JP2003233935A - Method and device for fixing substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce nonuniform exposure by suppressing light reflected from the backside direction of a master optical disk during the exposing work of the master optical disk. <P>SOLUTION: A turntable 20 for fixing a quartz master optical disk 10 has a pedestal portion 30 and a quartz table portion 40, and the master optical disk 10 is adsorbed and held coaxially to the turntable 20. The quartz master optical disk 10 and the quartz table portion 40 have equal refractive indexes because they are made of identical materials, and they are arranged in a state in which the backside of the signal recording area 12 of the master optical disk 10 and the close contact area 44 of the quartz table portion 40 are in close contact with each other. Thus, even when the master optical disk 10 is thin, almost no reflective light is generated on the backside of the master optical disk 10, and reflective light generated on the backside of the quarts table portion 40 becomes scattered light, and hence excessive exposure by re- exposure is prevented. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate fixing method and a substrate fixing device which are effective for preventing overexposure when fixing a transparent substrate to a fixing table during an exposure operation of a transparent substrate such as an optical disc master.

[0002]

2. Description of the Related Art Conventionally, when a photoresist exposure operation is performed in a process of manufacturing an optical disk master, the optical disk master is usually fixed on a circular turntable and the turntable is rotated to irradiate an exposure beam. Such a method is used. Then, in such an exposure operation, as a method of fixing the optical disc master onto the turntable, a method of adsorbing and holding onto the turntable by using vacuum adsorption, or a peripheral portion of the optical disc master using a fixing ring member is used. The method of fixing to the turntable is adopted. A ring-shaped groove is formed on the upper surface of the turntable, which serves as a suction port during vacuum suction or a table for supporting the table. The optical disc master is made of a circular glass plate and has a thickness of 6 to 10 mm.
Has become. A photoresist is applied to the surface of the optical disk master, and a laser beam is focused on the surface of the master with a high NA objective lens to perform exposure.

[0003]

The beam transmitted through the photoresist during the exposure of the master as described above is reflected by the back surface of the glass master disk or the surface of the turntable.
Here, the surface of the turntable is surface-treated so as to absorb the exposure beam, and the glass master has a thickness of 6 to 1
If it is 0 mm, the reflectance is low and the reflected beam is also widely diffused, so that the exposure failure due to the re-exposure by the reflected beam hardly occurs. However, in the case of a glass master having a thickness of about 1 mm, the light reflected on the back surface of the master or the table surface is not diffused, and the photoresist is exposed again, resulting in partial overexposure. Further, the thinning of the master causes waviness on the surface of the master when the master is fixed to the table, resulting in poor exposure.

Therefore, as a method for solving these problems,
It is desired that the contact surface between the master and the table be uniform and the back surface reflection be uniform, or that the back surface reflection be prevented as much as possible. Incidentally, such a problem occurs not only during the exposure work of the optical disc master, but also during the exposure of another transparent substrate.

The present invention has been made in view of the above circumstances, and an object thereof is to fix a substrate capable of suppressing reflected light from the rear surface of the transparent substrate and reducing unevenness during exposure. A method and a substrate fixing device are provided.

[0006]

In order to achieve the above object, the present invention provides a substrate fixing method in which a transparent substrate is placed and fixed on a substrate fixing table to perform an exposure operation, and at least the substrate fixing table is provided. In a state where the substrate mounting portion is formed of the same material as the transparent substrate, and the transparent substrate and the substrate mounting portion are fixed to the substrate fixing table, light is not reflected at the contact surface between the transparent substrate and the substrate mounting portion. The feature is that it is fixed. The present invention also provides a substrate fixing method for fixing a transparent substrate to a substrate fixing table to perform an exposure operation, wherein light transmitted through the transparent substrate is fixed to the substrate while the transparent substrate is fixed to the substrate fixing table. It is characterized in that the substrate mounting portion or the transparent substrate is subjected to a surface treatment so as to be scattered on the surface of the substrate mounting portion of the operating table or the back surface of the transparent substrate. The present invention also provides a substrate fixing method for fixing a transparent substrate to a substrate fixing table to perform an exposure operation, wherein light transmitted through the transparent substrate is fixed to the substrate while the transparent substrate is fixed to the substrate fixing table. It is characterized in that the substrate mounting portion or the transparent substrate is subjected to a surface treatment so that the surface of the substrate mounting portion of the operating table or the back surface of the transparent substrate is absorbed.

