JPH0523871B2 - - Google Patents
Info
- Publication number
- JPH0523871B2 JPH0523871B2 JP23756485A JP23756485A JPH0523871B2 JP H0523871 B2 JPH0523871 B2 JP H0523871B2 JP 23756485 A JP23756485 A JP 23756485A JP 23756485 A JP23756485 A JP 23756485A JP H0523871 B2 JPH0523871 B2 JP H0523871B2
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- soldered
- molten solder
- thin metal
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005476 soldering Methods 0.000 claims description 42
- 229910000679 solder Inorganic materials 0.000 claims description 37
- 239000002184 metal Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 18
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 210000002268 wool Anatomy 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 6
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 235000000396 iron Nutrition 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23756485A JPS6297763A (ja) | 1985-10-25 | 1985-10-25 | はんだ付け方法および装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23756485A JPS6297763A (ja) | 1985-10-25 | 1985-10-25 | はんだ付け方法および装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6297763A JPS6297763A (ja) | 1987-05-07 |
| JPH0523871B2 true JPH0523871B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-04-06 |
Family
ID=17017181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23756485A Granted JPS6297763A (ja) | 1985-10-25 | 1985-10-25 | はんだ付け方法および装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6297763A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2517469B2 (ja) * | 1990-10-12 | 1996-07-24 | 三洋電機株式会社 | 半田付方法 |
-
1985
- 1985-10-25 JP JP23756485A patent/JPS6297763A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6297763A (ja) | 1987-05-07 |