JP3055193B2 - Circuit connection method and liquid crystal device manufacturing method - Google Patents
Circuit connection method and liquid crystal device manufacturing methodInfo
- Publication number
- JP3055193B2 JP3055193B2 JP5469791A JP5469791A JP3055193B2 JP 3055193 B2 JP3055193 B2 JP 3055193B2 JP 5469791 A JP5469791 A JP 5469791A JP 5469791 A JP5469791 A JP 5469791A JP 3055193 B2 JP3055193 B2 JP 3055193B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- adhesive
- substrate
- liquid crystal
- crystal panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、回路基板の実装方法に
関する。詳しくは、ポケットテレビ、壁掛けテレビ、プ
ロジェクションテレビ、ラップトップパソコンゲーム機
その他用途に用いられる液晶装置の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting a circuit board. More specifically, the present invention relates to a method of manufacturing a liquid crystal device used for a pocket television, a wall-mounted television, a projection television, a laptop computer game machine, and other uses.
【０００２】[0002]
【従来の技術】従来よりポケットテレビなど液晶パネル
を組み込むためには小型、高密度実装の液晶パネルを構
成する必要がある。その対策の一例として液晶パネルを
構成しているガラス基板上にＩＣチップを直接搭載する
方法が提案されている。2. Description of the Related Art Conventionally, in order to incorporate a liquid crystal panel such as a pocket television, it is necessary to construct a liquid crystal panel having a small size and a high density mounting. As an example of the countermeasure, a method of directly mounting an IC chip on a glass substrate constituting a liquid crystal panel has been proposed.
【０００３】以下図面を参照しながら、従来の液晶パネ
ルについて説明する。図４、５は従来の液晶パネルの一
例を示すものである。図４は相対峙して形成された接続
用回路すなわちＩＣチップと液晶パネルガラスの電極パ
ターンの間に絶縁性接着剤あるいは絶縁性接着剤中に導
電性微粒子を分散させた接着剤を狭持して上記相対峙す
る接続用回路を位置合わせする工程、図５はＩＣチップ
の上から高温のツールによって加圧されながら加熱さ
れ、上記接着剤を加熱硬化してＩＣチップと液晶パネル
ガラスの電極パターンを本圧着接合した様子を示す。Hereinafter, a conventional liquid crystal panel will be described with reference to the drawings. 4 and 5 show an example of a conventional liquid crystal panel. FIG. 4 shows an insulating adhesive or an adhesive obtained by dispersing conductive fine particles in an insulating adhesive between an IC chip and an electrode pattern of a liquid crystal panel glass which are formed facing each other. FIG. 5 shows a process of aligning the facing connection circuits with each other. FIG. 5 shows a process in which the IC chip is heated while being pressed by a high-temperature tool from above the IC chip, and the adhesive is heated and cured to form an electrode pattern between the IC chip and the liquid crystal panel glass. This shows a state in which the pressure bonding is performed.
【０００４】図４、５において２１はＩＣチップ、２２
は液晶パネル、２３は液晶パネルの基板上に形成された
電極パターン、２４は導電性微粒子を絶縁性接着剤中に
分散させた接着剤層、２５はＡｕバンプ、２６は圧着ツ
ールを示す。ＩＣチップ上には電極パッドが形成されて
いる。その電極パッド上にはＡｕバンプが形成されてい
る。液晶パネルの基板上には上記ＩＣチップの接続電極
と相対峙して接続用回路が形成されている。4 and 5, reference numeral 21 denotes an IC chip;
Denotes a liquid crystal panel, 23 denotes an electrode pattern formed on a substrate of the liquid crystal panel, 24 denotes an adhesive layer in which conductive fine particles are dispersed in an insulating adhesive, 25 denotes an Au bump, and 26 denotes a crimping tool. Electrode pads are formed on the IC chip. Au bumps are formed on the electrode pads. A connection circuit is formed on the substrate of the liquid crystal panel so as to face the connection electrodes of the IC chip.
