JPH05235094A - Circuit connecting method - Google Patents
Circuit connecting methodInfo
- Publication number
- JPH05235094A JPH05235094A JP5469791A JP5469791A JPH05235094A JP H05235094 A JPH05235094 A JP H05235094A JP 5469791 A JP5469791 A JP 5469791A JP 5469791 A JP5469791 A JP 5469791A JP H05235094 A JPH05235094 A JP H05235094A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- liquid crystal
- crystal panel
- chip
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はポケットテレビ、壁掛け
テレビ、プロジェクションテレビ、ラップトップパソコ
ン、ゲーム機、等に持ちいられる液晶パネルやその他の
回路部品の実装方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of mounting a liquid crystal panel and other circuit parts which can be carried in a pocket TV, a wall-mounted TV, a projection TV, a laptop personal computer, a game machine and the like.
【０００２】[0002]
【従来の技術】従来よりポケットテレビなど液晶パネル
を組み込むためには小型、高密度実装の液晶パネルを構
成する必要がある。その対策の一例として液晶パネルを
構成しているガラス基板上にＩＣチップを直接搭載する
方法が提案されている。2. Description of the Related Art Conventionally, in order to incorporate a liquid crystal panel such as a pocket television, it is necessary to construct a small-sized, high-density mounted liquid crystal panel. As one example of measures against this, a method of directly mounting an IC chip on a glass substrate which constitutes a liquid crystal panel has been proposed.
【０００３】以下図面を参照しながら、従来の液晶パネ
ルについて説明する。図４、５は従来の液晶パネルの一
例を示すものである。図４は相対峙して形成された接続
用回路すなわちＩＣチップと液晶パネルガラスの電極パ
ターンの間に絶縁性接着剤あるいは絶縁性接着剤中に導
電性微粒子を分散させた接着剤を狭持して上記相対峙す
る接続用回路を位置合わせする工程、図５はＩＣチップ
の上から高温のツールによって加圧されながら加熱さ
れ、上記接着剤を加熱硬化してＩＣチップと液晶パネル
ガラスの電極パターンを本圧着接合した様子を示す。A conventional liquid crystal panel will be described below with reference to the drawings. 4 and 5 show an example of a conventional liquid crystal panel. FIG. 4 shows an insulating adhesive or an adhesive in which conductive fine particles are dispersed in the insulating adhesive sandwiched between the IC chip and the electrode pattern of the liquid crystal panel glass, which is a connection circuit formed by facing each other. 5 is a step of aligning the connecting circuits facing each other. FIG. 5 shows that the adhesive is heat-cured while being pressed from above the IC chip by a high temperature tool to heat and cure the adhesive to form the electrode pattern of the IC chip and the liquid crystal panel glass. The figure shows the state of main compression bonding.
【０００４】図４、５において２１はＩＣチップ、２２
は液晶パネル、２３は液晶パネルの基板上に形成された
電極パターン、２４は導電性微粒子を絶縁性接着剤中に
分散させた接着剤層、２５はＡｕバンプ、２６は圧着ツ
ールを示す。ＩＣチップ上には電極パッドが形成されて
いる。その電極パッド上にはＡｕバンプが形成されてい
る。液晶パネルの基板上には上記ＩＣチップの接続電極
と相対峙して接続用回路が形成されている。In FIGS. 4 and 5, reference numeral 21 denotes an IC chip, 22
Is a liquid crystal panel, 23 is an electrode pattern formed on the substrate of the liquid crystal panel, 24 is an adhesive layer in which conductive fine particles are dispersed in an insulating adhesive, 25 is an Au bump, and 26 is a pressure bonding tool. Electrode pads are formed on the IC chip. Au bumps are formed on the electrode pads. A connection circuit is formed on the substrate of the liquid crystal panel, facing the connection electrodes of the IC chip.
