JPH0521340B2 - - Google Patents

Info

Publication number
JPH0521340B2
JPH0521340B2 JP28038684A JP28038684A JPH0521340B2 JP H0521340 B2 JPH0521340 B2 JP H0521340B2 JP 28038684 A JP28038684 A JP 28038684A JP 28038684 A JP28038684 A JP 28038684A JP H0521340 B2 JPH0521340 B2 JP H0521340B2
Authority
JP
Japan
Prior art keywords
heater plate
thermocompression bonding
silicone sheet
workpiece
crimping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP28038684A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61158153A (ja
Inventor
Kenji Wada
Ikuo Ookawa
Tetsushi Sato
Tatsuo Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP28038684A priority Critical patent/JPS61158153A/ja
Publication of JPS61158153A publication Critical patent/JPS61158153A/ja
Publication of JPH0521340B2 publication Critical patent/JPH0521340B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP28038684A 1984-12-28 1984-12-28 熱圧着装置 Granted JPS61158153A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28038684A JPS61158153A (ja) 1984-12-28 1984-12-28 熱圧着装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28038684A JPS61158153A (ja) 1984-12-28 1984-12-28 熱圧着装置

Publications (2)

Publication Number Publication Date
JPS61158153A JPS61158153A (ja) 1986-07-17
JPH0521340B2 true JPH0521340B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-03-24

Family

ID=17624297

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28038684A Granted JPS61158153A (ja) 1984-12-28 1984-12-28 熱圧着装置

Country Status (1)

Country Link
JP (1) JPS61158153A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6544377B1 (en) 1997-11-20 2003-04-08 Matsushita Electric Industrial Co., Ltd. Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components
US7173322B2 (en) 2002-03-13 2007-02-06 Mitsui Mining & Smelting Co., Ltd. COF flexible printed wiring board and method of producing the wiring board
JP3889700B2 (ja) 2002-03-13 2007-03-07 三井金属鉱業株式会社 Ｃｏｆフィルムキャリアテープの製造方法
JP2006142611A (ja) * 2004-11-18 2006-06-08 Nitto Denko Corp 加熱圧着用複合シート及びその製造方法
US7923846B2 (en) 2007-11-16 2011-04-12 Stats Chippac Ltd. Integrated circuit package-in-package system with wire-in-film encapsulant
KR101594973B1 (ko) * 2009-03-11 2016-02-17 신에쓰 가가꾸 고교 가부시끼가이샤 태양전지 셀 전극의 접속용 시트, 태양전지 모듈의 제조 방법 및 태양전지 모듈

Also Published As

Publication number Publication date
JPS61158153A (ja) 1986-07-17

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