【０００５】[0005]
【発明が解決しようとする課題】図４において、絶縁性
接着剤あるいは絶縁性接着剤中に導電性微粒子を分散さ
せた接着剤は相対峙して形成された接続用回路すなわち
ＩＣチップと液晶パネルガラスの電極パターンの間に加
熱や加圧無しに狭持される、この時相対峙して形成され
た接続用回路すなわちＩＣチップと液晶パネルガラスの
電極パターンは純粋に位置合わせされる。その後、図５
においてＩＣチップの上から高温のツールによって加圧
されながら加熱され、上記接着剤を加熱硬化してＩＣチ
ップと液晶パネルガラスの電極パターンは導通接続され
る。この時、一般的に用いられる接着剤としてのエポキ
シ系の接着剤は完全硬化する。In FIG. 4, an insulating adhesive or an adhesive in which conductive fine particles are dispersed in an insulating adhesive is used to form a connection circuit, ie, an IC chip and a liquid crystal panel, which are formed facing each other. The connection circuit, ie, the IC chip and the electrode pattern of the liquid crystal panel glass, which are sandwiched between the electrode patterns of the glass without heating or pressurization at this time, face each other, are purely aligned. Then, FIG.
In the above, the IC chip is heated while being pressed by a high-temperature tool from above the IC chip, and the adhesive is heated and hardened to electrically connect the IC chip and the electrode pattern of the liquid crystal panel glass. At this time, the epoxy adhesive, which is generally used, is completely cured.
【０００６】しかし、従来の回路の接続用接着剤を用い
た接続構造体は図４、５より明らかなように幾多の問題
点を有するものであった。However, the conventional connection structure using a connection adhesive for a circuit has a number of problems as apparent from FIGS.
【０００７】まず、従来の回路の接続用接着剤を用いた
接続構造体は、半導体チップ２１を回路基板に接合した
のち、特性検査をし、これが不良であったと判定された
場合、一旦熱硬化性接着剤が完全硬化した後の剥離再生
は極めて作業困難なものとなる。すなわちエポキシのよ
うな熱硬化性接着剤は硬く接着強度が大きいため機械的
に剥るのが難しいばかりではなく、無理矢理に剥ったと
してもはぎ取ったＩＣチップはほとんど破壊されてしま
い、きわめてもったいないものとなってしまうものであ
った。しかも、無理矢理にはぎ取った後の回路基板側の
残査もきわめて強固なものであり、アルコールやアセト
ンの様な溶剤でもとりずらく無理して取ろうとすると、
回路基板の基材をも壊しかねないものであった。このよ
うに不良発生時の剥離再生作業がやりずらいばかりでは
なく、再生しようとした部品をも破壊しかねないもので
あった。回路基板が液晶パネルの場合、特に部品が破壊
した場合の損失は大きくなってしまうものであった。First, in a conventional connection structure using a circuit connection adhesive, a semiconductor chip 21 is bonded to a circuit board, and then a characteristic test is performed. The peeling and regeneration after the adhesive is completely cured becomes extremely difficult. In other words, thermosetting adhesives such as epoxy are hard and difficult to peel off mechanically due to their high adhesive strength. In addition, even if they are forcibly peeled, the peeled IC chip is almost destroyed, which is extremely wasteful. It was something that would be. In addition, the residue on the circuit board after being forcibly removed is also very strong, and if you try to remove it with a solvent such as alcohol or acetone,
The substrate of the circuit board could be broken. As described above, the peeling and regenerating work at the time of occurrence of a defect is not only troublesome, but also may destroy the part to be regenerated. When the circuit board is a liquid crystal panel, the loss particularly when components are destroyed increases.
【０００８】さらに、剥離再生を容易なものにするため
に、接着剤として熱可塑性接着剤を用いることもできな
いではないが、この場合、接合の信頼性はかなり損なわ
れてしまう。Further, it is not impossible to use a thermoplastic adhesive as an adhesive in order to facilitate peeling and regeneration, but in this case, the reliability of bonding is considerably impaired.