Further, according to the present invention, in a substrate fixing apparatus for mounting and fixing a transparent substrate on a substrate fixing table for performing an exposure operation, at least the substrate mounting portion of the substrate fixing table is made of the same material as the transparent substrate. Formed by and
It is characterized in that the transparent substrate is fixed on the substrate fixing table in a state where light reflection does not occur on the contact surface between the transparent substrate and the substrate mounting portion. Further, according to the present invention, in a substrate fixing device for fixing a transparent substrate to a substrate fixing table to perform an exposure operation, light transmitted through the transparent substrate is fixed to the substrate while the transparent substrate is fixed to the substrate fixing table. The substrate mounting portion or the transparent substrate is subjected to a surface treatment so as to be scattered on the surface of the substrate mounting portion of the operating table or the back surface of the transparent substrate. Further, according to the present invention, in a substrate fixing device for fixing a transparent substrate to a substrate fixing table to perform an exposure operation, light transmitted through the transparent substrate is fixed to the substrate while the transparent substrate is fixed to the substrate fixing table. The substrate mounting portion or the transparent substrate is subjected to a surface treatment so that the surface of the substrate mounting portion of the operating table or the back surface of the transparent substrate is absorbed.

In the substrate fixing method of the present invention, the substrate mounting portion of the substrate fixing table is formed of the same material as the transparent substrate, and the transparent substrate and the substrate mounting portion are fixed in the state where the transparent substrate is fixed to the substrate fixing table. Even if the transparent substrate is thin, the exposure beam is transmitted to the substrate mounting part side to prevent reflection from the rear surface direction of the transparent substrate, because it is fixed in a state where light reflection does not occur at the contact surface with the substrate. It is possible to suppress light and reduce unevenness during exposure. Further, in the substrate fixing method of the present invention, in a state where the transparent substrate is fixed to the substrate fixing table, the light transmitted through the transparent substrate is scattered or absorbed by the surface of the substrate mounting portion of the substrate fixing table or the rear surface of the transparent substrate. As described above, since the substrate mounting portion or the transparent substrate is subjected to the surface treatment, it is possible to suppress the reflected light from the rear surface direction of the transparent substrate by scattering or absorption and reduce the unevenness at the time of exposure. .

Further, in the substrate fixing device of the present invention, the substrate mounting portion of the substrate fixing table is formed of the same material as the transparent substrate, and the transparent substrate and the substrate mounting portion are fixed in the state where the transparent substrate is fixed to the substrate fixing table. Since it was fixed in a state where light reflection does not occur on the contact surface with the mounting part, even if the transparent substrate is thin, the exposure beam is transmitted to the substrate mounting part side, so that the reflected light from the back surface direction of the transparent substrate is reflected. It is possible to suppress and reduce unevenness during exposure. Further, in the substrate fixing device of the present invention, in a state where the transparent substrate is fixed to the substrate fixing table, the light transmitted through the transparent substrate is scattered or absorbed by the surface of the substrate mounting portion of the substrate fixing table or the rear surface of the transparent substrate. As described above, since the substrate mounting portion or the transparent substrate is subjected to the surface treatment, it is possible to suppress the reflected light from the back surface direction of the transparent substrate by scattering or absorption, and reduce the unevenness at the time of exposure.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a substrate fixing method and a substrate fixing device according to the present invention will be described below. The embodiments described below are preferred specific examples of the present invention, and various technically preferable limitations are given. However, the scope of the present invention is not limited to the present invention in the following description. Unless otherwise stated, the present invention is not limited to these embodiments.

