JPH0521266Y2 - - Google Patents
Info
- Publication number
- JPH0521266Y2 JPH0521266Y2 JP1988167984U JP16798488U JPH0521266Y2 JP H0521266 Y2 JPH0521266 Y2 JP H0521266Y2 JP 1988167984 U JP1988167984 U JP 1988167984U JP 16798488 U JP16798488 U JP 16798488U JP H0521266 Y2 JPH0521266 Y2 JP H0521266Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- connection
- conductor
- connecting conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 42
- 239000010949 copper Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988167984U JPH0521266Y2 (US07413550-20080819-C00001.png) | 1988-12-26 | 1988-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988167984U JPH0521266Y2 (US07413550-20080819-C00001.png) | 1988-12-26 | 1988-12-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0287382U JPH0287382U (US07413550-20080819-C00001.png) | 1990-07-11 |
| JPH0521266Y2 true JPH0521266Y2 (US07413550-20080819-C00001.png) | 1993-05-31 |
Family
ID=31456768
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988167984U Expired - Lifetime JPH0521266Y2 (US07413550-20080819-C00001.png) | 1988-12-26 | 1988-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0521266Y2 (US07413550-20080819-C00001.png) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4690578B2 (ja) * | 2001-04-27 | 2011-06-01 | 株式会社東芝 | 電子機器のグランドパターン接続金具及び基板取付構造 |
| US8519989B2 (en) | 2008-02-06 | 2013-08-27 | Panasonic Corporation | Plasma display device using a plurality of metal fittings for reducing impedance |
| US10175878B2 (en) | 2010-02-23 | 2019-01-08 | Kyocera Corporation | Electronic apparatus |
-
1988
- 1988-12-26 JP JP1988167984U patent/JPH0521266Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0287382U (US07413550-20080819-C00001.png) | 1990-07-11 |
