JP2893116B2 - Manufacturing method of ceramic multilayer wiring board - Google Patents
Manufacturing method of ceramic multilayer wiring boardInfo
- Publication number
- JP2893116B2 JP2893116B2 JP25018189A JP25018189A JP2893116B2 JP 2893116 B2 JP2893116 B2 JP 2893116B2 JP 25018189 A JP25018189 A JP 25018189A JP 25018189 A JP25018189 A JP 25018189A JP 2893116 B2 JP2893116 B2 JP 2893116B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- wiring board
- multilayer wiring
- sheets
- green
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Producing Shaped Articles From Materials (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明はセラミック多層配線基板の製造方法に関し、
より詳細には半導体素子を収容する半導体素子収納用パ
ッケージや半導体素子、抵抗、コンデンサ等が搭載接続
される回路基板等に用いられるセラミック多層配線基板
の製造方法に関するものである。Description: TECHNICAL FIELD The present invention relates to a method for manufacturing a ceramic multilayer wiring board,
More particularly, the present invention relates to a method of manufacturing a ceramic multilayer wiring board used for a semiconductor element housing package for housing a semiconductor element, a circuit board on which a semiconductor element, a resistor, a capacitor, and the like are mounted and connected.
（従来の技術） 従来、半導体素子収納用パッケージや回路基板等に使
用されるセラミック多層配線基板はアルミナセラミック
ス等の電気絶縁材料より成る基体と該基体の表面及び内
部に埋設、焼付られているタングステン（Ｗ）、モリブ
デン（Mo）等の高融点金属より成る配線導体とにより構
成されている。2. Description of the Related Art Conventionally, a ceramic multilayer wiring board used for a package for accommodating a semiconductor element, a circuit board or the like has a base made of an electrically insulating material such as alumina ceramics and tungsten embedded and baked on the surface and inside of the base. (W), and a wiring conductor made of a high melting point metal such as molybdenum (Mo).
かかる従来のセラミック多層配線基板は通常、以下の
方法によって製作される。Such a conventional ceramic multilayer wiring board is usually manufactured by the following method.
即ち、 まず、アルミナ（Al2O3）等の電気絶縁性に優れたセ
ラミックス原料粉末に適当な有機溶剤、溶媒を添加混合
して泥漿状となすと共に、該泥漿物を従来周知のドクタ
ーブレード法を採用することによってシート状とし、複
数枚のセラミック生シートを得る。First, an appropriate organic solvent and a suitable solvent are added to a ceramic raw material powder such as alumina (Al 2 O 3 ) having excellent electrical insulation to form a slurry, and the slurry is subjected to a conventional doctor blade method. To obtain a plurality of green ceramic sheets.
次に前記各セラミック生シートに接続配線用のスルー
ホールを形成するとともに該スルーホール内及び上面に
タングステン（Ｗ）、モリブデン（Mo）等の高融点金属
から成る金属ペーストをスクリーン印刷法により印刷塗
布し所定パターンの配線用導体を被着させる。Next, through-holes for connection wiring are formed in each of the ceramic green sheets, and a metal paste made of a high melting point metal such as tungsten (W) or molybdenum (Mo) is printed and applied in the through-holes and on the upper surface by screen printing. Then, a wiring conductor having a predetermined pattern is adhered.
そして最後に前記各セラミック生シートを上下に積層
するとともに加圧して生積層体を得ると共に、該生積層
体を約1500℃の温度で焼成し、各セラミック生シートと
配線用導電層とを焼結一体化させることによって製品と
してのセラミック多層配線基板となる。Finally, the respective ceramic green sheets are vertically stacked and pressed to obtain a green laminate, and the green laminate is fired at a temperature of about 1500 ° C. to fire each ceramic green sheet and the conductive layer for wiring. By bonding and integrating, a ceramic multilayer wiring board as a product is obtained.
（発明が解決しようとする課題） しかし乍ら、この従来のセラミック多層配線基板の製
造方法によれば複数枚のセラミック生シートを積層し、
生積層体を得る際、各セラミック生シート間に空気が抱
き込まれ、これが焼成時に膨張してセラミック多層配線
基板に大きな膨れを形成し、該膨れがセラミック多層配
線基板の配線導体を断線させたり外観不良を起こしたり
するという欠点を有していた。(Problems to be Solved by the Invention) However, according to the conventional method for manufacturing a ceramic multilayer wiring board, a plurality of ceramic green sheets are laminated,
When obtaining a green laminate, air is entrapped between the ceramic green sheets, which expands during firing to form large swells in the ceramic multilayer wiring board, and the swells may break the wiring conductors of the ceramic multilayer wiring board. It has the drawback of causing poor appearance.