FIG. 1 is a sectional view showing a structural example of a substrate fixing device according to an embodiment of the present invention, and FIG. 2 is a top view showing a turntable of the substrate fixing device shown in FIG.
The embodiment of the present invention is one in which the present invention is applied to the case of performing photoresist exposure in the case of manufacturing an optical disc master. The turntable 20 that fixes the optical disk master 10 includes a pedestal portion 30 that is rotationally driven, and the pedestal portion 3.
And a quartz table 40 installed on the optical disc master 40. The quartz table 40 serves as a substrate mounting portion for mounting and fixing the optical disk master 10.

Further, in this embodiment, the optical disc master 10 is fixed to the upper surface of the quartz table portion 40 by a vacuum suction method, and the quartz table portion 40 is provided with a large number of through holes 42 for vacuum suction. ing. Here, as shown in FIG. 2, the through holes 42 are dispersed and arranged in an area avoiding the contact area 44 corresponding to the signal recording area 12 of the optical disc master 10, and the optical disc master 10 is made of the quartz table portion 40. The quartz table part 4 and the back surface of the signal recording area 12 of the optical disc master 10 in a state of being sucked and fixed on the top.
When the contact area 44 of 0 is in close contact with each other, the light reflected on the contact surface is suppressed as much as possible.

The optical disk master 10 is coaxially fixed to such a turntable 20, and an exposure operation is performed while rotating the turntable 20. The optical disc master 10 is made of a quartz glass plate, and a resist film 14 is formed on the upper surface by a photoresist process. The quartz optical disc master 10 and the quartz table part 40 made of such quartz have the same refractive index by using the same material, and the back surface of the signal recording area 12 of the optical disc master 10 and the quartz table part 40 are in close contact with each other. Since the region 44 and the region 44 are arranged in close contact with each other, the exposure beam incident from above the optical disk master 10 is not reflected by the contact surface between the two, but is transmitted to the quartz table 40 side, and the quartz table 40 is formed. It reaches the back surface of 40. Therefore, even when the thickness of the optical disc master 10 is thin, almost no reflected light is generated on the back surface of the optical disc master 10, and the reflected light generated on the back surface of the quartz table portion 40 is also scattered light. The amount of light incident on is small, and overexposure due to such reflected light can be prevented.

Hereinafter, a more specific example of the substrate fixing method and the substrate fixing device according to the present embodiment will be described with reference to FIG.
2 and FIG. First, the optical disc master 10
Is a quartz wafer having an outer diameter of 200 mm and a thickness of 1 mm,
The back surface is a polished surface. The quartz table portion 40 of the turntable 20 has an outer diameter of 190 mm and a thickness of 10 mm, and its surface is a polishing surface. The signal recording area 12 of the optical disk master 10 is an area having a radius of about 10 mm to 60 mm, and a contact area 44 of the quartz table portion 40 is formed corresponding to this, and a radius of 8 mm is avoided while avoiding the contact area 44.
Through holes 42 are provided at equal intervals along a circumference having a radius of 75 mm. If the diameter of the through hole 42 is too large, the optical disc master 10 will be distorted, so it is preferable to make it sufficiently small depending on the thickness of the optical disc master 10.
Here, the diameter is 0.5 mm.

Further, the pedestal portion 30 of the turntable 20
Is made of metal, for example, and is provided with a ring-shaped vacuum suction groove 32 on the upper surface, and the through hole 42 of the quartz table portion 40 is provided.
It is designed to communicate with. Further, the upper surface of the pedestal portion 30 is surface-treated in black so that light is absorbed. On the upper surface of the pedestal portion 30, the quartz table portion 4 is attached.
0 and the optical disk master 10 are sequentially stacked and sucked through the vacuum suction groove 32, whereby the quartz table portion 40 and the optical disk master 10 are integrally suction-held. Due to this adsorption, it is possible to give the thin glass master 10 rigidity.

