JPH0513011Y2 - - Google Patents
Info
- Publication number
- JPH0513011Y2 JPH0513011Y2 JP1987123180U JP12318087U JPH0513011Y2 JP H0513011 Y2 JPH0513011 Y2 JP H0513011Y2 JP 1987123180 U JP1987123180 U JP 1987123180U JP 12318087 U JP12318087 U JP 12318087U JP H0513011 Y2 JPH0513011 Y2 JP H0513011Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- wire
- semiconductor chip
- bonding
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 239000004065 semiconductor Substances 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003223 protective agent Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987123180U JPH0513011Y2 (US07714131-20100511-C00038.png) | 1987-08-13 | 1987-08-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987123180U JPH0513011Y2 (US07714131-20100511-C00038.png) | 1987-08-13 | 1987-08-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6429885U JPS6429885U (US07714131-20100511-C00038.png) | 1989-02-22 |
| JPH0513011Y2 true JPH0513011Y2 (US07714131-20100511-C00038.png) | 1993-04-06 |
Family
ID=31371794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987123180U Expired - Lifetime JPH0513011Y2 (US07714131-20100511-C00038.png) | 1987-08-13 | 1987-08-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0513011Y2 (US07714131-20100511-C00038.png) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5629963B2 (US07714131-20100511-C00038.png) * | 1975-02-21 | 1981-07-11 | ||
| JPS58151039A (ja) * | 1982-03-04 | 1983-09-08 | Denki Kagaku Kogyo Kk | 混成集積回路基板 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5629963U (US07714131-20100511-C00038.png) * | 1979-08-15 | 1981-03-23 | ||
| JPS58118739U (ja) * | 1982-02-05 | 1983-08-13 | 富士電機株式会社 | ボンデイングブロツク |
-
1987
- 1987-08-13 JP JP1987123180U patent/JPH0513011Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5629963B2 (US07714131-20100511-C00038.png) * | 1975-02-21 | 1981-07-11 | ||
| JPS58151039A (ja) * | 1982-03-04 | 1983-09-08 | Denki Kagaku Kogyo Kk | 混成集積回路基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6429885U (US07714131-20100511-C00038.png) | 1989-02-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3060896B2 (ja) | バンプ電極の構造 | |
| JP2509027B2 (ja) | 半導体装置 | |
| JPH10294418A (ja) | 半導体装置 | |
| JP2569400B2 (ja) | 樹脂封止型半導体装置の製造方法 | |
| JPH0513011Y2 (US07714131-20100511-C00038.png) | ||
| JP2798108B2 (ja) | 混成集積回路装置 | |
| JP2651608B2 (ja) | 電子部品搭載用基板 | |
| JPH10189863A (ja) | 実装用基板 | |
| JPS6097654A (ja) | 封止型半導体装置 | |
| JP3297959B2 (ja) | 半導体装置 | |
| JP2953893B2 (ja) | プリント基板ジャンパー配線方法及びジャンパー配線用射出成形プリント基板 | |
| JP2830221B2 (ja) | ハイブリッド集積回路のマウント構造 | |
| JP3398556B2 (ja) | 半導体装置の製造方法 | |
| JP2774566B2 (ja) | 半導体装置のリードフレーム | |
| JP2000196004A (ja) | 半導体装置用リ―ドフレ―ム及びこれを用いた半導体装置 | |
| JP2822446B2 (ja) | 混成集積回路装置 | |
| JPH0214558A (ja) | 半導体集積回路装置 | |
| JPH0590984U (ja) | 印刷回路基板 | |
| JPS62169461A (ja) | 半導体装置 | |
| JPS5923432Y2 (ja) | 半導体装置 | |
| JPH05335437A (ja) | 半導体装置 | |
| JPS6242549A (ja) | 電子部品パツケ−ジ及びその製造方法 | |
| JPH042478Y2 (US07714131-20100511-C00038.png) | ||
| JPS603189A (ja) | リ−ド線の接続方法 | |
| JPH0380599A (ja) | 電子回路モジュール |
