JPH0514543Y2 - - Google Patents
Info
- Publication number
- JPH0514543Y2 JPH0514543Y2 JP8758586U JP8758586U JPH0514543Y2 JP H0514543 Y2 JPH0514543 Y2 JP H0514543Y2 JP 8758586 U JP8758586 U JP 8758586U JP 8758586 U JP8758586 U JP 8758586U JP H0514543 Y2 JPH0514543 Y2 JP H0514543Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- conductor
- board
- connection end
- reinforcing member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 claims description 23
- 230000003014 reinforcing effect Effects 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8758586U JPH0514543Y2 (fr) | 1986-06-09 | 1986-06-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8758586U JPH0514543Y2 (fr) | 1986-06-09 | 1986-06-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62199975U JPS62199975U (fr) | 1987-12-19 |
| JPH0514543Y2 true JPH0514543Y2 (fr) | 1993-04-19 |
Family
ID=30944935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8758586U Expired - Lifetime JPH0514543Y2 (fr) | 1986-06-09 | 1986-06-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0514543Y2 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6307871B2 (ja) * | 2013-12-24 | 2018-04-11 | 株式会社デンソー | 電子制御装置 |
-
1986
- 1986-06-09 JP JP8758586U patent/JPH0514543Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62199975U (fr) | 1987-12-19 |
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