The quartz table portion 40 is thus formed.
In the state where the optical disk master 10 is sucked and held by the pedestal portion 30, the quartz table 40 and the optical disk master 10 are held.
Can be considered to be optically integrated. In other words, the quartz table 40 and the optical disc master 10 can be treated as light that does not absorb, scatter, or reflect on the contact surface and that transmits while maintaining the traveling direction. Therefore, the light that has been irradiated onto the surface of the optical disc master 10 for exposure and transmitted without being absorbed by the photoresist film 14 is not reflected on the back surface of the optical disc master 10 and is reflected on the bottom surface of the quartz table 40. Reach up to. Then, part of the light is reflected on the bottom surface of the quartz table portion 40, and part of the light is absorbed or reflected on the upper surface of the pedestal portion 30.

The light reflected here is the optical disc master 10.
However, the light emitted from the objective lens with a high NA rapidly expands the irradiation area as the distance increases, reciprocates in quartz with a total thickness of 11 mm, and repeats absorption and reflection, and then the resist film. The area density of the light re-irradiated on 14 is 1
This is 1/121 of the case of reciprocating in quartz having a thickness of mm. As a result, it is possible to significantly reduce the exposure unevenness on the resist film 14.

Further, in the above embodiment, since the optical disk master 10 is closely supported by the quartz table portion 40 made of the same material, even when the optical disk master 10 is thin, sufficient rigidity similar to a thick substrate is obtained. It is possible to suppress the distortion during the work.

The present invention can be modified and applied in the following manners in addition to the above embodiments.
For example, in the above-described embodiment, the quartz table portion 4
0 surface or the back surface of the glass master 10 is subjected to surface treatment such as graining, and the reflected light component is scattered at every angle, so that the resist film 14 is returned to the surface of the glass master 10 more than when reflected on a flat surface. It is also possible to reduce the areal density of the light that is re-irradiated with. Further, the upper surface of the pedestal portion 30 of the turntable 20 may be subjected to a grain treatment to scatter the reflected light instead of the black surface treatment.

In the above-described embodiment, the turntable 20 is composed of the quartz table portion 40 and the pedestal portion 30,
Although a black surface treatment is applied to the upper surface of the pedestal portion 30 so that light is absorbed, the same surface treatment may be applied to the back surface of the quartz table portion 40, or the back surface of the master 10 may be subjected to a black surface treatment. By performing the above, the absolute amount of the reflected light component may be reduced. Also in this case, the surface density of the light returning to the master surface and re-irradiating the resist film again can be lowered as compared with the case where the light is reflected by the flat surface not subjected to the surface treatment. In addition,
When the surface treatment for absorbing light or the surface treatment for scattering light is performed on the back surface of the master 10 or the turntable 20 side, if the surface treatment is sufficiently effective, the turntable 20 side is made of quartz. It is also possible to omit the table section 40 and configure the substrate mounting section with other members.

Further, in the above-described embodiment, the entire area immediately below the signal recording area of the optical disc master 10 is brought into close contact with the quartz table portion 40 made of the same material as the master disc 10 to suppress the variation in the areal density of the returning light intensity. However, instead of this, the entire area directly below the signal recording area may be hollow, and a suction support structure may be adopted in which the central portion and the outer peripheral portion of the disk master 10 are closely attached in a ring shape. Also in this case, it is possible to suppress variations in the areal density of the returning light intensity in the signal recording area. Further, in the above-mentioned embodiment,
Although the optical disk master 10 is held by vacuum suction, it may be held by electrostatic attraction, for example. When held by vacuum suction or electrostatic suction, the absolute amount of the reflected light component may be reduced by performing a black surface treatment on the back surface of the master 10. In this case as well, the surface density of the light returning to the master disk surface and re-irradiating the resist film again can be lowered as compared with the case where the light is reflected by the flat surface which is not surface-treated. Further, although the above-described embodiment has described the configuration for performing the exposure processing of the optical disc master 10, the present invention can be widely applied to the configuration for performing exposure on another transparent substrate.

[0022]

As described above, according to the substrate fixing method of the present invention, the substrate mounting portion of the substrate fixing table is made of the same material as the transparent substrate, and the transparent substrate is fixed to the substrate fixing table. In this state, the transparent substrate and the substrate mounting portion are fixed in a state in which light reflection does not occur at the contact surface, so that even if the transparent substrate is thin, the exposure beam can be transmitted to the substrate mounting portion side. The effect of suppressing reflected light from the back surface of the transparent substrate and reducing unevenness during exposure is obtained. Further, according to the substrate fixing method of the present invention, in a state where the transparent substrate is fixed to the substrate fixing table, the light transmitted through the transparent substrate is scattered on the surface of the substrate mounting portion of the substrate fixing table or the back surface of the transparent substrate. Since the substrate mounting portion or the transparent substrate is subjected to the surface treatment so as to be absorbed, the reflected light from the back surface direction of the transparent substrate can be suppressed by scattering or absorption, and unevenness during exposure can be reduced. effective.

Further, according to the substrate fixing device of the present invention, the substrate mounting portion of the substrate fixing table is formed of the same material as the transparent substrate, and the transparent substrate and the transparent substrate are fixed to the substrate fixing table. Since it was fixed in a state where light reflection does not occur on the contact surface with the substrate mounting part, even if the transparent substrate is thin, the exposure beam is transmitted to the substrate mounting part side, so that it is reflected from the back surface direction of the transparent substrate. There is an effect that light can be suppressed and unevenness at the time of exposure can be reduced.
Further, according to the substrate fixing device of the present invention, in a state where the transparent substrate is fixed to the substrate fixing table, the light transmitted through the transparent substrate is scattered or scattered on the surface of the substrate mounting portion of the substrate fixing table or the rear surface of the transparent substrate. Since the substrate mounting portion or the transparent substrate is subjected to the surface treatment so as to be absorbed, the reflected light from the back surface direction of the transparent substrate is suppressed by scattering or absorption,
There is an effect that unevenness during exposure can be reduced.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a configuration example of a substrate fixing device according to an embodiment of the present invention.

FIG. 2 is a top view showing a turntable of the substrate fixing device shown in FIG.

[Explanation of symbols]

10 ... Optical disc master, 12 ... Signal recording area, 14
... resist film, 20 ... turntable, 30 ... pedestal part, 40 ... quartz table part, 42 ... through hole.

Claims (48)

[Claims] 1. A substrate fixing method in which a transparent substrate is placed and fixed on a substrate fixing table to perform an exposure operation, wherein at least the substrate placing portion of the substrate fixing table is formed of the same material as the transparent substrate. And a method for fixing a substrate, wherein the transparent substrate is fixed on a substrate fixing table in a state in which light reflection does not occur at a contact surface between the transparent substrate and the substrate mounting portion. . 2. A substrate fixing method for exposing a transparent substrate fixed to a substrate fixing table, wherein the transparent substrate is fixed to the substrate fixing table,
The substrate mounting portion or the transparent substrate is subjected to a surface treatment so that the light transmitted through the transparent substrate is scattered on the surface of the substrate mounting portion of the substrate fixing table or the back surface of the transparent substrate. Board fixing method. 3. A substrate fixing method in which a transparent substrate is fixed to a substrate fixing table and an exposure operation is performed, wherein the transparent substrate is fixed to the substrate fixing table,
The surface treatment is performed on the substrate mounting portion or the transparent substrate so that the light transmitted through the transparent substrate is absorbed by the surface of the substrate mounting portion of the substrate fixing table or the back surface of the transparent substrate. Board fixing method. 4. The substrate fixing method according to claim 1, wherein the transparent substrate is an optical disc master. 5. The substrate fixing method according to claim 2, wherein the transparent substrate is an optical disc master. 6. The substrate fixing method according to claim 3, wherein the transparent substrate is an optical disc master. 7. The substrate fixing method according to claim 4, wherein the entire area directly below the signal recording area is in contact with the substrate fixing table on the back surface of the optical disk master. 8. The method for fixing a substrate according to claim 5, wherein the entire lower portion of the signal recording area is in contact with the substrate fixing table on the back surface of the master for optical disks. 9. The substrate fixing method according to claim 6, wherein the entire portion directly below the signal recording area on the rear surface of the optical disc master is in contact with the substrate fixing table. 10. The substrate fixing method according to claim 4, wherein the substrate fixing table is contacted only at a position other than directly below the signal recording area on the back surface of the optical disc master. 11. The substrate fixing method according to claim 5, wherein the substrate fixing table is contacted only at a position on the back surface of the optical disk master other than immediately below the signal recording area. 12. The substrate fixing method according to claim 6, wherein the substrate fixing table is contacted only at a position other than directly below the signal recording area on the back surface of the optical disk master. 13. The substrate fixing method according to claim 1, wherein the transparent substrate is fixed to the substrate fixing table by vacuum suction. 14. The substrate fixing method according to claim 2, wherein the transparent substrate is fixed to the substrate fixing table by vacuum suction. 15. The substrate fixing method according to claim 3, wherein the transparent substrate is fixed to the substrate fixing table by vacuum suction. 16. The substrate fixing method according to claim 1, wherein the transparent substrate is fixed to the substrate fixing table by electrostatic attraction. 17. The substrate fixing method according to claim 2, wherein the transparent substrate is fixed to the substrate fixing table by electrostatic attraction. 18. The substrate fixing method according to claim 3, wherein the transparent substrate is fixed to the substrate fixing table by electrostatic attraction. 19. The substrate fixing table has a pedestal part that is driven to rotate and a table part provided with a substrate placing part, and the table part and the pedestal part are installed in a state where the table part is installed on the pedestal part. 2. The substrate fixing method according to claim 1, wherein the pedestal portion is surface-treated so that the contact surface optically scatters. 20. The substrate fixing table has a pedestal part that is rotationally driven and a table part provided with a substrate placing part, and the table part and the pedestal part are installed in a state where the table part is installed on the pedestal part. The substrate fixing method according to claim 2, wherein the pedestal portion is surface-treated so that the contact surface optically scatters. 21. The substrate fixing table has a pedestal part that is driven to rotate and a table part provided with a substrate mounting part, and the table part and the pedestal part are installed in a state where the table part is installed on the pedestal part. The substrate fixing method according to claim 3, wherein the pedestal portion is subjected to a surface treatment so that the contact surface optically scatters. 22. The substrate fixing table has a pedestal part that is driven to rotate and a table part provided with a substrate placing part, and the table part and the pedestal part are installed with the table part installed on the pedestal part. The substrate fixing method according to claim 1, wherein the pedestal portion is surface-treated so that the contact surface optically absorbs the light. 23. The substrate fixing table has a pedestal part that is driven to rotate and a table part provided with a substrate mounting part, and the table part and the pedestal part are installed in a state where the table part is installed on the pedestal part. The substrate fixing method according to claim 2, wherein the pedestal portion is surface-treated so that the contact surface optically absorbs the light. 24. The substrate fixing table has a pedestal part that is driven to rotate and a table part provided with a substrate placing part, and the table part and the pedestal part are installed in a state where the table part is installed on the pedestal part. The substrate fixing method according to claim 3, wherein the pedestal portion is subjected to a surface treatment so that the contact surface optically absorbs. 25. A substrate fixing device for carrying out an exposure operation by mounting and fixing a transparent substrate on a substrate fixing table,
