JPH0524679B2 - - Google Patents
Info
- Publication number
- JPH0524679B2 JPH0524679B2 JP63009128A JP912888A JPH0524679B2 JP H0524679 B2 JPH0524679 B2 JP H0524679B2 JP 63009128 A JP63009128 A JP 63009128A JP 912888 A JP912888 A JP 912888A JP H0524679 B2 JPH0524679 B2 JP H0524679B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- ceramic substrate
- thick film
- bonding
- image recognition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63-9128A JPH01793A (ja) | 1987-02-09 | 1988-01-18 | 回路装置の製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2846687 | 1987-02-09 | ||
| JP62-28466 | 1987-02-09 | ||
| JP63-9128A JPH01793A (ja) | 1987-02-09 | 1988-01-18 | 回路装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPS64793A JPS64793A (en) | 1989-01-05 |
| JPH01793A JPH01793A (ja) | 1989-01-05 |
| JPH0524679B2 true JPH0524679B2 (enExample) | 1993-04-08 |
Family
ID=
Also Published As
| Publication number | Publication date |
|---|---|
| JPS64793A (en) | 1989-01-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |