JPH0526738Y2 - - Google Patents
Info
- Publication number
- JPH0526738Y2 JPH0526738Y2 JP1985111524U JP11152485U JPH0526738Y2 JP H0526738 Y2 JPH0526738 Y2 JP H0526738Y2 JP 1985111524 U JP1985111524 U JP 1985111524U JP 11152485 U JP11152485 U JP 11152485U JP H0526738 Y2 JPH0526738 Y2 JP H0526738Y2
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- hole
- pad
- film
- passivation film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 58
- 238000002161 passivation Methods 0.000 claims description 46
- 239000004065 semiconductor Substances 0.000 claims description 38
- 230000004888 barrier function Effects 0.000 claims description 11
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000009719 polyimide resin Substances 0.000 claims description 3
- 238000013459 approach Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 90
- 239000010410 layer Substances 0.000 description 26
- 239000011229 interlayer Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 7
- 238000009413 insulation Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 3
- 229910020658 PbSn Inorganic materials 0.000 description 3
- 101150071746 Pbsn gene Proteins 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000004570 mortar (masonry) Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910017401 Au—Ge Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985111524U JPH0526738Y2 (US20090163788A1-20090625-C00002.png) | 1985-07-20 | 1985-07-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985111524U JPH0526738Y2 (US20090163788A1-20090625-C00002.png) | 1985-07-20 | 1985-07-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6219741U JPS6219741U (US20090163788A1-20090625-C00002.png) | 1987-02-05 |
JPH0526738Y2 true JPH0526738Y2 (US20090163788A1-20090625-C00002.png) | 1993-07-07 |
Family
ID=30991521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985111524U Expired - Lifetime JPH0526738Y2 (US20090163788A1-20090625-C00002.png) | 1985-07-20 | 1985-07-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0526738Y2 (US20090163788A1-20090625-C00002.png) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000055898A1 (fr) * | 1999-03-16 | 2000-09-21 | Seiko Epson Corporation | Dispositif a semi-conducteur, son procede de fabrication, carte de circuit et dispositif electronique |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5334466A (en) * | 1976-09-10 | 1978-03-31 | Mitsubishi Electric Corp | Electrode construction of semiconductor device |
JPS57117258A (en) * | 1981-01-13 | 1982-07-21 | Ricoh Elemex Corp | Semiconductor device |
JPS5940550A (ja) * | 1982-08-30 | 1984-03-06 | Hitachi Ltd | 半導体装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4867662U (US20090163788A1-20090625-C00002.png) * | 1971-12-03 | 1973-08-28 |
-
1985
- 1985-07-20 JP JP1985111524U patent/JPH0526738Y2/ja not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5334466A (en) * | 1976-09-10 | 1978-03-31 | Mitsubishi Electric Corp | Electrode construction of semiconductor device |
JPS57117258A (en) * | 1981-01-13 | 1982-07-21 | Ricoh Elemex Corp | Semiconductor device |
JPS5940550A (ja) * | 1982-08-30 | 1984-03-06 | Hitachi Ltd | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS6219741U (US20090163788A1-20090625-C00002.png) | 1987-02-05 |
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