JPH05205997A - Substrate support disc - Google Patents
Substrate support discInfo
- Publication number
- JPH05205997A JPH05205997A JP3862492A JP3862492A JPH05205997A JP H05205997 A JPH05205997 A JP H05205997A JP 3862492 A JP3862492 A JP 3862492A JP 3862492 A JP3862492 A JP 3862492A JP H05205997 A JPH05205997 A JP H05205997A
- Authority
- JP
- Japan
- Prior art keywords
- coating layer
- wafer
- substrate
- covering layer
- holding plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体素子や液晶ディ
スプレイを製造するための露光装置等の基板保持盤に関
し、特にウエハ等基板を透過した照明光の反射によって
露光、アライメントまたはフォーカス調整の精度を損な
うことのない基板保持盤に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate holding plate for an exposure apparatus or the like for manufacturing a semiconductor device or a liquid crystal display, and more particularly, accuracy of exposure, alignment or focus adjustment by reflection of illumination light transmitted through a substrate such as a wafer. The present invention relates to a substrate holding board that does not damage the board.
【０００２】[0002]
【従来の技術】従来、半導体素子や液晶ディスプレイを
製造するための露光装置のウエハチャック等の基板保持
盤は、アルミ系の金属からなる母材にアルマイトメッキ
を施したものや、ステンレスやアルマイト系のセラミッ
クまたはアルマイトセラミックからなる母材にＴｉＣ等
の被覆を施したものが用いられていた。このような基板
保持盤にウエハ等基板（以下、「基板」という。）を保
持させて、露光用の照明光あるいはアライメントやフォ
ーカス調整用の照明光を照射した場合は、図４に示すよ
うに、基板Ｗに照射された照明光Ｓの一部分が前記基板
Ｗを透過して基板保持盤５１に到達し、その多くが該基
板保持盤５１の被覆層５２の表面で反射される。2. Description of the Related Art Conventionally, a substrate holding plate such as a wafer chuck of an exposure apparatus for manufacturing a semiconductor device or a liquid crystal display is a base material made of an aluminum-based metal, which is anodized, a stainless steel or an alumite-based material. The base material made of the ceramic or alumite ceramic coated with TiC or the like was used. When a substrate such as a wafer (hereinafter, referred to as “substrate”) is held on such a substrate holder and is irradiated with illumination light for exposure or illumination light for alignment or focus adjustment, as shown in FIG. A part of the illumination light S applied to the substrate W passes through the substrate W and reaches the substrate holding plate 51, and most of it is reflected by the surface of the coating layer 52 of the substrate holding plate 51.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、基板に
入射した照明光の一部分が基板保持盤の表面によって反
射されて再び前記基板の特定箇所に入射すれば、これに
よってレジストの不要な部分が露光されたり、アライメ
ントやフォーカス調整の精度を低下させる等の弊害が発
生する。However, if a part of the illumination light incident on the substrate is reflected by the surface of the substrate holding plate and again enters a specific portion of the substrate, an unnecessary portion of the resist is exposed. In addition, there is a problem that the accuracy of alignment and focus adjustment is reduced.
【０００４】本発明は、上記従来の技術の有する解決す
べき課題に鑑みてなされたものであり、基板を透過した
照明光の反射によって、レジストの不要な部分が露光さ
れたり、アライメントやフォーカス調整の精度を低下さ
せることのない基板保持盤を提供することを目的とする
ものである。The present invention has been made in view of the problems to be solved by the above-mentioned conventional techniques, and the unnecessary portion of the resist is exposed by the reflection of the illumination light transmitted through the substrate, and alignment and focus adjustment. It is an object of the present invention to provide a substrate holding board that does not reduce the accuracy of the above.
