JPH0518711B2 - - Google Patents

Info

Publication number
JPH0518711B2
JPH0518711B2 JP63190038A JP19003888A JPH0518711B2 JP H0518711 B2 JPH0518711 B2 JP H0518711B2 JP 63190038 A JP63190038 A JP 63190038A JP 19003888 A JP19003888 A JP 19003888A JP H0518711 B2 JPH0518711 B2 JP H0518711B2
Authority
JP
Japan
Prior art keywords
resin
laminate
phenolic resin
aluminum hydroxide
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63190038A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0239928A (ja
Inventor
Yukihiro Yamashita
Mitsutoshi Kamata
Masaru Ogata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Shin Kobe Electric Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery Co Ltd filed Critical Shin Kobe Electric Machinery Co Ltd
Priority to JP63190038A priority Critical patent/JPH0239928A/ja
Publication of JPH0239928A publication Critical patent/JPH0239928A/ja
Publication of JPH0518711B2 publication Critical patent/JPH0518711B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Laminated Bodies (AREA)
JP63190038A 1988-07-29 1988-07-29 フェノール樹脂積層板 Granted JPH0239928A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63190038A JPH0239928A (ja) 1988-07-29 1988-07-29 フェノール樹脂積層板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63190038A JPH0239928A (ja) 1988-07-29 1988-07-29 フェノール樹脂積層板

Publications (2)

Publication Number Publication Date
JPH0239928A JPH0239928A (ja) 1990-02-08
JPH0518711B2 true JPH0518711B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-03-12

Family

ID=16251326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63190038A Granted JPH0239928A (ja) 1988-07-29 1988-07-29 フェノール樹脂積層板

Country Status (1)

Country Link
JP (1) JPH0239928A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5614600A (en) * 1994-06-03 1997-03-25 Kashima Oil Co., Ltd. Fiber-reinforced resin plate and process for producing the same
DE4440491A1 (de) * 1994-11-12 1996-05-15 Basf Ag Brandschutzdecken aus Melamin-Formaldehyd-Harzfasern

Also Published As

Publication number Publication date
JPH0239928A (ja) 1990-02-08

Similar Documents

Publication Publication Date Title
JP3119577B2 (ja) 積層板
JPH0518711B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH02120330A (ja) 積層板の製造法
JPS60252620A (ja) 積層板用樹脂組成物
JPS63168439A (ja) 積層板用エポキシ樹脂組成物
JPS6365091B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH02150346A (ja) 積層板
JPS6364306B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP3179145B2 (ja) フェノール樹脂組成物
JPS5856994B2 (ja) 電気回路装置
JPS5857447B2 (ja) 積層板の製造方法
JPH042612B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0381141A (ja) 金属箔張り積層板の製造法
JPS62127325A (ja) 難燃性フエノ−ル樹脂系積層板の製造法
JPH0267310A (ja) 難燃性フェノール樹脂組成物および積層板
JPH058747B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0126373B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH01144427A (ja) 紙基材−難燃性フェノール樹脂積層板の製造法
JPH05185527A (ja) 積層板の製造方法
JPH0438770B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS61133263A (ja) 積層板用樹脂組成物
JPS63186745A (ja) 難燃性フエノ−ル樹脂積層板
JPH0236941A (ja) フェノール樹脂積層板およびその製造法
JPH0678472B2 (ja) 積層板用フエノ−ル樹脂組成物
JPH07157576A (ja) 積層板用樹脂組成物および積層板