【０００９】そこで、本発明は従来のこのような欠点を
解決し相対峙して形成された接続回路の接続の不良時の
剥離再生作業を容易にし、剥離再生によって部品が壊れ
てしまう確率を低減し、しかも接合の信頼性を高くする
ものである。Therefore, the present invention solves the above-mentioned drawbacks of the prior art and facilitates the peeling and regenerating operation when the connection of the confronting connection circuits is defective, and reduces the probability of breakage of parts due to the peeling and regenerating. In addition, the reliability of the bonding is enhanced.
【００１０】[0010]
【課題を解決するための手段】本発明の回路の接続方法
は、電極パターンを有する基板と、電極端子を有するＩ
Ｃチップとを接着剤を介在させて接続する回路の接続方
法であって、前記電極端子は、前記ＩＣチップが前記基
板と対向する面に設けられ、前記基板と前記ＩＣチップ
との間に前記接着剤を挟み、前記電極端子よりも前記対
向する面の中心側にある前記接着剤の一部に、前記基板
の裏面からスポット的に光を照射することによって、前
記基板に前記ＩＣチップを仮止めする工程と、前記ＩＣ
チップを前記基板に本圧着する工程と、を有することを
特徴とする。また、本発明の液晶装置の製造方法は、電
極パターンが形成された液晶パネルを構成する基板と、
電極端子を有するＩＣチップと、を接着剤を介して接続
する工程を具備する液晶装置の製造方法であって、前記
電極端子は、前記ＩＣチップが前記基板と対向する面に
設けられ、前記基板と前記ＩＣチップとの間に前記接着
剤を挟み、前記電極端子よりも前記対向する面の中心側
にある前記接着剤の一部に、前記基板の裏面からスポッ
ト的に光を照射することによって、前記基板に前記ＩＣ
チップを仮止めする工程と、前記ＩＣチップを前記基板
に本圧着する工程と、を具備することを特徴とする。ま
た、仮止めの工程の後で本圧着の工程の前に、液晶装置
の点灯検査を行うことが好ましい。前記接着剤として
は、絶縁性樹脂中に導電性微粒子を分散させた接着剤を
用いることができる。SUMMARY OF THE INVENTION A circuit connecting method according to the present invention comprises a substrate having an electrode pattern and an I-type terminal having an electrode terminal.
A method of connecting a circuit for connecting a C chip with an adhesive therebetween, wherein the electrode terminal is provided on a surface of the IC chip facing the substrate, and the electrode terminal is provided between the substrate and the IC chip. The IC chip is temporarily attached to the substrate by irradiating spot light from the back surface of the substrate to a part of the adhesive located on the center side of the facing surface with respect to the electrode terminal with an adhesive therebetween. Stopping, and the IC
And a step of fully pressing the chip to the substrate. Further, the method for manufacturing a liquid crystal device according to the present invention includes a substrate forming a liquid crystal panel on which an electrode pattern is formed,
A method for manufacturing a liquid crystal device, comprising: a step of connecting an IC chip having electrode terminals with an adhesive via an adhesive, wherein the electrode terminals are provided on a surface of the IC chip facing the substrate; By interposing the adhesive between the IC chip and the IC chip, and irradiating a spot-like light from the back surface of the substrate to a part of the adhesive located on the center side of the facing surface with respect to the electrode terminals. The IC on the substrate
A step of temporarily fixing the chip; and a step of permanently bonding the IC chip to the substrate. Further, it is preferable to perform a lighting inspection of the liquid crystal device after the temporary fixing process and before the final pressure bonding process. As the adhesive, an adhesive in which conductive fine particles are dispersed in an insulating resin can be used.
