JPH0519974Y2 - - Google Patents
Info
- Publication number
- JPH0519974Y2 JPH0519974Y2 JP14343287U JP14343287U JPH0519974Y2 JP H0519974 Y2 JPH0519974 Y2 JP H0519974Y2 JP 14343287 U JP14343287 U JP 14343287U JP 14343287 U JP14343287 U JP 14343287U JP H0519974 Y2 JPH0519974 Y2 JP H0519974Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal substrates
- printed wiring
- wiring board
- integrated circuit
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 34
- 229910052751 metal Inorganic materials 0.000 claims description 30
- 239000002184 metal Substances 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 239000004020 conductor Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14343287U JPH0519974Y2 (uk) | 1987-09-18 | 1987-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14343287U JPH0519974Y2 (uk) | 1987-09-18 | 1987-09-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6448068U JPS6448068U (uk) | 1989-03-24 |
| JPH0519974Y2 true JPH0519974Y2 (uk) | 1993-05-25 |
Family
ID=31410253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14343287U Expired - Lifetime JPH0519974Y2 (uk) | 1987-09-18 | 1987-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0519974Y2 (uk) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2840505A1 (fr) | 2002-05-31 | 2003-12-05 | Thomson Multimedia Broadband F | Dispositif de blindage pour cartes de circuits imprimes |
-
1987
- 1987-09-18 JP JP14343287U patent/JPH0519974Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6448068U (uk) | 1989-03-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0004148B1 (en) | Electrical connector for use in mounting an electronic device on a substrate | |
| JP4178880B2 (ja) | モジュール部品 | |
| US6028358A (en) | Package for a semiconductor device and a semiconductor device | |
| JPH0519974Y2 (uk) | ||
| JPH0558597B2 (uk) | ||
| JPH0359591B2 (uk) | ||
| JPH0349415Y2 (uk) | ||
| JP2567661B2 (ja) | 混成集積回路 | |
| JPH0445253Y2 (uk) | ||
| JPH113955A (ja) | 半導体チップ搭載ボード | |
| JP2641912B2 (ja) | 格子配列形半導体素子パッケージ | |
| JPH0639483Y2 (ja) | 混成集積回路 | |
| JPH0442937Y2 (uk) | ||
| JPH0458189B2 (uk) | ||
| JPH064605Y2 (ja) | 混成集積回路 | |
| JP2771575B2 (ja) | 混成集積回路 | |
| JPS61166148A (ja) | 多層混成集積回路装置 | |
| JPH02110990A (ja) | 混成集積回路 | |
| JPH0735413Y2 (ja) | 混成集積回路におけるチツプ電子部品の取付構造 | |
| JPH0442938Y2 (uk) | ||
| JP3615236B2 (ja) | 混成集積回路装置 | |
| JP2766361B2 (ja) | 半導体装置 | |
| JP2879503B2 (ja) | 面実装型電子回路装置 | |
| JPH0531839B2 (uk) | ||
| JPH0672249U (ja) | 集積回路装置 |