【０００５】[0005]
【発明が解決しようとする課題】図４において、絶縁性
接着剤あるいは絶縁性接着剤中に導電性微粒子を分散さ
せた接着剤は相対峙して形成された接続用回路すなわち
ＩＣチップと液晶パネルガラスの電極パターンの間に加
熱や加圧無しに狭持される、この時相対峙して形成され
た接続用回路すなわちＩＣチップと液晶パネルガラスの
電極パターンは純粋に位置合わせされる。その後、図５
においてＩＣチップの上から高温のツールによって加圧
されながら加熱され、上記接着剤を加熱硬化してＩＣチ
ップと液晶パネルガラスの電極パターンは導通接続され
る。この時、一般的に用いられる接着剤としてのエポキ
シ系の接着剤は完全硬化する。In FIG. 4, an insulating adhesive or an adhesive in which conductive fine particles are dispersed in the insulating adhesive is a connection circuit formed by facing each other, that is, an IC chip and a liquid crystal panel. The connection circuit that is sandwiched between the electrode patterns of the glass without heating or pressurization, that is, the connecting circuit formed in this way, that is, the IC chip and the electrode pattern of the liquid crystal panel glass are purely aligned. After that, FIG.
In, the IC chip is heated while being pressed by a high temperature tool, and the adhesive is heat-cured to electrically connect the IC chip and the electrode pattern of the liquid crystal panel glass. At this time, an epoxy-based adhesive that is generally used as an adhesive is completely cured.
【０００６】しかし、従来の回路の接続用接着剤を用い
た接続構造体は図４、５より明らかなように幾多の問題
点を有するものであった。However, the conventional connecting structure using the adhesive for connecting circuits has many problems as apparent from FIGS.
【０００７】まず、従来の回路の接続用接着剤を用いた
接続構造体は、半導体チップ２１を回路基板に接合した
のち、特性検査をし、これが不良であったと判定された
場合、一旦熱硬化性接着剤が完全硬化した後の剥離再生
は極めて作業困難なものとなる。すなわちエポキシのよ
うな熱硬化性接着剤は硬く接着強度が大きいため機械的
に剥るのが難しいばかりではなく、無理矢理に剥ったと
してもはぎ取ったＩＣチップはほとんど破壊されてしま
い、きわめてもったいないものとなってしまうものであ
った。しかも、無理矢理にはぎ取った後の回路基板側の
残査もきわめて強固なものであり、アルコールやアセト
ンの様な溶剤でもとりずらく無理して取ろうとすると、
回路基板の基材をも壊しかねないものであった。このよ
うに不良発生時の剥離再生作業がやりずらいばかりでは
なく、再生しようとした部品をも破壊しかねないもので
あった。回路基板が液晶パネルの場合、特に部品が破壊
した場合の損失は大きくなってしまうものであった。First, the conventional connection structure using a circuit connection adhesive is subjected to a characteristic inspection after the semiconductor chip 21 is bonded to the circuit board, and if it is determined to be defective, it is once thermoset. The peeling reproduction after the complete curing of the adhesive has become extremely difficult. That is, thermosetting adhesives such as epoxy are not only difficult to peel mechanically because they are hard and have high adhesive strength, but even if they are forcibly peeled off, the peeled IC chips are almost destroyed, which is extremely wasteful. It was something that became. Moreover, the residue on the circuit board side after it is forcibly stripped is extremely strong, and if you try to forcefully remove it with a solvent such as alcohol or acetone,
It could also damage the substrate of the circuit board. As described above, not only is the peeling and reclaiming work difficult when a defect occurs, but also the parts to be reclaimed may be destroyed. When the circuit board is a liquid crystal panel, the loss is particularly large when the parts are broken.
【０００８】さらに、剥離再生を容易なものにするため
に、接着剤として熱可塑性接着剤を用いることもできな
いではないが、この場合、接合の信頼性はかなり損なわ
れてしまう。Further, it is not impossible to use a thermoplastic adhesive as an adhesive for facilitating peeling and reproduction, but in this case, the reliability of bonding is considerably deteriorated.
【０００９】そこで、本発明は従来のこのような欠点を
解決し相対峙して形成された接続回路の接続の不良時の
剥離再生作業を容易にし、剥離再生によって部品が壊れ
てしまう確率を低減し、しかも接合の信頼性を高くする
ものである。Therefore, the present invention solves the above-mentioned drawbacks of the related art and facilitates the peeling / reclaiming work at the time of a defective connection of the connection circuit formed by facing each other, and reduces the probability that parts are broken by the peeling / reclaiming. In addition, the reliability of the joining is increased.
