JPH0521316B2 - - Google Patents
Info
- Publication number
- JPH0521316B2 JPH0521316B2 JP59209123A JP20912384A JPH0521316B2 JP H0521316 B2 JPH0521316 B2 JP H0521316B2 JP 59209123 A JP59209123 A JP 59209123A JP 20912384 A JP20912384 A JP 20912384A JP H0521316 B2 JPH0521316 B2 JP H0521316B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- copper foil
- connector
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 239000011889 copper foil Substances 0.000 claims description 14
- 238000005476 soldering Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59209123A JPS6188471A (ja) | 1984-10-05 | 1984-10-05 | コネクタ− |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59209123A JPS6188471A (ja) | 1984-10-05 | 1984-10-05 | コネクタ− |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6188471A JPS6188471A (ja) | 1986-05-06 |
JPH0521316B2 true JPH0521316B2 (US20110009641A1-20110113-C00116.png) | 1993-03-24 |
Family
ID=16567664
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59209123A Granted JPS6188471A (ja) | 1984-10-05 | 1984-10-05 | コネクタ− |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6188471A (US20110009641A1-20110113-C00116.png) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4764848A (en) * | 1986-11-24 | 1988-08-16 | International Business Machines Corporation | Surface mounted array strain relief device |
JPS63167678U (US20110009641A1-20110113-C00116.png) * | 1987-04-22 | 1988-11-01 | ||
JPH04133362U (ja) * | 1991-06-03 | 1992-12-11 | 新電元工業株式会社 | 表面実装用端子台 |
JPH09171846A (ja) * | 1995-12-19 | 1997-06-30 | Nec Shizuoka Ltd | 表面実装タイプのピンヘッダーコネクタ |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5698853A (en) * | 1980-01-11 | 1981-08-08 | Hitachi Ltd | Structure of lead in semiconductor device |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5565789U (US20110009641A1-20110113-C00116.png) * | 1978-10-31 | 1980-05-07 |
-
1984
- 1984-10-05 JP JP59209123A patent/JPS6188471A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5698853A (en) * | 1980-01-11 | 1981-08-08 | Hitachi Ltd | Structure of lead in semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS6188471A (ja) | 1986-05-06 |
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