【０００５】[0005]
【課題を解決するための手段】上記の目的を達成するた
めに、本発明の基板保持盤は、基板に接触してこれを支
持する支持面を有する基板保持盤であって、その前記支
持面を有する側の表面が、粗面化された表面をもつ反射
率の低い材料からなる第１の被覆層によって被覆されて
おり、該第１の被覆層の、少くとも前記支持面を被覆す
る部分の表面が、平滑な表面をもつ透明材料からなる第
２の被覆層によって被覆されていることを特徴とする。In order to achieve the above object, a substrate holding plate of the present invention is a substrate holding plate having a supporting surface for coming into contact with and supporting a substrate, the supporting surface being the supporting surface. Having a roughened surface, the surface of which is covered with a first coating layer made of a low-reflectance material, the portion of the first coating layer covering at least the supporting surface. Is coated with a second coating layer made of a transparent material having a smooth surface.
【０００６】[0006]
【作用】基板を透過した照明光の多くは反射率の低い第
１の被覆層によって吸収され、残りは前記第１の被覆層
の粗面化された表面で散乱光となって反射される。前記
第１の被覆層には平滑な表面をもつ透明な第２の被覆層
が積層されているため、基板保持盤に載置された基板が
これに吸着されても、前記基板の平坦度が粗面化された
第１の被覆層の表面の凹凸によって損われることはな
い。Most of the illumination light transmitted through the substrate is absorbed by the first coating layer having a low reflectance, and the rest is reflected as scattered light on the roughened surface of the first coating layer. Since the transparent second coating layer having a smooth surface is laminated on the first coating layer, even if the substrate placed on the substrate holding plate is adsorbed by the second coating layer, the flatness of the substrate is reduced. It is not damaged by the unevenness of the surface of the roughened first coating layer.
【０００７】[0007]
【実施例】本発明の実施例を図面に基づいて説明する。Embodiments of the present invention will be described with reference to the drawings.
【０００８】図１は第１実施例を示すもので、（ａ）は
その斜視図、（ｂ）は（ａ）の円Ａで囲んだ部分の断面
を拡大して示す拡大部分断面図である。FIG. 1 shows a first embodiment, (a) is a perspective view thereof, and (b) is an enlarged partial sectional view showing an enlarged cross section of a portion surrounded by a circle A in (a). ..
【０００９】基板保持盤であるウエハチャックＣ1 は平
板状の本体１からなり、該本体１は、複数の突部１ａを
有し、各突部１ａは基板であるウエハ（図示せず）に接
触してこれを支持する支持面１ｂを有する。本体１の、
照明光を反射する表面である各支持面１ｂおよび前記突
部１ａ間の表面等は、反射率の低いＳｉＣからなる第１
被覆層２によって覆われており、該第１の被覆層２の表
面２ａは研削やブラスト加工によって粗面化される。A wafer chuck C 1 which is a substrate holding plate is composed of a flat plate-shaped main body 1, and the main body 1 has a plurality of protrusions 1a. It has a supporting surface 1b which comes into contact with and supports the same. Of the main body 1,
The surface between each of the supporting surfaces 1b and the protrusions 1a, which is the surface that reflects the illumination light, and the like are made of SiC having a low reflectance.
It is covered with the coating layer 2, and the surface 2a of the first coating layer 2 is roughened by grinding or blasting.
【００１０】このように粗面化された第１の被覆層２の
表面２ａは、平滑な表面をもつ透明材料であるＡｌ2 Ｏ
3 からなる第２の被覆層３によって覆われている。な
お、ウエハチャックＣ1 に載置されたウエハは公知の吸
着手段によってこれに吸着される。The surface 2a of the first coating layer 2 thus roughened is made of Al 2 O which is a transparent material having a smooth surface.
It is covered by a second covering layer 3 made of 3. The wafer placed on the wafer chuck C 1 is attracted to the wafer by a known suction means.
【００１１】露光用あるいはアライメントやフォーカス
調整用の照明光が前記ウエハに照射されると、その一部
分は該ウエハを透過してウエハチャックＣ1 に到達する
が、第１の被覆層２は前述のように反射率の低い材料で
作られているためにこれによる反射光は少量であり、加
えて第１の被覆層２が粗面化されているために前記反射
光は散乱光となり、特定の箇所に集中することはない。When the wafer is exposed to illumination light for exposure or for alignment or focus adjustment, a part of the light passes through the wafer and reaches the wafer chuck C 1. However, the first coating layer 2 has the above-mentioned structure. As described above, the amount of reflected light due to this is small because it is made of a material having a low reflectance. In addition, since the first coating layer 2 is roughened, the reflected light becomes scattered light, and You don't concentrate on the spot.
