JPH0521879Y2 - - Google Patents
Info
- Publication number
- JPH0521879Y2 JPH0521879Y2 JP1987165373U JP16537387U JPH0521879Y2 JP H0521879 Y2 JPH0521879 Y2 JP H0521879Y2 JP 1987165373 U JP1987165373 U JP 1987165373U JP 16537387 U JP16537387 U JP 16537387U JP H0521879 Y2 JPH0521879 Y2 JP H0521879Y2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- bonding
- tension
- feeding
- amount control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W72/0711—
-
- H10W72/07141—
-
- H10W72/07168—
-
- H10W72/07502—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987165373U JPH0521879Y2 (enExample) | 1987-10-30 | 1987-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987165373U JPH0521879Y2 (enExample) | 1987-10-30 | 1987-10-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0171444U JPH0171444U (enExample) | 1989-05-12 |
| JPH0521879Y2 true JPH0521879Y2 (enExample) | 1993-06-04 |
Family
ID=31451802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987165373U Expired - Lifetime JPH0521879Y2 (enExample) | 1987-10-30 | 1987-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0521879Y2 (enExample) |
-
1987
- 1987-10-30 JP JP1987165373U patent/JPH0521879Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0171444U (enExample) | 1989-05-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4928871A (en) | Apparatus and method of controlled feed of a bonding wire to the "wedge" of a bonding head | |
| US7407079B2 (en) | Automated filament attachment system for vacuum fluorescent display | |
| JPH0521879Y2 (enExample) | ||
| JPH04320350A (ja) | ワイヤボンデイング方法及び装置 | |
| CN101522356B (zh) | 适于向焊线施加可变张力的焊线机送线系统及其操作方法 | |
| JPH0622986Y2 (ja) | ワイヤボンディング装置におけるワイヤ供給装置 | |
| JP4781788B2 (ja) | ワイヤ送給装置 | |
| JPH09162224A (ja) | 被覆ワイヤのワイヤボンディング方法 | |
| JPH01222421A (ja) | 巻線装置とその装置による巻線方法 | |
| JPH0141025B2 (enExample) | ||
| JPH0320900B2 (enExample) | ||
| JP2885242B1 (ja) | ワイヤボンディング方法及び装置 | |
| JPH0287545A (ja) | 半導体ウエハのテープ貼付け方法 | |
| KR100273237B1 (ko) | 반도체패키지의와이어본딩공정용와이어공급장치 | |
| JPH0521504A (ja) | ワイヤボンデイング装置におけるワイヤ供給方法 | |
| US20060065695A1 (en) | Wire feed system for a wire bonding apparatus | |
| JPS61229776A (ja) | 細線の送給装置 | |
| JPH0611066B2 (ja) | ワイヤボンデイング装置 | |
| JPH03263844A (ja) | ワイヤボンダにおけるキャピラリへのワイヤの挿通方法 | |
| JPS59178000A (ja) | 自動配線装置 | |
| JPH0110929Y2 (enExample) | ||
| JPS62115733A (ja) | ワイヤボンデイング装置 | |
| JPS6141231Y2 (enExample) | ||
| JP3439791B2 (ja) | 巻線装置 | |
| JPH0231434A (ja) | 半導体製造装置 |