JPH0512877B2 - - Google Patents

Info

Publication number
JPH0512877B2
JPH0512877B2 JP33016690A JP33016690A JPH0512877B2 JP H0512877 B2 JPH0512877 B2 JP H0512877B2 JP 33016690 A JP33016690 A JP 33016690A JP 33016690 A JP33016690 A JP 33016690A JP H0512877 B2 JPH0512877 B2 JP H0512877B2
Authority
JP
Japan
Prior art keywords
hole
heat sink
wiring board
printed wiring
clearance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP33016690A
Other languages
English (en)
Japanese (ja)
Other versions
JPH04206675A (ja
Inventor
Masaru Hanamori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Avionics Co Ltd
Original Assignee
Nippon Avionics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Avionics Co Ltd filed Critical Nippon Avionics Co Ltd
Priority to JP33016690A priority Critical patent/JPH04206675A/ja
Publication of JPH04206675A publication Critical patent/JPH04206675A/ja
Publication of JPH0512877B2 publication Critical patent/JPH0512877B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Structure Of Printed Boards (AREA)
JP33016690A 1990-11-30 1990-11-30 ヒートシンク付きプリント配線板 Granted JPH04206675A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33016690A JPH04206675A (ja) 1990-11-30 1990-11-30 ヒートシンク付きプリント配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33016690A JPH04206675A (ja) 1990-11-30 1990-11-30 ヒートシンク付きプリント配線板

Publications (2)

Publication Number Publication Date
JPH04206675A JPH04206675A (ja) 1992-07-28
JPH0512877B2 true JPH0512877B2 (enrdf_load_stackoverflow) 1993-02-19

Family

ID=18229558

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33016690A Granted JPH04206675A (ja) 1990-11-30 1990-11-30 ヒートシンク付きプリント配線板

Country Status (1)

Country Link
JP (1) JPH04206675A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2731690B2 (ja) * 1993-03-31 1998-03-25 ローム株式会社 プリント基板アッセンブリ及び該プリント基板アッセンブリを有する電子機器
DE19607014A1 (de) * 1996-02-24 1997-08-28 Bosch Gmbh Robert Verfahren zur Herstellung einer Verbundanordnung
CN108770238B (zh) * 2018-07-13 2021-07-06 深圳崇达多层线路板有限公司 一种改善钻孔扯铜的内层图形设计方法

Also Published As

Publication number Publication date
JPH04206675A (ja) 1992-07-28

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