JPH0519319B2 - - Google Patents
Info
- Publication number
- JPH0519319B2 JPH0519319B2 JP62011718A JP1171887A JPH0519319B2 JP H0519319 B2 JPH0519319 B2 JP H0519319B2 JP 62011718 A JP62011718 A JP 62011718A JP 1171887 A JP1171887 A JP 1171887A JP H0519319 B2 JPH0519319 B2 JP H0519319B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- inner layer
- connection
- land portion
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1171887A JPS64795A (en) | 1987-01-20 | 1987-01-20 | Multilayer printed-interconnection board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1171887A JPS64795A (en) | 1987-01-20 | 1987-01-20 | Multilayer printed-interconnection board |
Publications (3)
Publication Number | Publication Date |
---|---|
JPH01795A JPH01795A (ja) | 1989-01-05 |
JPS64795A JPS64795A (en) | 1989-01-05 |
JPH0519319B2 true JPH0519319B2 (enrdf_load_html_response) | 1993-03-16 |
Family
ID=11785822
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1171887A Granted JPS64795A (en) | 1987-01-20 | 1987-01-20 | Multilayer printed-interconnection board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS64795A (enrdf_load_html_response) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH044577A (ja) * | 1990-04-20 | 1992-01-09 | Nec Kansai Ltd | 気密端子及びその製造方法 |
EP0817548B1 (en) * | 1996-01-11 | 2006-04-05 | Ibiden Co., Ltd. | Printed wiring board and method for manufacturing the same |
JP2005323288A (ja) * | 2004-05-11 | 2005-11-17 | Hosiden Corp | デジタルマイクロホン |
JP2007250697A (ja) * | 2006-03-14 | 2007-09-27 | Nec Corp | サーマルランド付き配線基板及び該配線基板を備えた電子機器 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59146986U (ja) * | 1983-03-22 | 1984-10-01 | 日本電気株式会社 | 多層プリント板 |
JPS60121674U (ja) * | 1984-01-26 | 1985-08-16 | 株式会社明電舎 | プリント基板 |
JPS6157565U (enrdf_load_html_response) * | 1984-09-18 | 1986-04-17 |
-
1987
- 1987-01-20 JP JP1171887A patent/JPS64795A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS64795A (en) | 1989-01-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5414223A (en) | Solder pad for printed circuit boards | |
EP1592290A1 (en) | Wired circuit board and production method thereof | |
JPH0519319B2 (enrdf_load_html_response) | ||
US6326556B1 (en) | Multilayered printed wiring board | |
JPH01795A (ja) | 多層プリント配線板 | |
JPH06236959A (ja) | リードフレーム及び電子部品搭載基板 | |
JPS6124295A (ja) | 配線基板 | |
KR100300624B1 (ko) | 전자부품탑재용기판및그의제조방법 | |
JPH09130013A (ja) | プリント配線板の製造方法、多数個どり用基板 | |
JPH0426800B2 (enrdf_load_html_response) | ||
JP2001358257A (ja) | 半導体装置用基板の製造方法 | |
JP2000091722A (ja) | プリント配線板及びその製造方法 | |
JP2002324968A (ja) | 配線基板の製造方法 | |
JPH1041677A (ja) | 電磁干渉シールド型印刷配線板及びその製造方法 | |
JPH03245593A (ja) | プリント配線板の製造方法 | |
KR100654085B1 (ko) | 다층 인쇄회로기판의 슬루프형 스루홀 제조공법 | |
JP2001007453A (ja) | プリント配線基板及びその製造方法 | |
KR101173316B1 (ko) | 인쇄 회로기판의 제조방법 및 인쇄 회로기판의 제조 방법에의해 제조된 인쇄 회로기판 | |
JPH0590764A (ja) | 電子部品搭載用基板の製造方法 | |
JP2004200448A (ja) | 電子部品の基板実装方法 | |
JPH066031A (ja) | プリント配線板の製造方法 | |
JP2755255B2 (ja) | 半導体搭載用基板 | |
KR100438091B1 (ko) | 다층프린트 배선판 | |
JPH0336319B2 (enrdf_load_html_response) | ||
JP2025099076A (ja) | 配線基板及び配線基板の製造方法 |