【００１１】[0011]
【実施例】図１〜図３は本発明による回路の接続工程を
示す。図１は相対峙して形成された接続用回路すなわち
ＩＣチップと液晶パネルガラスの電極パターンの間に絶
縁性接着剤あるいは絶縁性接着剤中に導電性微粒子を分
散させた接着剤を狭持して上記相対峙する接続用回路を
位置合わせする工程を示し、また図２はＩＣの上から圧
力が加えられながら上記狭持された接着剤に対し、液晶
パネルのガラスの裏面より部分的にレーザー光線を照射
しスポット的に上記接着剤を硬化し、初期的にＩＣの接
続用回路たる電極パッド上に形成されたＡｕバンプが相
対峙する液晶パネルガラスの電極パターンに充分押しつ
けられ、導通接続が図られている。また図２の状態で液
晶パネルは基本的に点灯表示できる。しかし、上記のよ
うにスポット的な硬化のため長期信頼性はもちろん無
い。図３は図２にて加圧および部分加熱の状態のものを
ＩＣ上部より高温のツールによって加圧されながら加熱
され、上記接着剤を加熱硬化してＩＣチップと液晶パネ
ルガラスの電極パターンを本圧着接合した様子を示す。
この時接着剤たる例えばエポキシ系接着剤は完全に硬化
している。図１に於て、１はＩＣチップ、２は液晶パネ
ル、３は液晶パネルの基板上に形成された電極パター
ン、４は接着剤、５はレーザー光、６はＡｕバンプ、７
は仮固定用ツール、８は本圧着ツール、９は接着剤中に
おいて部分硬化した部位を示す。1 to 3 show a connection process of a circuit according to the present invention. FIG. 1 shows an insulating adhesive or an adhesive obtained by dispersing conductive fine particles in an insulating adhesive between an IC chip and an electrode pattern of a liquid crystal panel glass sandwiched between connection circuits formed opposite to each other. FIG. 2 shows a process of aligning the connection circuit facing each other, and FIG. 2 shows a laser beam partially applied from the back surface of the liquid crystal panel glass to the held adhesive while applying pressure from above the IC. To cure the adhesive in a spot-like manner, and the Au bumps formed on the electrode pads, which are the connection circuits for the IC, are sufficiently pressed against the electrode patterns of the liquid crystal panel glass facing each other at the initial stage, and the conductive connection is achieved. Have been. In addition, in the state shown in FIG. 2, the liquid crystal panel can basically be lit and displayed. However, there is no long-term reliability due to the spot-like curing as described above. FIG. 3 shows the state of the pressure and partial heating in FIG. 2 which is heated while being pressed by a tool having a high temperature from the upper part of the IC, and the adhesive is heated and cured to form an electrode pattern of the IC chip and the liquid crystal panel glass. This shows a state in which pressure bonding is performed.
At this time, the adhesive, for example, the epoxy adhesive is completely cured. In FIG. 1, 1 is an IC chip, 2 is a liquid crystal panel, 3 is an electrode pattern formed on a substrate of the liquid crystal panel, 4 is an adhesive, 5 is a laser beam, 6 is an Au bump, 7 is an Au bump.
Denotes a temporary fixing tool, 8 denotes a final pressure bonding tool, and 9 denotes a partially cured portion in the adhesive.
【００１２】図１より明らかなように、本発明による回
路の接続方法は、図２に示すように、レーザー光線を接
着剤の一部分に照射してスポット的に硬化させるため、
長期信頼性は無いが確実にＩＣのバンプは液晶パネルガ
ラスの電極に押しつけられて初期的な電気的導通が図ら
れているため、初期的に液晶パネルを点灯表示すること
ができ、この状態で液晶パネルの点灯検査をすることが
できる。もしこの状態で不良が発見されれば、比較的容
易に液晶パネルもＩＣも破壊せずに剥離再生することが
できる。すなわち、接合がごく小さい点で成り立ってい
るため、剥離再生するときも、この小さい点を破断すれ
ばよい。その結果良品のみを後工程に送ることが出来る
ため、製造効率が向上し製造コストを低減することがで
きるものである。点灯検査の結果良品であれば、この時
点ですでにＩＣチップの電極パッドと液晶パネルガラス
の接続用回路は位置合わせが済んでいるため、そのま
ま、本圧着工程にまわすことができる。この時、わずら
わしい位置合わせ工程は不要であり、ほとんどラフな位
置決めで圧着すればよい。As can be seen from FIG. 1, the circuit connecting method according to the present invention, as shown in FIG.