【００１２】すなわち、前記反射光が前記ウエハの裏面
に逆照射されても、ウエハ表面のレジスト膜を露光した
り、アライメントあるいはフォーカス調整の障害となる
ことはない。また、前記第１の被覆層２の粗面化された
表面は、平滑な表面をもつ透明な第２の被覆層３によっ
て覆われているため、本体１に吸着されたウエハの平坦
度が、前記第１の被覆層２の表面の凹凸によって損われ
ることはない。That is, even when the back surface of the wafer is reversely irradiated with the reflected light, it does not interfere with the exposure of the resist film on the front surface of the wafer or the alignment or focus adjustment. Further, since the roughened surface of the first coating layer 2 is covered with the transparent second coating layer 3 having a smooth surface, the flatness of the wafer attracted to the main body 1 is It is not damaged by the unevenness of the surface of the first coating layer 2.
【００１３】図２は第２実施例を説明する拡大部分断面
図であって、本実施例の基板保持盤であるウエハチャッ
クＣ2 においては、本体１１の各突部１１ａの支持面１
１ｂとなる部分自体が研削等によって粗面化されてお
り、これを覆う第１の被覆層１２は前記支持面となる部
分の凹凸によって粗面化される。第１実施例と同様に第
１の被覆層１２は反射率の低い材料で形成され、その表
面には平滑な表面をもつ透明な第２の被覆層１３が積層
される。FIG. 2 is an enlarged partial sectional view for explaining the second embodiment. In the wafer chuck C 2 which is the substrate holding plate of this embodiment, the supporting surface 1 of each projection 11a of the main body 11 is shown.
The portion 1b itself is roughened by grinding or the like, and the first coating layer 12 covering the portion 1b is roughened by the unevenness of the portion serving as the support surface. Similar to the first embodiment, the first coating layer 12 is formed of a material having a low reflectance, and a transparent second coating layer 13 having a smooth surface is laminated on the surface thereof.
【００１４】図３は第３実施例を説明する拡大部分断面
図であって、本実施例の基板保持盤であるウエハチャッ
クＣ3 においては、本体２１の各突部２１ａの支持面２
１ｂのみに平滑な表面をもつ透明な第２の被覆層２３が
設けられる。すなわち第１の被覆層２２の、ウエハ（図
示せず）に接触する部分の表面２２ａのみが第２の被覆
層２３によって被覆される。なお、第１の被覆層２２に
ついては第１実施例と同様であるので説明は省略する。FIG. 3 is an enlarged partial sectional view for explaining the third embodiment. In the wafer chuck C 3 which is the substrate holding plate of this embodiment, the support surface 2 of each projection 21a of the main body 21 is shown.
A transparent second coating layer 23 having a smooth surface is provided only on 1b. That is, only the surface 22 a of the portion of the first coating layer 22 that contacts the wafer (not shown) is coated with the second coating layer 23. The description of the first coating layer 22 is omitted because it is similar to that of the first embodiment.
【００１５】[0015]
【発明の効果】基板保持盤に載置された基板を透過した
照明光の反射によってレジストが露光されたり、アライ
メントやフォーカス調整の精度が損われることがない。
その結果、高精度の露光、焼付けができる。EFFECTS OF THE INVENTION The resist is not exposed by the reflection of illumination light that has passed through the substrate mounted on the substrate holding plate, and the accuracy of alignment and focus adjustment is not impaired.
As a result, highly accurate exposure and printing can be performed.
【図１】第１実施例を説明するもので、（ａ）はその斜
視図、（ｂ）は（ａ）の円Ａで囲まれた部分を拡大して
示す拡大部分断面図である。FIG. 1 is a perspective view showing the first embodiment, and FIG. 1 (b) is an enlarged partial sectional view showing an enlarged portion surrounded by a circle A in (a).
【図２】第２実施例の一部分を示す部分断面図である。FIG. 2 is a partial sectional view showing a part of a second embodiment.
