JPH0525238Y2 - - Google Patents

Info

Publication number
JPH0525238Y2
JPH0525238Y2 JP1987000107U JP10787U JPH0525238Y2 JP H0525238 Y2 JPH0525238 Y2 JP H0525238Y2 JP 1987000107 U JP1987000107 U JP 1987000107U JP 10787 U JP10787 U JP 10787U JP H0525238 Y2 JPH0525238 Y2 JP H0525238Y2
Authority
JP
Japan
Prior art keywords
bonding
substrate
moving
arm
distance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987000107U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63108632U (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987000107U priority Critical patent/JPH0525238Y2/ja
Publication of JPS63108632U publication Critical patent/JPS63108632U/ja
Application granted granted Critical
Publication of JPH0525238Y2 publication Critical patent/JPH0525238Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1987000107U 1987-01-06 1987-01-06 Expired - Lifetime JPH0525238Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987000107U JPH0525238Y2 (enrdf_load_stackoverflow) 1987-01-06 1987-01-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987000107U JPH0525238Y2 (enrdf_load_stackoverflow) 1987-01-06 1987-01-06

Publications (2)

Publication Number Publication Date
JPS63108632U JPS63108632U (enrdf_load_stackoverflow) 1988-07-13
JPH0525238Y2 true JPH0525238Y2 (enrdf_load_stackoverflow) 1993-06-25

Family

ID=30776792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987000107U Expired - Lifetime JPH0525238Y2 (enrdf_load_stackoverflow) 1987-01-06 1987-01-06

Country Status (1)

Country Link
JP (1) JPH0525238Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS63108632U (enrdf_load_stackoverflow) 1988-07-13

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