JPH0521340B2 - - Google Patents
Info
- Publication number
- JPH0521340B2 JPH0521340B2 JP59280386A JP28038684A JPH0521340B2 JP H0521340 B2 JPH0521340 B2 JP H0521340B2 JP 59280386 A JP59280386 A JP 59280386A JP 28038684 A JP28038684 A JP 28038684A JP H0521340 B2 JPH0521340 B2 JP H0521340B2
- Authority
- JP
- Japan
- Prior art keywords
- heater plate
- thermocompression bonding
- silicone sheet
- workpiece
- crimping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W99/00—
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59280386A JPS61158153A (ja) | 1984-12-28 | 1984-12-28 | 熱圧着装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59280386A JPS61158153A (ja) | 1984-12-28 | 1984-12-28 | 熱圧着装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61158153A JPS61158153A (ja) | 1986-07-17 |
| JPH0521340B2 true JPH0521340B2 (cg-RX-API-DMAC10.html) | 1993-03-24 |
Family
ID=17624297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59280386A Granted JPS61158153A (ja) | 1984-12-28 | 1984-12-28 | 熱圧着装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61158153A (cg-RX-API-DMAC10.html) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999027564A1 (en) | 1997-11-20 | 1999-06-03 | Matsushita Electric Industrial Co., Ltd. | Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components |
| US7173322B2 (en) | 2002-03-13 | 2007-02-06 | Mitsui Mining & Smelting Co., Ltd. | COF flexible printed wiring board and method of producing the wiring board |
| JP3889700B2 (ja) | 2002-03-13 | 2007-03-07 | 三井金属鉱業株式会社 | Ｃｏｆフィルムキャリアテープの製造方法 |
| JP2006142611A (ja) * | 2004-11-18 | 2006-06-08 | Nitto Denko Corp | 加熱圧着用複合シート及びその製造方法 |
| US7923846B2 (en) | 2007-11-16 | 2011-04-12 | Stats Chippac Ltd. | Integrated circuit package-in-package system with wire-in-film encapsulant |
| WO2010103998A1 (ja) * | 2009-03-11 | 2010-09-16 | 信越化学工業株式会社 | 太陽電池セル電極の接続用シート、太陽電池モジュールの製造方法及び太陽電池モジュール |
-
1984
- 1984-12-28 JP JP59280386A patent/JPS61158153A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61158153A (ja) | 1986-07-17 |
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