JPH0510362Y2 - - Google Patents
Info
- Publication number
- JPH0510362Y2 JPH0510362Y2 JP1988123135U JP12313588U JPH0510362Y2 JP H0510362 Y2 JPH0510362 Y2 JP H0510362Y2 JP 1988123135 U JP1988123135 U JP 1988123135U JP 12313588 U JP12313588 U JP 12313588U JP H0510362 Y2 JPH0510362 Y2 JP H0510362Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- lead wire
- thin lead
- wire
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W72/90—
-
- H10W72/0711—
-
- H10W72/07141—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W72/5366—
-
- H10W72/5449—
-
- H10W72/59—
-
- H10W72/932—
-
- H10W90/753—
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988123135U JPH0510362Y2 (cg-RX-API-DMAC10.html) | 1988-09-19 | 1988-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988123135U JPH0510362Y2 (cg-RX-API-DMAC10.html) | 1988-09-19 | 1988-09-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0244331U JPH0244331U (cg-RX-API-DMAC10.html) | 1990-03-27 |
| JPH0510362Y2 true JPH0510362Y2 (cg-RX-API-DMAC10.html) | 1993-03-15 |
Family
ID=31371709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988123135U Expired - Lifetime JPH0510362Y2 (cg-RX-API-DMAC10.html) | 1988-09-19 | 1988-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0510362Y2 (cg-RX-API-DMAC10.html) |
-
1988
- 1988-09-19 JP JP1988123135U patent/JPH0510362Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0244331U (cg-RX-API-DMAC10.html) | 1990-03-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH05218127A (ja) | 半導体装置及びその製造方法 | |
| JPH0510362Y2 (cg-RX-API-DMAC10.html) | ||
| JPH10335366A (ja) | 半導体装置 | |
| JPH0817870A (ja) | 半導体装置 | |
| JPH04255237A (ja) | 半導体装置の製造方法 | |
| JPH10125710A (ja) | ワイヤボンディング方法 | |
| JP2004221264A (ja) | 半導体装置及びその製造方法 | |
| JPH0525236Y2 (cg-RX-API-DMAC10.html) | ||
| JPH06120406A (ja) | 半導体装置 | |
| JPS63152161A (ja) | 半導体装置 | |
| JPS61241954A (ja) | 半導体装置 | |
| JPS63215058A (ja) | 絶縁物封止型半導体装置 | |
| JPH0546271Y2 (cg-RX-API-DMAC10.html) | ||
| JPS5934148Y2 (ja) | 双方向性サイリスタ | |
| JPS5824442Y2 (ja) | 半導体装置 | |
| JPS6344991Y2 (cg-RX-API-DMAC10.html) | ||
| JPH06120287A (ja) | リードフレームを用いた半導体装置とその製造方法 | |
| JPH1126643A (ja) | 半導体装置 | |
| JPH0525237Y2 (cg-RX-API-DMAC10.html) | ||
| JPH09223767A (ja) | リードフレーム | |
| JP2941533B2 (ja) | 半導体チップのワイヤレスボンディング方法 | |
| JPH10199913A (ja) | ワイヤボンディング方法 | |
| JPH05251491A (ja) | ワイヤボンディング方法と半導体装置 | |
| JPH056839U (ja) | 半導体装置 | |
| JPH05152366A (ja) | 半導体装置およびその製造方法 |