JPH0519319B2 - - Google Patents

Info

Publication number
JPH0519319B2
JPH0519319B2 JP62011718A JP1171887A JPH0519319B2 JP H0519319 B2 JPH0519319 B2 JP H0519319B2 JP 62011718 A JP62011718 A JP 62011718A JP 1171887 A JP1171887 A JP 1171887A JP H0519319 B2 JPH0519319 B2 JP H0519319B2
Authority
JP
Japan
Prior art keywords
pattern
inner layer
connection
land portion
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62011718A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01795A (ja
JPS64795A (en
Inventor
Yoshasu Nishikawa
Hajime Hosokawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP1171887A priority Critical patent/JPS64795A/ja
Publication of JPH01795A publication Critical patent/JPH01795A/ja
Publication of JPS64795A publication Critical patent/JPS64795A/ja
Publication of JPH0519319B2 publication Critical patent/JPH0519319B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP1171887A 1987-01-20 1987-01-20 Multilayer printed-interconnection board Granted JPS64795A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1171887A JPS64795A (en) 1987-01-20 1987-01-20 Multilayer printed-interconnection board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1171887A JPS64795A (en) 1987-01-20 1987-01-20 Multilayer printed-interconnection board

Publications (3)

Publication Number Publication Date
JPH01795A JPH01795A (ja) 1989-01-05
JPS64795A JPS64795A (en) 1989-01-05
JPH0519319B2 true JPH0519319B2 (enrdf_load_html_response) 1993-03-16

Family

ID=11785822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1171887A Granted JPS64795A (en) 1987-01-20 1987-01-20 Multilayer printed-interconnection board

Country Status (1)

Country Link
JP (1) JPS64795A (enrdf_load_html_response)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH044577A (ja) * 1990-04-20 1992-01-09 Nec Kansai Ltd 気密端子及びその製造方法
EP0817548B1 (en) * 1996-01-11 2006-04-05 Ibiden Co., Ltd. Printed wiring board and method for manufacturing the same
JP2005323288A (ja) * 2004-05-11 2005-11-17 Hosiden Corp デジタルマイクロホン
JP2007250697A (ja) * 2006-03-14 2007-09-27 Nec Corp サーマルランド付き配線基板及び該配線基板を備えた電子機器

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59146986U (ja) * 1983-03-22 1984-10-01 日本電気株式会社 多層プリント板
JPS60121674U (ja) * 1984-01-26 1985-08-16 株式会社明電舎 プリント基板
JPS6157565U (enrdf_load_html_response) * 1984-09-18 1986-04-17

Also Published As

Publication number Publication date
JPS64795A (en) 1989-01-05

Similar Documents

Publication Publication Date Title
US5414223A (en) Solder pad for printed circuit boards
EP1592290A1 (en) Wired circuit board and production method thereof
JPH0519319B2 (enrdf_load_html_response)
US6326556B1 (en) Multilayered printed wiring board
JPH01795A (ja) 多層プリント配線板
JPH06236959A (ja) リードフレーム及び電子部品搭載基板
JPS6124295A (ja) 配線基板
KR100300624B1 (ko) 전자부품탑재용기판및그의제조방법
JPH09130013A (ja) プリント配線板の製造方法、多数個どり用基板
JPH0426800B2 (enrdf_load_html_response)
JP2001358257A (ja) 半導体装置用基板の製造方法
JP2000091722A (ja) プリント配線板及びその製造方法
JP2002324968A (ja) 配線基板の製造方法
JPH1041677A (ja) 電磁干渉シールド型印刷配線板及びその製造方法
JPH03245593A (ja) プリント配線板の製造方法
KR100654085B1 (ko) 다층 인쇄회로기판의 슬루프형 스루홀 제조공법
JP2001007453A (ja) プリント配線基板及びその製造方法
KR101173316B1 (ko) 인쇄 회로기판의 제조방법 및 인쇄 회로기판의 제조 방법에의해 제조된 인쇄 회로기판
JPH0590764A (ja) 電子部品搭載用基板の製造方法
JP2004200448A (ja) 電子部品の基板実装方法
JPH066031A (ja) プリント配線板の製造方法
JP2755255B2 (ja) 半導体搭載用基板
KR100438091B1 (ko) 다층프린트 배선판
JPH0336319B2 (enrdf_load_html_response)
JP2025099076A (ja) 配線基板及び配線基板の製造方法