【００１０】[0010]
【課題を解決するための手段】本発明による回路の接続
方法は、相対峙して形成された接続用回路の間に絶縁性
接着剤あるいは絶縁性接着剤中に導電性微粒子を分散さ
せた接着剤を狭持して接合する回路の接続方法におい
て、上記接着剤を狭持しながら上記相対峙する接続用回
路を位置合わせする工程、一方の接続用回路から均一な
圧力が加えられながら接着剤の部分硬化によって所定の
接続用電極を初期的に導通接合せしめて仮止めする工
程、接着剤の完全硬化による本硬化の工程を有する事を
特徴とする。SUMMARY OF THE INVENTION A circuit connecting method according to the present invention is an adhesive in which conductive particles are dispersed in an insulating adhesive or an insulating adhesive between connecting circuits formed by facing each other. In a circuit connecting method of sandwiching and bonding an adhesive, a step of aligning the connecting circuit which holds the adhesive while sandwiching the adhesive, and an adhesive while applying a uniform pressure from one of the connecting circuits. The method is characterized by including a step of initially conducting and joining a predetermined connecting electrode by partial curing and temporarily fixing it, and a step of main curing by complete curing of the adhesive.
【００１１】[0011]
【実施例】図１〜図３は本発明による回路の接続工程を
示す。図１は相対峙して形成された接続用回路すなわち
ＩＣチップと液晶パネルガラスの電極パターンの間に絶
縁性接着剤あるいは絶縁性接着剤中に導電性微粒子を分
散させた接着剤を狭持して上記相対峙する接続用回路を
位置合わせする工程を示し、また図２はＩＣの上から圧
力が加えられながら上記狭持された接着剤に対し、液晶
パネルのガラスの裏面より部分的にレーザー光線を照射
しスポット的に上記接着剤を硬化し、初期的にＩＣの接
続用回路たる電極パッド上に形成されたＡｕバンプが相
対峙する液晶パネルガラスの電極パターンに充分押しつ
けられ、導通接続が図られている。また図２の状態で液
晶パネルは基本的に点灯表示できる。しかし、上記のよ
うにスポット的な硬化のため長期信頼性はもちろん無
い。図３は図２にて加圧および部分加熱の状態のものを
ＩＣ上部より高温のツールによって加圧されながら加熱
され、上記接着剤を加熱硬化してＩＣチップと液晶パネ
ルガラスの電極パターンを本圧着接合した様子を示す。
この時接着剤たる例えばエポキシ系接着剤は完全に硬化
している。図１に於て、１はＩＣチップ、２は液晶パネ
ル、３は液晶パネルの基板上に形成された電極パター
ン、４は接着剤、５はレーザー光、６はＡｕバンプ、７
は仮固定用ツール、８は本圧着ツール、９は接着剤中に
おいて部分硬化した部位を示す。1 to 3 show a process of connecting a circuit according to the present invention. FIG. 1 shows an insulating adhesive or an adhesive in which conductive fine particles are dispersed in an insulating adhesive sandwiched between the IC chip and the electrode pattern of the liquid crystal panel glass, which is a connection circuit formed by facing each other. FIG. 2 shows a step of aligning the connecting circuits which face each other, and FIG. 2 shows a laser beam partially from the back surface of the glass of the liquid crystal panel to the adhesive sandwiched while pressure is applied from above the IC. To cure the adhesive spotwise, and the Au bumps initially formed on the electrode pads, which are IC connection circuits, are sufficiently pressed against the electrode patterns of the liquid crystal panel glass facing each other to establish a conductive connection. Has been. In the state of FIG. 2, the liquid crystal panel can basically be lit and displayed. However, as described above, since the curing is spot-like, there is no long-term reliability. In FIG. 3, the pressure and partial heating state in FIG. 2 is heated while being pressed by a tool at a temperature higher than the upper part of the IC, and the adhesive is heat-cured to form the electrode pattern of the IC chip and the liquid crystal panel glass. The state of being pressure-bonded and joined is shown.
