JPH0521157B2 - - Google Patents
Info
- Publication number
- JPH0521157B2 JPH0521157B2 JP60035775A JP3577585A JPH0521157B2 JP H0521157 B2 JPH0521157 B2 JP H0521157B2 JP 60035775 A JP60035775 A JP 60035775A JP 3577585 A JP3577585 A JP 3577585A JP H0521157 B2 JPH0521157 B2 JP H0521157B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive adhesive
- conductive powder
- resin
- powder
- anisotropic conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 claims description 26
- 230000001070 adhesive effect Effects 0.000 claims description 26
- 239000000843 powder Substances 0.000 claims description 25
- 230000001154 acute effect Effects 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229920005992 thermoplastic resin Polymers 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 14
- 229920003002 synthetic resin Polymers 0.000 description 8
- 239000000057 synthetic resin Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000002788 crimping Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 239000011163 secondary particle Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Combinations Of Printed Boards (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3577585A JPS61195178A (ja) | 1985-02-25 | 1985-02-25 | 異方導電性接着剤 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3577585A JPS61195178A (ja) | 1985-02-25 | 1985-02-25 | 異方導電性接着剤 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61195178A JPS61195178A (ja) | 1986-08-29 |
| JPH0521157B2 true JPH0521157B2 (ko) | 1993-03-23 |
Family
ID=12451257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3577585A Granted JPS61195178A (ja) | 1985-02-25 | 1985-02-25 | 異方導電性接着剤 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61195178A (ko) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61274394A (ja) * | 1985-05-29 | 1986-12-04 | シャープ株式会社 | 端子の接続方法 |
| JPH0623350B2 (ja) * | 1988-01-20 | 1994-03-30 | 信越ポリマー株式会社 | 異方導電性接着剤 |
| JPH0746752B2 (ja) * | 1991-06-27 | 1995-05-17 | 信越ポリマー株式会社 | 異方導電性接着剤 |
| JP2823799B2 (ja) * | 1994-07-29 | 1998-11-11 | 信越ポリマー株式会社 | 異方導電接着剤 |
| CA2244332C (en) * | 1997-07-30 | 2002-04-02 | Becton, Dickinson And Company | Bonding agent and method of bonding electrode to printed conductive trace |
| JP4485027B2 (ja) * | 2000-07-28 | 2010-06-16 | エーユー オプトロニクス コーポレイション | 液晶デバイス、液晶デバイスの製造装置、液晶デバイスの製造方法および配向膜形成方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60199062A (ja) * | 1984-03-22 | 1985-10-08 | Nippon Oil & Fats Co Ltd | 帯電防止性導電樹脂組成物 |
-
1985
- 1985-02-25 JP JP3577585A patent/JPS61195178A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60199062A (ja) * | 1984-03-22 | 1985-10-08 | Nippon Oil & Fats Co Ltd | 帯電防止性導電樹脂組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61195178A (ja) | 1986-08-29 |
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