JPH0523872B2 - - Google Patents
Info
- Publication number
- JPH0523872B2 JPH0523872B2 JP28311985A JP28311985A JPH0523872B2 JP H0523872 B2 JPH0523872 B2 JP H0523872B2 JP 28311985 A JP28311985 A JP 28311985A JP 28311985 A JP28311985 A JP 28311985A JP H0523872 B2 JPH0523872 B2 JP H0523872B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- soldering
- molten solder
- molten
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 81
- 238000005476 soldering Methods 0.000 claims description 43
- 238000000034 method Methods 0.000 claims description 18
- 230000000694 effects Effects 0.000 description 5
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28311985A JPS62144873A (ja) | 1985-12-18 | 1985-12-18 | はんだ付け方法および装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28311985A JPS62144873A (ja) | 1985-12-18 | 1985-12-18 | はんだ付け方法および装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62144873A JPS62144873A (ja) | 1987-06-29 |
| JPH0523872B2 true JPH0523872B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-04-06 |
Family
ID=17661469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28311985A Granted JPS62144873A (ja) | 1985-12-18 | 1985-12-18 | はんだ付け方法および装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62144873A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4634576B2 (ja) * | 2000-06-27 | 2011-02-16 | 株式会社タムラ製作所 | 局所はんだ付け装置および局所はんだ付け方法 |
| WO2011105034A1 (ja) * | 2010-02-26 | 2011-09-01 | パナソニック株式会社 | 半田付け装置 |
-
1985
- 1985-12-18 JP JP28311985A patent/JPS62144873A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62144873A (ja) | 1987-06-29 |