JPH0498894A - Manufacture of ceramic multilayer wiring board - Google Patents

Abstract

PURPOSE:To prevent a via from falling off so as not to make it open and to restrain a via paste from being curved by the pressure of a hot press by a method wherein green sheets on which a conductor wiring is provided are laminated, which is thermocompressed into a laminate, and the laminate concerned is formed into a ceramic multilayer wiring board through two processes, a first process in which through-holes are provided and a second process in which conductor paste is filled into the through-holes. CONSTITUTION:A conductor wiring 2 is provided onto a ceramic green sheet 1. In a first process, the ceramic green sheets 1 are laminated, and the laminated sheets 1 are placed in a mold and thermocompressed into a ceramic laminate 3 by a hot press. At this point, as a via filling process is omitted, pressure is stably applied onto the laminated green sheets 3. In succession, through-holes 5 are provided to the ceramic laminate 3 by a drill 4. Next, conductor paste 7 is filled into the through-holes 5 bored by the drill 4 through a vacuum suction device 6. The conductor paste 7 is filled into the through-holes 5 depressurized by the vacuum suction device 6 to make vias filled.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a ceramic multilayer wiring board, and particularly to a method for manufacturing a ceramic multilayer wiring board manufactured by a green sheet method.

[Conventional technology]

The conventional manufacturing method for ceramic multilayer wiring boards is disclosed in Japanese Patent Application Laid-open No. 6
2-134997 etc., powders such as alumina and glass are mixed with a solvent to form a slurry, and this slurry is formed into a film by a slip casting method to form a green sheet,
Furthermore, the green sheet is cut into a predetermined shape, and through-holes are formed by punching to connect the upper and lower parts of the green sheet. Conductor pattern paste and via fill paste are filled into these through-holes by printing, and the green sheet is then cut into a predetermined shape. The method involved laminating a predetermined number of sheets, pressurizing/humidifying and thermocompression bonding, and then removing the binder/baking to produce a substrate.

[Problem to be solved by the invention]

The conventional method for manufacturing the ceramic multilayer wiring board described above is as follows:
After through-hole formation and via filling, the process of laminating and thermocompression bonding is used, so (1) vias are opened due to the conductor paste coming off before lamination, and (2) through-holes are removed because the conductor paste acts as a pillar. There are disadvantages such as the vias are curved, no pressure is applied to the green sheet itself, and the shrinkage rate varies.

[Means to solve the problem]

The method for manufacturing a ceramic multilayer wiring board of the present invention includes a first step of forming a laminate by laminating green sheets with conductor wiring and thermocompression bonding, and forming a through hole in the laminate with a drill; and a second step of filling the through hole with conductive paste using a vacuum suction machine.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

Fig. 1 is a diagram showing an example of laminating green sheets according to the method for manufacturing a ceramic multilayer wiring board according to an embodiment of the present invention, and Fig. 2 is an example of a laminate in which ceramic green sheets according to the present embodiment are laminated and bonded by thermocompression. FIG. 3 is a cross-sectional view showing a process of filling conductive paste into the through-holes of the laminate according to this embodiment.

In FIG. 1, a ceramic green sheet 1 is a sheet on which conductor wiring 2 is provided. In this embodiment, as a first step, the green sheets 1 are first stacked, placed in a mold, and bonded under heat using a hot press machine to form a ceramic laminate 3 shown in FIG. 2. At this time, since there is no via fill process, the pressure applied to the green sheet 1 itself can be stabilized.

Next, a through hole 5 is formed in the ceramic laminate 3 using a drill 4 shown in FIG.

Next, as shown in FIG. 3, the through holes 5 formed by the drill 4 are filled with conductive paste 7 using the vacuum suction machine 6. The conductive paste 7 is injected into the through-hole 5 portion which has been depressurized by the vacuum suction device 6 to perform via filling. Since suction is performed using a vacuum, there is no need for highly accurate positioning of the through hole 5, and via filling can be performed in one step.

After the above steps, the ceramic laminate 3 is fired to produce a ceramic multilayer wiring board.

〔Effect of the invention〕

As explained above, in the present invention, through-hole formation and via filling are performed after lamination and heat pressing, thereby preventing via opening due to via omission, bending of via paste due to heat press pressure, and preventing actual press pressure from being applied to the green sheet. This has the effect of eliminating the conventional drawback of variation in shrinkage rate.

[Brief explanation of the drawing]

Fig. 1 is a cross-sectional view showing an example of a laminate in which ceramic multi-layered structures according to an embodiment of the present invention are laminated and bonded by thermocompression, and Fig. 3 shows the filling of through-holes in the laminate according to this embodiment with conductive paste. It is a figure showing a process. 1... Green sheet, 2... Conductor wiring, 3...
Laminated body, 4... drill, 5... through hole, 6.
...Vacuum suction machine, 7...Conductor paste.

Claims (1)

[Claims] A first step of forming a laminate by laminating green sheets with conductor wiring and bonding them under heat, forming a through hole in the laminate using a drill, and applying pressure using a vacuum suction machine to form the through hole in the laminate. and a second step of filling with conductor paste.