Although there is no long-term reliability, the bumps of the IC are reliably pressed against the electrodes of the liquid crystal panel glass to achieve initial electrical continuity, so that the liquid crystal panel can be initially lit and displayed. The lighting inspection of the liquid crystal panel can be performed. If a defect is found in this state, peeling and regenerating can be performed relatively easily without breaking the liquid crystal panel or the IC. That is, since the bonding is made up of very small points, it is only necessary to break these small points when peeling and regenerating. As a result, only non-defective products can be sent to the post-process, so that manufacturing efficiency can be improved and manufacturing costs can be reduced. If the lighting inspection results in a good product, the connection circuit between the electrode pad of the IC chip and the liquid crystal panel glass has already been aligned at this point, so that it can be directly transferred to the final pressure bonding step. At this time, a troublesome positioning step is not required, and the crimping may be performed with almost rough positioning.
【００１３】さらに、本発明による回路の接続方法は、
上記の点灯表示を比較的容易に行なうことが出来る。す
なわち、液晶パネルの駆動用ＩＣは出力パッド数はきわ
めて多いが、入力信号のパッド数は少ない。従って、入
力信号より引き出された液晶パネルガラス上の電極パタ
ーンは広いピッチでガラスの縁部に配されており、機械
的な針を用いた探針は比較的容易である。そのため、点
灯表示検査そのものが容易であり、点灯検査用の機械も
安価で済むものである。Further, the method for connecting circuits according to the present invention comprises:
The above lighting display can be performed relatively easily. That is, the driving IC for the liquid crystal panel has a very large number of output pads, but a small number of input signal pads. Therefore, the electrode patterns on the liquid crystal panel glass extracted from the input signal are arranged at a wide pitch on the edge of the glass, and it is relatively easy to use a mechanical probe for probe. Therefore, the lighting display inspection itself is easy, and the machine for the lighting inspection can be inexpensive.
【００１４】また、本発明による効果は以上説明したよ
うなレーザー光線を用いた場合ばかりでなく、キセノン
ランプ等の可視光をレンズで集光して使う場合も同じで
あり、また、この様な光線を用いて加熱する場合のみで
なく、小さな抵抗加熱線を接着剤中に埋め込ませて接着
剤を部分的に硬化する場合も同じである。The effect of the present invention is the same not only when the laser beam as described above is used but also when the visible light of a xenon lamp or the like is condensed by a lens and used. The same is true not only when heating is performed by using the method described above, but also when a small resistance heating wire is embedded in the adhesive to partially cure the adhesive.
【００１５】[0015]
【発明の効果】本発明の回路の接続方法によれば、接着
剤に光を照射することによって基板とＩＣチップとを接
着する。この接着めは、本圧着に比べて接着力が小さい
ため、仮にＩＣチップと電極パターンとが接続不良を起
こしていても、容易にＩＣチップを基板から剥離するこ
とができる。そのため、ＩＣチップの再利用が可能とな
る。また、本発明の液晶装置の製造方法によれば、接着
の後点灯検査を行うため、点灯検査で良品となったもの
についてのみ本圧着を行い、不良となったものについて
は基板からＩＣを剥離し再利用するため、その製造工程
中においてＩＣチップを無駄にすることがなくなる。According to the circuit connection method of the present invention, the substrate and the IC chip are bonded by irradiating the adhesive with light. Since this bonding method has a smaller adhesive force than the final pressure bonding, the IC chip can be easily peeled from the substrate even if the IC chip and the electrode pattern have a poor connection. Therefore, the IC chip can be reused. According to the method of manufacturing a liquid crystal device of the present invention, a lighting test is performed after bonding, so that only a non-defective product is subjected to main pressure bonding, and a defective device is peeled from the substrate. Therefore, the IC chip is not wasted during the manufacturing process.
【００１６】[0016]
【図１】 本発明の実施例において液晶パネルとＩＣチ
ップの間に接着剤シートを狭持した工程図。FIG. 1 is a process diagram in which an adhesive sheet is sandwiched between a liquid crystal panel and an IC chip in an embodiment of the present invention.