At this time, the adhesive, for example, an epoxy adhesive is completely cured. In FIG. 1, 1 is an IC chip, 2 is a liquid crystal panel, 3 is an electrode pattern formed on a substrate of the liquid crystal panel, 4 is an adhesive, 5 is a laser beam, 6 is an Au bump, 7
Indicates a temporary fixing tool, 8 indicates a main pressure-bonding tool, and 9 indicates a partially cured portion in the adhesive.
【００１２】図１より明らかなように、本発明による回
路の接続方法は、図２に示すように、レーザー光線を接
着剤の一部分に照射してスポット的に硬化させるため、
長期信頼性は無いが確実にＩＣのバンプは液晶パネルガ
ラスの電極に押しつけられて初期的な電気的導通が図ら
れているため、初期的に液晶パネルを点灯表示すること
ができ、この状態で液晶パネルの点灯検査をすることが
できる。もしこの状態で不良が発見されれば、比較的容
易に液晶パネルもＩＣも破壊せずに剥離再生することが
できる。すなわち、接合がごく小さい点で成り立ってい
るため、剥離再生するときも、この小さい点を破断すれ
ばよい。その結果良品のみを後工程に送ることが出来る
ため、製造効率が向上し製造コストを低減することがで
きるものである。点灯検査の結果良品であれば、この時
点ですでにＩＣチップの電極パッドと液晶パネルガラス
の接続用回路は位置合わせが済んでいるため、そのま
ま、本圧着工程にまわすことができる。この時、わずら
わしい位置合わせ工程は不要であり、ほとんどラフな位
置決めで圧着すればよい。As is apparent from FIG. 1, the circuit connecting method according to the present invention, as shown in FIG. 2, irradiates a part of the adhesive with a laser beam to cure the adhesive in spots.
Although there is no long-term reliability, the bumps of the IC are surely pressed against the electrodes of the liquid crystal panel glass for initial electrical conduction, so the liquid crystal panel can be lit and displayed initially. It is possible to inspect the lighting of the liquid crystal panel. If a defect is found in this state, peeling and reproduction can be relatively easily performed without destroying the liquid crystal panel or the IC. That is, since the bonding is made up of very small points, the small points may be broken even when peeling and reproducing. As a result, only non-defective products can be sent to the subsequent process, so that the manufacturing efficiency is improved and the manufacturing cost can be reduced. If it is a non-defective product as a result of the lighting inspection, the electrode pads of the IC chip and the circuit for connecting the liquid crystal panel glass have already been aligned at this point, so that the product can be directly subjected to the main pressure bonding step. At this time, a troublesome positioning process is unnecessary, and it is sufficient to perform the pressure bonding with almost rough positioning.
【００１３】さらに、本発明による回路の接続方法は、
上記の点灯表示を比較的容易に行なうことが出来る。す
なわち、液晶パネルの駆動用ＩＣは出力パッド数はきわ
めて多いが、入力信号のパッド数は少ない。従って、入
力信号より引き出された液晶パネルガラス上の電極パタ
ーンは広いピッチでガラスの縁部に配されており、機械
的な針を用いた探針は比較的容易である。そのため、点
灯表示検査そのものが容易であり、点灯検査用の機械も
安価で済むものである。Further, the circuit connecting method according to the present invention is
The above lighting display can be performed relatively easily. That is, the number of output pads of the liquid crystal panel driving IC is extremely large, but the number of input signal pads is small. Therefore, the electrode pattern on the liquid crystal panel glass extracted from the input signal is arranged at the edge of the glass at a wide pitch, and the probe using a mechanical needle is relatively easy. Therefore, the lighting display inspection itself is easy, and the lighting inspection machine is inexpensive.
【００１４】また、本発明による効果は以上説明したよ
うなレーザー光線を用いた場合ばかりでなく、キセノン
ランプ等の可視光をレンズで集光して使う場合も同じで
あり、また、この様な光線を用いて加熱する場合のみで
なく、小さな抵抗加熱線を接着剤中に埋め込ませて接着
剤を部分的に硬化する場合も同じである。Further, the effect of the present invention is the same not only when the laser beam as described above is used but also when the visible light of a xenon lamp or the like is condensed and used by a lens. The same applies not only when heating is performed by using, but also when a small resistance heating wire is embedded in the adhesive to partially cure the adhesive.
