JPH0519310B2 - - Google Patents

Info

Publication number
JPH0519310B2
JPH0519310B2 JP62214319A JP21431987A JPH0519310B2 JP H0519310 B2 JPH0519310 B2 JP H0519310B2 JP 62214319 A JP62214319 A JP 62214319A JP 21431987 A JP21431987 A JP 21431987A JP H0519310 B2 JPH0519310 B2 JP H0519310B2
Authority
JP
Japan
Prior art keywords
chip
resin
side wall
sealed
island
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62214319A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6457739A (en
Inventor
Shigeki Sako
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP62214319A priority Critical patent/JPS6457739A/ja
Priority to US07/235,455 priority patent/US4942456A/en
Priority to KR1019880010738A priority patent/KR910003542B1/ko
Publication of JPS6457739A publication Critical patent/JPS6457739A/ja
Publication of JPH0519310B2 publication Critical patent/JPH0519310B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/12—
    • H10W74/124—
    • H10W40/778—
    • H10W70/411—
    • H10W70/468—
    • H10W74/114—
    • H10W90/811—
    • H10W72/01515—
    • H10W72/075—
    • H10W72/5449—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP62214319A 1987-08-28 1987-08-28 Resin seal type element Granted JPS6457739A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP62214319A JPS6457739A (en) 1987-08-28 1987-08-28 Resin seal type element
US07/235,455 US4942456A (en) 1987-08-28 1988-08-22 Plastic packaged device having a hollow portion enclosing a chip element
KR1019880010738A KR910003542B1 (ko) 1987-08-28 1988-08-24 수지밀폐형소자 및 그 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62214319A JPS6457739A (en) 1987-08-28 1987-08-28 Resin seal type element

Publications (2)

Publication Number Publication Date
JPS6457739A JPS6457739A (en) 1989-03-06
JPH0519310B2 true JPH0519310B2 (en:Method) 1993-03-16

Family

ID=16653787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62214319A Granted JPS6457739A (en) 1987-08-28 1987-08-28 Resin seal type element

Country Status (3)

Country Link
US (1) US4942456A (en:Method)
JP (1) JPS6457739A (en:Method)
KR (1) KR910003542B1 (en:Method)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5605863A (en) * 1990-08-31 1997-02-25 Texas Instruments Incorporated Device packaging using heat spreaders and assisted deposition of wire bonds
US5847467A (en) * 1990-08-31 1998-12-08 Texas Instruments Incorporated Device packaging using heat spreaders and assisted deposition of wire bonds
US5278446A (en) * 1992-07-06 1994-01-11 Motorola, Inc. Reduced stress plastic package
JP3132449B2 (ja) * 1998-01-09 2001-02-05 日本電気株式会社 樹脂外装型半導体装置の製造方法
US5899583A (en) * 1998-02-09 1999-05-04 Eastman Kodak Company Viewfinder lens assembly
US7778750B2 (en) * 2002-02-25 2010-08-17 Cummins Inc. Vehicle communications network adapter
US6556782B1 (en) 2002-08-22 2003-04-29 Eastman Kodak Company Camera having viewfinder box extending from cover to cover and assembly method
JP2008235559A (ja) * 2007-03-20 2008-10-02 Mitsui Chemicals Inc 中空パッケージおよびその製造方法
US7651891B1 (en) * 2007-08-09 2010-01-26 National Semiconductor Corporation Integrated circuit package with stress reduction
US8193597B2 (en) * 2009-11-17 2012-06-05 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Acoustic device with low acoustic loss packaging
US8232615B2 (en) * 2010-02-23 2012-07-31 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Packaged device with acoustic transducer and amplifier
JP6080305B2 (ja) * 2013-08-21 2017-02-15 新電元工業株式会社 半導体装置の製造方法、半導体装置及びリードフレーム
US11211305B2 (en) 2016-04-01 2021-12-28 Texas Instruments Incorporated Apparatus and method to support thermal management of semiconductor-based components
US10861796B2 (en) * 2016-05-10 2020-12-08 Texas Instruments Incorporated Floating die package
US10179730B2 (en) 2016-12-08 2019-01-15 Texas Instruments Incorporated Electronic sensors with sensor die in package structure cavity
US10074639B2 (en) 2016-12-30 2018-09-11 Texas Instruments Incorporated Isolator integrated circuits with package structure cavity and fabrication methods
JP7177330B2 (ja) * 2018-06-28 2022-11-24 日亜化学工業株式会社 発光装置の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4054901A (en) * 1975-10-14 1977-10-18 Thermalloy, Inc. Index mounting unitary heat sink apparatus with apertured base
JPS59172253A (ja) * 1983-03-18 1984-09-28 Mitsubishi Electric Corp 半導体装置
JPS6015955A (ja) * 1983-07-08 1985-01-26 Hitachi Micro Comput Eng Ltd 半導体装置
JPS6053058A (ja) * 1983-09-02 1985-03-26 Hitachi Ltd 樹脂封止形素子およびその製造方法
JPS60257546A (ja) * 1984-06-04 1985-12-19 Mitsubishi Electric Corp 半導体装置及びその製造方法

Also Published As

Publication number Publication date
US4942456A (en) 1990-07-17
KR890004428A (ko) 1989-04-22
JPS6457739A (en) 1989-03-06
KR910003542B1 (ko) 1991-06-04

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees