JPH0520902B2 - - Google Patents

Info

Publication number
JPH0520902B2
JPH0520902B2 JP59068416A JP6841684A JPH0520902B2 JP H0520902 B2 JPH0520902 B2 JP H0520902B2 JP 59068416 A JP59068416 A JP 59068416A JP 6841684 A JP6841684 A JP 6841684A JP H0520902 B2 JPH0520902 B2 JP H0520902B2
Authority
JP
Japan
Prior art keywords
film
fuse
fuse medium
medium
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59068416A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60210850A (ja
Inventor
Yoichi Akasaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59068416A priority Critical patent/JPS60210850A/ja
Publication of JPS60210850A publication Critical patent/JPS60210850A/ja
Publication of JPH0520902B2 publication Critical patent/JPH0520902B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
    • H01L23/5258—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive the change of state resulting from the use of an external beam, e.g. laser beam or ion beam

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP59068416A 1984-04-04 1984-04-04 半導体集積回路装置の製造方法 Granted JPS60210850A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59068416A JPS60210850A (ja) 1984-04-04 1984-04-04 半導体集積回路装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59068416A JPS60210850A (ja) 1984-04-04 1984-04-04 半導体集積回路装置の製造方法

Publications (2)

Publication Number Publication Date
JPS60210850A JPS60210850A (ja) 1985-10-23
JPH0520902B2 true JPH0520902B2 (enrdf_load_stackoverflow) 1993-03-22

Family

ID=13373052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59068416A Granted JPS60210850A (ja) 1984-04-04 1984-04-04 半導体集積回路装置の製造方法

Country Status (1)

Country Link
JP (1) JPS60210850A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6246542A (ja) * 1985-08-26 1987-02-28 Toshiba Corp ウエ−ハテストシステム
US4853758A (en) * 1987-08-12 1989-08-01 American Telephone And Telegraph Company, At&T Bell Laboratories Laser-blown links

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5847596Y2 (ja) * 1979-09-05 1983-10-29 富士通株式会社 半導体装置
JPS56146268A (en) * 1980-04-15 1981-11-13 Fujitsu Ltd Manufacture of semiconductor memory unit
JPS5762544A (en) * 1980-10-03 1982-04-15 Fujitsu Ltd Semiconductor device
JPS5928374A (ja) * 1982-08-10 1984-02-15 Nec Corp 半導体集積回路装置及びその製造方法

Also Published As

Publication number Publication date
JPS60210850A (ja) 1985-10-23

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