【００１５】[0015]
【発明の効果】本発明は以上説明したように、ＩＣチッ
プと液晶パネルの電極を接着剤シートを狭持して接合す
る回路の接続方法において、接着剤の一部をレーザー光
線等によって部分的に硬化する事によって、上記ＩＣチ
ップと液晶パネルを仮止めすることによって、簡易的に
液晶パネルの点灯検査をすることを可能にし、剥離再生
性を向上させる効果がある。As described above, according to the present invention, in a method of connecting a circuit in which an IC chip and electrodes of a liquid crystal panel are joined by sandwiching an adhesive sheet, a part of the adhesive is partially applied by a laser beam or the like. By curing, the IC chip and the liquid crystal panel are temporarily fixed, which makes it possible to easily perform a lighting inspection of the liquid crystal panel and improve peeling reproducibility.
【００１６】[0016]
【図１】 本発明の実施例において液晶パネルとＩＣチ
ップの間に接着剤シートを狭持した工程図。FIG. 1 is a process diagram in which an adhesive sheet is sandwiched between a liquid crystal panel and an IC chip in an embodiment of the present invention.
【図２】 本発明の実施例において液晶パネルの裏面よ
りレーザー光線を部分的に照射して接着剤を部分硬化せ
しめ、ＩＣを液晶パネルに仮止めしている工程図。FIG. 2 is a process drawing in which an IC is temporarily fixed to a liquid crystal panel by partially irradiating a laser beam from the back surface of the liquid crystal panel to partially cure the adhesive in the embodiment of the present invention.
【図３】 本発明の実施例においてＩＣの上面よりツー
ルにより加熱および加圧している様子を示す図。FIG. 3 is a diagram showing a state in which heating and pressurization are performed from the upper surface of an IC by a tool in the embodiment of the present invention.
【図４】 従来の実施例において、液晶パネルとＩＣチ
ップの間に接着剤シートを狭持した工程図。FIG. 4 is a process diagram in which an adhesive sheet is sandwiched between a liquid crystal panel and an IC chip in a conventional example.
【図５】 従来の実施例における、圧着ツールによる加
熱、加圧工程図。FIG. 5 is a process diagram of heating and pressurizing by a crimping tool in a conventional example.
１，２１ ＩＣチップ ２，２２ 液晶パネル ３，２３ 電極パターン ４ 接着剤 ５ レーザー光線 ６ Ａｕバンプ ２５ Ａｕバンプ ７ 仮固定ツール ８ 本圧着ツール ９ 接着剤中の部分硬化の部位 ２４ 接着剤 ２６ 圧着ツール 1, 21 IC Chip 2, 22 Liquid Crystal Panel 3, 23 Electrode Pattern 4 Adhesive 5 Laser Beam 6 Au Bump 25 Au Bump 7 Temporary Fixing Tool 8 Main Crimping Tool 9 Partial Curing Site in Adhesive 24 Adhesive 26 Crimping Tool
Claims (3)
縁性接着剤あるいは絶縁性接着剤中に導電性微粒子を分
散させた接着剤を狭持して接合する回路の接続方法にお
いて、上記接着剤を狭持しながら上記相対峙する接続用
回路を位置合わせする工程、一方の接続用回路から均一
な圧力が加えられながら接着剤の部分硬化によって所定
の接続用電極を初期的に導通接合せしめて仮止めする工
程、接着剤の完全硬化による本硬化の工程を有する事を
特徴とする回路の接続方法。1. A method of connecting a circuit in which an insulating adhesive or an adhesive in which conductive fine particles are dispersed in an insulating adhesive is sandwiched and bonded between connecting circuits formed by facing each other. , A step of aligning the connecting circuit which holds the adhesive while holding the adhesive, and a predetermined connecting electrode is initially formed by partial curing of the adhesive while uniform pressure is applied from one connecting circuit. A method of connecting a circuit, which comprises a step of conducting conductive joining and temporary fixing, and a step of main curing by complete curing of an adhesive.
線、可視光光線等の加熱光線をスポット状に照射する事
により、仮止めをする事を特徴とする請求項１記載の回
路の接続方法。2. The circuit connecting method according to claim 1, wherein, in the temporary fixing step, the temporary fixing is carried out by irradiating a heating beam such as a laser beam or a visible light beam in a spot shape.