【図２】 本発明の実施例において液晶パネルの裏面よ
りレーザー光線を部分的に照射して接着剤を部分硬化せ
しめ、ＩＣを液晶パネルに仮止めしている工程図。FIG. 2 is a process diagram of temporarily irradiating a laser beam from a back surface of a liquid crystal panel to partially cure an adhesive and temporarily fixing an IC to the liquid crystal panel in the embodiment of the present invention.
【図３】 本発明の実施例においてＩＣの上面よりツー
ルにより加熱および加圧している様子を示す図。FIG. 3 is a diagram showing a state in which heating and pressing are performed by a tool from above the IC in the embodiment of the present invention.
【図４】 従来の実施例において、液晶パネルとＩＣチ
ップの間に接着剤シートを狭持した工程図。FIG. 4 is a process diagram in which an adhesive sheet is sandwiched between a liquid crystal panel and an IC chip in a conventional example.
【図５】 従来の実施例における、圧着ツールによる加
熱、加圧工程図。FIG. 5 is a drawing showing a heating and pressing process using a crimping tool in a conventional example.
１，２１ ＩＣチップ ２，２２ 液晶パネル ３，２３ 電極パターン ４ 接着剤 ５ レーザー光線 ６ Ａｕバンプ ２５ Ａｕバンプ ７ 仮固定ツール ８ 本圧着ツール ９ 接着剤中の部分硬化の部位 ２４ 接着剤 ２６ 圧着ツール 1, 21 IC chip 2, 22 Liquid crystal panel 3, 23 Electrode pattern 4 Adhesive 5 Laser beam 6 Au bump 25 Au bump 7 Temporary fixing tool 8 Final pressure bonding tool 9 Partially cured part in adhesive 24 Adhesive 26 Pressure bonding tool
Claims (4)
有するＩＣチップと、を接着剤を介在させて接続する回
路の接続方法であって、 前記電極端子は、前記ＩＣチップが前記基板と対向する
面に設けられ、 前記基板と前記ＩＣチップとの間に前記接着剤を挟み、
前記電極端子よりも前記対向する面の中心側にある前記
接着剤の一部に、前記基板の裏面からスポット的に光を
照射することによって、前記基板に前記ＩＣチップを仮
止めする工程と、 前記ＩＣチップを前記基板に本圧着する工程と、を有す
ることを特徴とする回路の接続方法。1. A circuit connection method for connecting a substrate having an electrode pattern and an IC chip having electrode terminals with an adhesive interposed therebetween, wherein the electrode terminals are arranged such that the IC chip faces the substrate. The adhesive is interposed between the substrate and the IC chip,
A step of temporarily fixing the IC chip to the substrate by irradiating a portion of the adhesive on the center side of the opposing surface with respect to the electrode terminal from a back surface of the substrate in a spot-like manner; And a step of permanently bonding the IC chip to the substrate.
する基板と、電極端子を有するＩＣチップと、を接着剤
を介して接続する工程を具備する液晶装置の製造方法で
あって、 前記電極端子は、前記ＩＣチップが前記基板と対向する
面に設けられ、 前記基板と前記ＩＣチップとの間に前記接着剤を挟み、
前記電極端子よりも前記対向する面の中心側にある前記
接着剤の一部に、前記基板の裏面からスポット的に光を
照射することによって、前記基板に前記ＩＣチップを仮
止めする工程と、 前記ＩＣチップを前記基板に本圧着する工程と、を具備
することを特徴とする液晶装置の製造方法。2. A method for manufacturing a liquid crystal device, comprising a step of connecting an IC chip having electrode terminals to a substrate forming a liquid crystal panel on which an electrode pattern is formed, via an adhesive. The IC chip is provided on a surface facing the substrate, the adhesive is interposed between the substrate and the IC chip,
A step of temporarily fixing the IC chip to the substrate by irradiating a portion of the adhesive on the center side of the opposing surface with respect to the electrode terminal from a back surface of the substrate in a spot-like manner; And a step of permanently bonding the IC chip to the substrate.