【図３】第３実施例の一部分を示す部分断面図である。FIG. 3 is a partial sectional view showing a part of the third embodiment.
【図４】従来例を説明する部分断面図である。FIG. 4 is a partial cross-sectional view illustrating a conventional example.
Ｃ1 ，Ｃ2 ，Ｃ3 ウエハチャック １，１１，２１ 本体 １ａ，１１ａ，２１ａ 突部 １ｂ，１１ｂ，２１ｂ 支持面 ２，１２，２２ 第１の被覆層 ３，１３，２３ 第２の被覆層C 1 , C 2 , C 3 Wafer chuck 1, 11, 21 Main body 1 a, 11 a, 21 a Projection 1 b, 11 b, 21 b Support surface 2, 12, 22 First coating layer 3, 13, 23 Second coating layer
Claims (2)
有する基板保持盤であって、その前記支持面を有する側
の表面が、粗面化された表面をもつ反射率の低い材料か
らなる第１の被覆層によって被覆されており、該第１の
被覆層の少くとも前記支持面を被覆する部分の表面が、
平滑な表面をもつ透明材料からなる第２の被覆層によっ
て被覆されていることを特徴とする基板保持盤。1. A substrate holding plate having a supporting surface for coming into contact with and supporting the substrate, wherein the surface having the supporting surface has a roughened surface and is made of a material having a low reflectance. Is covered with a first coating layer, and the surface of at least the portion of the first coating layer that covers the support surface is
A substrate holding plate coated with a second coating layer made of a transparent material having a smooth surface.
がそれぞれＳｉＣおよびＡｌ2 Ｏ3 であることを特徴と
する請求項１記載の基板保持盤。2. The substrate holding plate according to claim 1, wherein the materials of the first coating layer and the second coating layer are SiC and Al 2 O 3 , respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3862492A JP3095514B2 (en) | 1992-01-29 | 1992-01-29 | Substrate holding board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3862492A JP3095514B2 (en) | 1992-01-29 | 1992-01-29 | Substrate holding board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05205997A true JPH05205997A (en) | 1993-08-13 |
| JP3095514B2 JP3095514B2 (en) | 2000-10-03 |
Family
ID=12530399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3862492A Expired - Fee Related JP3095514B2 (en) | 1992-01-29 | 1992-01-29 | Substrate holding board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3095514B2 (en) |
Cited By (13)
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| JP2006064992A (en) * | 2004-08-26 | 2006-03-09 | Kyocera Corp | Liquid crystal substrate holding base and manufacturing method therefor |
| JP2006351949A (en) * | 2005-06-17 | 2006-12-28 | Tokyo Electron Ltd | Substrate mounting base, method for manufacturing the same and substrate processing apparatus |
| JP2011002639A (en) * | 2009-06-18 | 2011-01-06 | Shin-Etsu Chemical Co Ltd | Susceptor and flash irradiation method using the same, and method for producing photomask blank |
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-
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| JP2006064992A (en) * | 2004-08-26 | 2006-03-09 | Kyocera Corp | Liquid crystal substrate holding base and manufacturing method therefor |
| JP4502746B2 (en) * | 2004-08-26 | 2010-07-14 | 京セラ株式会社 | Liquid crystal substrate holder and manufacturing method thereof |
| JP2006351949A (en) * | 2005-06-17 | 2006-12-28 | Tokyo Electron Ltd | Substrate mounting base, method for manufacturing the same and substrate processing apparatus |
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| US9256139B2 (en) | 2011-02-18 | 2016-02-09 | Asml Netherlands B.V. | Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder |
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| TWI581362B (en) * | 2012-08-28 | 2017-05-01 | 尼康股份有限公司 | A substrate supporting device, and an exposure device |
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| KR20150136483A (en) * | 2013-03-29 | 2015-12-07 | 스미토모 오사카 세멘토 가부시키가이샤 | Electrostatic chuck device |
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| JP2019211755A (en) * | 2018-05-30 | 2019-12-12 | キヤノン株式会社 | Substrate holding device, exposure device and method for producing article |
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