JPH0524217B2 - - Google Patents

Info

Publication number
JPH0524217B2
JPH0524217B2 JP63214527A JP21452788A JPH0524217B2 JP H0524217 B2 JPH0524217 B2 JP H0524217B2 JP 63214527 A JP63214527 A JP 63214527A JP 21452788 A JP21452788 A JP 21452788A JP H0524217 B2 JPH0524217 B2 JP H0524217B2
Authority
JP
Japan
Prior art keywords
alloy
content
connectors
terminals
punching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63214527A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0266130A (ja
Inventor
Takeshi Suzuki
Tadao Sakakibara
Manpei Kuwabara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Original Assignee
Mitsubishi Shindoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindoh Co Ltd filed Critical Mitsubishi Shindoh Co Ltd
Priority to JP21452788A priority Critical patent/JPH0266130A/ja
Publication of JPH0266130A publication Critical patent/JPH0266130A/ja
Publication of JPH0524217B2 publication Critical patent/JPH0524217B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Conductive Materials (AREA)
JP21452788A 1988-08-29 1988-08-29 打抜金型摩耗の少ない端子・コネクタ用Cu合金 Granted JPH0266130A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21452788A JPH0266130A (ja) 1988-08-29 1988-08-29 打抜金型摩耗の少ない端子・コネクタ用Cu合金

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21452788A JPH0266130A (ja) 1988-08-29 1988-08-29 打抜金型摩耗の少ない端子・コネクタ用Cu合金

Publications (2)

Publication Number Publication Date
JPH0266130A JPH0266130A (ja) 1990-03-06
JPH0524217B2 true JPH0524217B2 (ru) 1993-04-07

Family

ID=16657200

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21452788A Granted JPH0266130A (ja) 1988-08-29 1988-08-29 打抜金型摩耗の少ない端子・コネクタ用Cu合金

Country Status (1)

Country Link
JP (1) JPH0266130A (ru)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2503793B2 (ja) * 1991-03-01 1996-06-05 三菱伸銅株式会社 打抜金型の摩耗抑制効果を有する電気電子部品用Cu合金板材
JP3739214B2 (ja) 1998-03-26 2006-01-25 株式会社神戸製鋼所 電子部品用銅合金板
JP6355672B2 (ja) * 2016-03-31 2018-07-11 Jx金属株式会社 Cu−Ni−Si系銅合金及びその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61127842A (ja) * 1984-11-24 1986-06-16 Kobe Steel Ltd 端子・コネクタ−用銅合金およびその製造方法
JPS6376839A (ja) * 1986-09-18 1988-04-07 Furukawa Electric Co Ltd:The 電子機器用銅合金とその製造法
JPS63130739A (ja) * 1986-11-20 1988-06-02 Nippon Mining Co Ltd 半導体機器リ−ド材又は導電性ばね材用高力高導電銅合金

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61127842A (ja) * 1984-11-24 1986-06-16 Kobe Steel Ltd 端子・コネクタ−用銅合金およびその製造方法
JPS6376839A (ja) * 1986-09-18 1988-04-07 Furukawa Electric Co Ltd:The 電子機器用銅合金とその製造法
JPS63130739A (ja) * 1986-11-20 1988-06-02 Nippon Mining Co Ltd 半導体機器リ−ド材又は導電性ばね材用高力高導電銅合金

Also Published As

Publication number Publication date
JPH0266130A (ja) 1990-03-06

Similar Documents

Publication Publication Date Title
US4559200A (en) High strength and high conductivity copper alloy
EP0175183B1 (en) Copper alloys having an improved combination of strength and conductivity
JP4787986B2 (ja) 銅合金およびその製造方法
JP2001294957A (ja) コネクタ用銅合金およびその製造法
EP0189637B1 (en) Copper alloy and production of the same
US5024814A (en) Copper alloy having excellent hot rollability and excellent adhesion strength of plated surface thereof when heated
JP4754930B2 (ja) 電子材料用Cu−Ni−Si系銅合金
JPH059619A (ja) 高力銅合金の製造方法
JPH0480102B2 (ru)
JP4431741B2 (ja) 銅合金の製造方法
JP2000144284A (ja) 耐熱性に優れる高強度・高導電性Cu−Fe系合金板
JPH0524217B2 (ru)
JP2503793B2 (ja) 打抜金型の摩耗抑制効果を有する電気電子部品用Cu合金板材
JP4042920B2 (ja) 強度および打抜き加工性に優れた電気電子部品用Cu合金
JPS6146534B2 (ru)
JPH07113133B2 (ja) 連続鋳造鋳型用Cu合金
JPH0696757B2 (ja) 耐熱性および曲げ加工性が優れる高力、高導電性銅合金の製造方法
JPH0243811B2 (ja) Riidofureemuyodogokinoyobisonoseizoho
JP3519863B2 (ja) 表面割れ感受性の低いりん青銅及びその製造方法
JPH1053824A (ja) 接点材用銅合金およびその製造方法
JPH04210438A (ja) 高強度Cu 合金製連続鋳造鋳型材
WO2020170956A1 (ja) 銅合金材、整流子片、電極材
JPS6144930B2 (ru)
JPS5835584B2 (ja) 良好な熱間圧延性を有するりん青銅
JPH0813066A (ja) スタンピング性に優れた銅合金または銅合金薄板

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080407

Year of fee payment: 15

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090407

Year of fee payment: 16

EXPY Cancellation because of completion of term
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090407

Year of fee payment: 16