JPH0521879Y2 - - Google Patents

Info

Publication number
JPH0521879Y2
JPH0521879Y2 JP1987165373U JP16537387U JPH0521879Y2 JP H0521879 Y2 JPH0521879 Y2 JP H0521879Y2 JP 1987165373 U JP1987165373 U JP 1987165373U JP 16537387 U JP16537387 U JP 16537387U JP H0521879 Y2 JPH0521879 Y2 JP H0521879Y2
Authority
JP
Japan
Prior art keywords
wire
bonding
tension
feeding
amount control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987165373U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0171444U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987165373U priority Critical patent/JPH0521879Y2/ja
Publication of JPH0171444U publication Critical patent/JPH0171444U/ja
Application granted granted Critical
Publication of JPH0521879Y2 publication Critical patent/JPH0521879Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member

Landscapes

  • Wire Bonding (AREA)
JP1987165373U 1987-10-30 1987-10-30 Expired - Lifetime JPH0521879Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987165373U JPH0521879Y2 (enExample) 1987-10-30 1987-10-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987165373U JPH0521879Y2 (enExample) 1987-10-30 1987-10-30

Publications (2)

Publication Number Publication Date
JPH0171444U JPH0171444U (enExample) 1989-05-12
JPH0521879Y2 true JPH0521879Y2 (enExample) 1993-06-04

Family

ID=31451802

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987165373U Expired - Lifetime JPH0521879Y2 (enExample) 1987-10-30 1987-10-30

Country Status (1)

Country Link
JP (1) JPH0521879Y2 (enExample)

Also Published As

Publication number Publication date
JPH0171444U (enExample) 1989-05-12

Similar Documents

Publication Publication Date Title
US4928871A (en) Apparatus and method of controlled feed of a bonding wire to the "wedge" of a bonding head
US7407079B2 (en) Automated filament attachment system for vacuum fluorescent display
JPH0521879Y2 (enExample)
CN101522356B (zh) 适于向焊线施加可变张力的焊线机送线系统及其操作方法
JPH0622986Y2 (ja) ワイヤボンディング装置におけるワイヤ供給装置
JP4781788B2 (ja) ワイヤ送給装置
JPH09162224A (ja) 被覆ワイヤのワイヤボンディング方法
JPH0141025B2 (enExample)
JP2885242B1 (ja) ワイヤボンディング方法及び装置
JPH0287545A (ja) 半導体ウエハのテープ貼付け方法
KR100273237B1 (ko) 반도체패키지의와이어본딩공정용와이어공급장치
JPH0521504A (ja) ワイヤボンデイング装置におけるワイヤ供給方法
US20060065695A1 (en) Wire feed system for a wire bonding apparatus
JPS61229776A (ja) 細線の送給装置
JPH0611066B2 (ja) ワイヤボンデイング装置
JPH03263844A (ja) ワイヤボンダにおけるキャピラリへのワイヤの挿通方法
JPS59178000A (ja) 自動配線装置
JPH0110929Y2 (enExample)
JPH09320877A (ja) 線材供給装置
JPS62115733A (ja) ワイヤボンデイング装置
JPS6141231Y2 (enExample)
JP3439791B2 (ja) 巻線装置
JPH0231434A (ja) 半導体製造装置
JP2511263Y2 (ja) バンプ電極形成装置
JPH1059617A (ja) 粘弾性素材からなるワイヤーの送り装置