At least the substrate mounting portion of the substrate fixing table is formed of the same material as the transparent substrate, and at the contact surface between the transparent substrate and the substrate mounting portion in a state where the transparent substrate is fixed to the substrate fixing table. A substrate fixing device, which is fixed in a state where light reflection does not occur. 26. A substrate fixing device for performing an exposure operation by fixing a transparent substrate on a substrate fixing table, wherein the transparent substrate is fixed on the substrate fixing table,
The substrate mounting portion or the transparent substrate is subjected to a surface treatment so that the light transmitted through the transparent substrate is scattered on the surface of the substrate mounting portion of the substrate fixing table or the back surface of the transparent substrate. Fixing device. 27. In a substrate fixing device for fixing a transparent substrate to a substrate fixing table and performing an exposure operation, the transparent substrate is fixed to the substrate fixing table,
The substrate mounting portion or the transparent substrate is subjected to a surface treatment so that the light transmitted through the transparent substrate is absorbed by the surface of the substrate mounting portion of the substrate fixing table or the back surface of the transparent substrate. Fixing device. 28. The substrate fixing device according to claim 25, wherein the transparent substrate is an optical disc master. 29. The substrate fixing device according to claim 26, wherein the transparent substrate is an optical disc master. 30. The substrate fixing device according to claim 27, wherein the transparent substrate is an optical disc master. 31. The substrate fixing device according to claim 28, wherein an entire portion immediately below a signal recording area is in contact with the substrate fixing table on the back surface of the optical disk master. 32. The substrate fixing device according to claim 29, wherein an entire portion immediately below a signal recording area is in contact with the substrate fixing table on the back surface of the optical disc master. 33. The substrate fixing device according to claim 30, wherein an entire portion immediately below a signal recording area on the back surface of the optical disk master comes into contact with the substrate fixing table. 34. The substrate fixing device according to claim 28, wherein the substrate fixing table comes into contact with the substrate fixing table only at a position other than a portion directly below the signal recording area on the back surface of the optical disk master. 35. The substrate fixing device according to claim 29, wherein the substrate fixing table is in contact with the substrate fixing table only at a position other than a position directly below the signal recording area on the back surface of the optical disk master. 36. The substrate fixing device according to claim 30, wherein the substrate fixing table is in contact with the substrate fixing table only at a position other than directly below the signal recording area on the back surface of the optical disk master. 37. The substrate fixing device according to claim 25, wherein the transparent substrate is fixed to the substrate fixing table by vacuum suction. 38. The substrate fixing device according to claim 26, wherein the transparent substrate is fixed to the substrate fixing table by vacuum suction. 39. The substrate fixing device according to claim 27, wherein the transparent substrate is fixed to the substrate fixing table by vacuum suction. 40. The substrate fixing device according to claim 25, wherein the transparent substrate is fixed to the substrate fixing table by electrostatic attraction. 41. The substrate fixing device according to claim 26, wherein the transparent substrate is fixed to the substrate fixing table by electrostatic attraction. 42. The substrate fixing device according to claim 27, wherein the transparent substrate is fixed to the substrate fixing table by electrostatic attraction. 43. The substrate fixing table has a pedestal part which is rotationally driven and a table part provided with a substrate placing part, and the table part and the pedestal part are installed in a state where the table part is installed on the pedestal part. 26. The substrate fixing device according to claim 25, wherein the pedestal part is surface-treated so that the contact surface optically scatters. 44. The substrate fixing table has a pedestal part that is rotationally driven and a table part provided with a substrate placing part, and the table part and the pedestal part are installed in a state where the table part is installed on the pedestal part. 27. The substrate fixing device according to claim 26, wherein the pedestal part is surface-treated so that the contact surface is optically scattered. 45. The substrate fixing table has a pedestal part which is rotationally driven and a table part provided with a substrate placing part, and the table part and the pedestal part are mounted in a state where the table part is installed on the pedestal part. 28. The substrate fixing device according to claim 27, wherein the pedestal part is surface-treated so that the contact surface optically scatters. 46. The substrate fixing table has a pedestal part which is rotationally driven and a table part provided with a substrate placing part, and the table part and the pedestal part are installed in a state where the table part is installed on the pedestal part. 26. The substrate fixing device according to claim 25, wherein the pedestal portion is surface-treated so that the contact surface optically absorbs the light. 47. The substrate fixing table has a pedestal part which is rotationally driven and a table part provided with a substrate placing part, and the table part and the pedestal part are installed with the table part installed on the pedestal part. 27. The substrate fixing device according to claim 26, wherein the pedestal portion is surface-treated so that the contact surface optically absorbs the light. 48. The substrate fixing table has a pedestal part that is driven to rotate and a table part provided with a substrate placing part, and the table part and the pedestal part are installed in a state where the table part is installed on the pedestal part. 28. The substrate fixing device according to claim 27, wherein the pedestal part is surface-treated so that the contact surface optically absorbs the surface.