088U JPH0526741Y2 (US20100012521A1-20100121-C00001.png) 1988-10-31 1988-10-31

Publications (2)

Publication Number Publication Date
JPH0262721U JPH0262721U (US20100012521A1-20100121-C00001.png) 1990-05-10
JPH0526741Y2 true JPH0526741Y2 (US20100012521A1-20100121-C00001.png) 1993-07-07

Family

ID=31408644

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14257088U Expired - Lifetime JPH0526741Y2 (US20100012521A1-20100121-C00001.png) 1988-10-31 1988-10-31

Country Status (1)

Country Link
JP (1) JPH0526741Y2 (US20100012521A1-20100121-C00001.png)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4548199B2 (ja) * 2005-04-22 2010-09-22 株式会社デンソー 電子回路装置の製造方法
JP2009033065A (ja) * 2007-07-30 2009-02-12 Mitsubishi Electric Corp フィン一体型半導体モジュールおよびその製造方法
DE102008040676A1 (de) * 2008-07-24 2010-01-28 Robert Bosch Gmbh Abdichtrahmen sowie Verfahren zum Abdecken eines Bauteils
JP2018146264A (ja) * 2017-03-01 2018-09-20 矢崎総業株式会社 絶縁状態検出装置

Also Published As

Publication number Publication date
JPH0262721U (US20100012521A1-20100121-C00001.png) 1990-05-10

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