て、前記接着剤が、絶縁性樹脂中に導電性微粒子を分散
させた接着剤であることを特徴とする回路の接続方法。3. The circuit connection method according to claim 1, wherein the adhesive is an adhesive in which conductive fine particles are dispersed in an insulating resin.
って、 前記仮止めする工程の後で、前記本圧着する工程の前
に、 前記基板に前記ＩＣチップが仮止めされた状態で点灯検
査を行う工程を具備することを特徴とする液晶装置の製
造方法。4. The method for manufacturing a liquid crystal device according to claim 2, wherein the IC chip is temporarily fixed to the substrate after the step of temporarily fixing and before the step of final pressure bonding. A method for manufacturing a liquid crystal device, comprising a step of performing a lighting inspection in step (a).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5469791A JP3055193B2 (en) | 1991-03-19 | 1991-03-19 | Circuit connection method and liquid crystal device manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5469791A JP3055193B2 (en) | 1991-03-19 | 1991-03-19 | Circuit connection method and liquid crystal device manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05235094A JPH05235094A (en) | 1993-09-10 |
| JP3055193B2 true JP3055193B2 (en) | 2000-06-26 |
Family
ID=12977999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5469791A Expired - Fee Related JP3055193B2 (en) | 1991-03-19 | 1991-03-19 | Circuit connection method and liquid crystal device manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3055193B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3197788B2 (en) * | 1995-05-18 | 2001-08-13 | 株式会社日立製作所 | Method for manufacturing semiconductor device |
| JPH10284535A (en) * | 1997-04-11 | 1998-10-23 | Toshiba Corp | Method for producing semiconductor device and semiconductor component |
| US9335187B2 (en) * | 2012-11-16 | 2016-05-10 | Apple Inc. | Methods for assembling devices using pressure indicator adhesives |
| CN111132459B (en) * | 2018-10-31 | 2021-08-03 | 台湾爱司帝科技股份有限公司 | Method and device for fixedly connecting light-emitting diode chip |
-
1991
- 1991-03-19 JP JP5469791A patent/JP3055193B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05235094A (en) | 1993-09-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3055193B2 (en) | Circuit connection method and liquid crystal device manufacturing method | |
| JP3036249B2 (en) | Chip mounting structure and test method | |
| JPH0121620B2 (en) | ||
| US6369450B1 (en) | Method of producing mounting structure and mounting structure produced by the same | |
| JPS63151033A (en) | Manufacture of semiconductor device | |
| JP3509642B2 (en) | Semiconductor device mounting method and mounting structure | |
| JP3041980B2 (en) | Liquid crystal panel and method of manufacturing liquid crystal panel | |
| JP2961825B2 (en) | Liquid crystal device manufacturing method | |
| JP3319269B2 (en) | Electronic component joining method | |
| JP2000100873A (en) | Bare chip mounting method | |
| JP3112470B2 (en) | Connection structure of electric element and liquid crystal panel | |
| JPH04291323A (en) | Connecting method for circuit | |
| JPH10107072A (en) | Structure and method for connecting semiconductor element | |
| JP2959215B2 (en) | Electronic component and its mounting method | |
| JPH0992651A (en) | Semiconductor element and connection method | |
| JP2000323348A (en) | Method for mounting electronic parts | |
| JP3284890B2 (en) | Bonding method of work with bump | |
| JPH04117477A (en) | Anisotropic conductive material and method for connecting integrated circuit element using the same | |
| JPH11251373A (en) | Tape carrier package | |
| JPH11135561A (en) | Anisotropic conductive adhesive film, its manufacture, flip-chip mounting method, and flip-chip packaging board | |
| JPS6348157B2 (en) | ||
| JPH0897256A (en) | Method of mounting electronic part | |
| JP3265316B2 (en) | Semiconductor device and manufacturing method thereof | |
| JP3316472B2 (en) | Method of connecting electric element and method of manufacturing liquid crystal panel | |
| JP2000021936A (en) | Method for exchanging semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080414 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090414 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090414 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 10 Free format text: PAYMENT UNTIL: 20100414 |
|
| LAPS | Cancellation because of no payment of annual fees |