JPH0521340B2 - - Google Patents
Info
- Publication number
- JPH0521340B2 JPH0521340B2 JP28038684A JP28038684A JPH0521340B2 JP H0521340 B2 JPH0521340 B2 JP H0521340B2 JP 28038684 A JP28038684 A JP 28038684A JP 28038684 A JP28038684 A JP 28038684A JP H0521340 B2 JPH0521340 B2 JP H0521340B2
- Authority
- JP
- Japan
- Prior art keywords
- heater plate
- thermocompression bonding
- silicone sheet
- workpiece
- crimping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920001296 polysiloxane Polymers 0.000 claims description 24
- 238000002788 crimping Methods 0.000 claims description 17
- 238000007906 compression Methods 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 10
- 239000011521 glass Substances 0.000 description 9
- 239000004973 liquid crystal related substance Substances 0.000 description 9
- 230000006866 deterioration Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28038684A JPS61158153A (ja) | 1984-12-28 | 1984-12-28 | 熱圧着装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28038684A JPS61158153A (ja) | 1984-12-28 | 1984-12-28 | 熱圧着装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61158153A JPS61158153A (ja) | 1986-07-17 |
| JPH0521340B2 true JPH0521340B2 (enrdf_load_stackoverflow) | 1993-03-24 |
Family
ID=17624297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28038684A Granted JPS61158153A (ja) | 1984-12-28 | 1984-12-28 | 熱圧着装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61158153A (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1032946A1 (en) | 1997-11-20 | 2000-09-06 | Matsushita Electric Industrial Co., Ltd. | Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components |
| JP3889700B2 (ja) | 2002-03-13 | 2007-03-07 | 三井金属鉱業株式会社 | Ｃｏｆフィルムキャリアテープの製造方法 |
| US7173322B2 (en) | 2002-03-13 | 2007-02-06 | Mitsui Mining & Smelting Co., Ltd. | COF flexible printed wiring board and method of producing the wiring board |
| JP2006142611A (ja) * | 2004-11-18 | 2006-06-08 | Nitto Denko Corp | 加熱圧着用複合シート及びその製造方法 |
| US7923846B2 (en) | 2007-11-16 | 2011-04-12 | Stats Chippac Ltd. | Integrated circuit package-in-package system with wire-in-film encapsulant |
| MY157233A (en) * | 2009-03-11 | 2016-05-13 | Shinetsu Chemical Co | Connection sheet for solar battery cell electrode, process for manufacturing solar cell module, and solar cell module |
-
1984
- 1984-12-28 JP JP28038684A patent/JPS61158153A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61158153A (ja) | 1986-07-17 |
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