スポット状に埋め込む事により、スポット状に加熱をし
仮止めをする事を特徴とする請求項１記載の回路の接続
方法。3. The circuit connecting method according to claim 1, wherein, in the step of temporarily fixing, the resistance heating wire is embedded in a spot shape so that the resistance heating wire is heated in a spot shape and temporarily fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5469791A JP3055193B2 (en) | 1991-03-19 | 1991-03-19 | Circuit connection method and liquid crystal device manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5469791A JP3055193B2 (en) | 1991-03-19 | 1991-03-19 | Circuit connection method and liquid crystal device manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05235094A true JPH05235094A (en) | 1993-09-10 |
| JP3055193B2 JP3055193B2 (en) | 2000-06-26 |
Family
ID=12977999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5469791A Expired - Fee Related JP3055193B2 (en) | 1991-03-19 | 1991-03-19 | Circuit connection method and liquid crystal device manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3055193B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996036992A1 (en) * | 1995-05-18 | 1996-11-21 | Hitachi, Ltd. | Semiconductor device and its manufacture |
| WO1998047175A1 (en) * | 1997-04-11 | 1998-10-22 | Kabushiki Kaisha Toshiba | Process for manufacturing semiconductor device and semiconductor component |
| US20140138011A1 (en) * | 2012-11-16 | 2014-05-22 | Apple Inc. | Methods for Assembling Devices Using Pressure Indicator Adhesives |
| CN111132459A (en) * | 2018-10-31 | 2020-05-08 | 台湾爱司帝科技股份有限公司 | Method and device for fixedly connecting light-emitting diode chip |
-
1991
- 1991-03-19 JP JP5469791A patent/JP3055193B2/en not_active Expired - Fee Related
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6162701A (en) * | 1995-05-18 | 2000-12-19 | Hitachi, Ltd. | Semiconductor device and method for making same |
| US6514796B2 (en) | 1995-05-18 | 2003-02-04 | Hitachi, Ltd. | Method for mounting a thin semiconductor device |
| US6589818B2 (en) | 1995-05-18 | 2003-07-08 | Hitachi. Ltd. | Method for mounting a thin semiconductor device |
| US5893746A (en) * | 1995-05-18 | 1999-04-13 | Hitachi, Ltd. | Semiconductor device and method for making same |
| EP0828292A4 (en) * | 1995-05-18 | 2000-01-05 | Hitachi Ltd | Semiconductor device and its manufacture |
| AU718934B2 (en) * | 1995-05-18 | 2000-05-04 | Hitachi Limited | Semiconductor device and method for making same |
| EP0828292A1 (en) * | 1995-05-18 | 1998-03-11 | Hitachi, Ltd. | Semiconductor device and its manufacture |
| WO1996036992A1 (en) * | 1995-05-18 | 1996-11-21 | Hitachi, Ltd. | Semiconductor device and its manufacture |
| US6245582B1 (en) | 1997-04-11 | 2001-06-12 | Kabushiki Kaisha Toshiba | Process for manufacturing semiconductor device and semiconductor component |
| CN1108635C (en) * | 1997-04-11 | 2003-05-14 | 株式会社东芝 | Process for manufacturing semiconductor device and semiconductor component |
| WO1998047175A1 (en) * | 1997-04-11 | 1998-10-22 | Kabushiki Kaisha Toshiba | Process for manufacturing semiconductor device and semiconductor component |
| US20140138011A1 (en) * | 2012-11-16 | 2014-05-22 | Apple Inc. | Methods for Assembling Devices Using Pressure Indicator Adhesives |
| US9335187B2 (en) * | 2012-11-16 | 2016-05-10 | Apple Inc. | Methods for assembling devices using pressure indicator adhesives |
| CN111132459A (en) * | 2018-10-31 | 2020-05-08 | 台湾爱司帝科技股份有限公司 | Method and device for fixedly connecting light-emitting diode chip |
| CN111132459B (en) * | 2018-10-31 | 2021-08-03 | 台湾爱司帝科技股份有限公司 | Method and device for fixedly connecting light-emitting diode chip |
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| Publication number | Publication date |
|---|---|
| JP3055193B2 (en) | 2000-06-26 |
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