（発明の目的） 本発明は上記欠点に鑑み案出されたもので、その目的
は空気の抱き込みに起因する膨れの発生を極小とし、配
線導体の断線及び外観不良の発生を皆無としたセラミッ
ク多層配線基板の製造方法を提供することにある。(Object of the Invention) The present invention has been devised in view of the above-mentioned drawbacks, and an object of the present invention is to minimize the occurrence of swelling due to air entrapment and to eliminate the occurrence of disconnection of wiring conductors and appearance defects. An object of the present invention is to provide a method for manufacturing a multilayer wiring board.
（課題を解決するための手段） 本発明は上面に配線用導体を有し、厚み方向に空気抜
き用の貫通孔を有するセラミック生シートを複数枚、積
層して生積層体を得ると共に、該生積層体を加圧し、セ
ラミック生シート間に介在する空気を前記貫通孔を介し
て外部に導出させ、しかる後、前記生積層体を焼成し、
焼結一体化させることを特徴とするものである。(Means for Solving the Problems) The present invention provides a green laminate by laminating a plurality of ceramic green sheets each having a wiring conductor on an upper surface and having a through hole for air release in a thickness direction. Press the laminate, let the air intervening between the ceramic raw sheets to the outside through the through-hole, and then fire the green laminate,
It is characterized by being integrated by sintering.
（実施例） 次ぎに本発明のセラミック多層配線基板の製造方法を
第１図に示す実施例に基づき詳細に説明する。Example Next, a method for manufacturing a ceramic multilayer wiring board according to the present invention will be described in detail with reference to an example shown in FIG.
まず第１図（ａ）に示す如く２枚のセラミック生シー
トを1a,1bを製作する。First, two ceramic green sheets 1a and 1b are manufactured as shown in FIG.
前記セラミック生シート1a,1bは、例えばアルミナ（A
l2O3）、シリカ（SiO2）等のセラミック原料粉末に適当
な有機溶剤、溶媒を添加混合して泥漿物を作り、これを
従来周知のドクターブレード法等によりシート状となす
ことによって形成される。The ceramic raw sheets 1a and 1b are made of, for example, alumina (A
l 2 O 3 ), silica (SiO 2 ) and other ceramic raw material powders are mixed with an appropriate organic solvent and solvent to form a slurry, which is formed into a sheet by a well-known doctor blade method or the like. Is done.
また前記セラミック生シート1a,1bはその夫々の厚み
方向に空気抜き用の貫通孔2a,2bが形成されており、更
にセラミック生シート1aには接続用導体を充填するため
のスルーホール3aが形成されている。The ceramic raw sheets 1a and 1b are provided with through holes 2a and 2b for venting air in their respective thickness directions, and the ceramic raw sheets 1a are further formed with through holes 3a for filling connection conductors. ing.
前記空気抜き用貫通孔2a,2bは後述するセラミック生
シート1a,1bを重ね、生積層体とする際、セラミック生
シート1a,1b間に介在する空気を外部に導出する作用を
為し、その孔径は空気の導出が容易な大きさ、具体的に
は0.5〜1.5mmの径に形成される。The air vent through-holes 2a, 2b serve to guide the air interposed between the ceramic green sheets 1a, 1b to the outside when stacking the green ceramic sheets 1a, 1b, which will be described later, to form a green laminate. Is formed in such a size that air can be easily led out, specifically, a diameter of 0.5 to 1.5 mm.
また前記スルーホール3aはその内部に接続用導体とな
る金属ペーストが充填され、その孔径は金属ペーストの
流入が容易な大きさ、具体的には0.15〜0.35mmの大きさ
となっている。The inside of the through hole 3a is filled with a metal paste serving as a connection conductor, and the hole diameter is a size that allows the metal paste to easily flow in, specifically, a size of 0.15 to 0.35 mm.
尚、前記空気抜き用貫通孔2a,2b及びスルーホール3a
は従来周知の打ち抜き加工法によりセラミック生シート
1a,1bに所定孔径に形成される。In addition, the through holes 2a, 2b for air release and the through holes 3a
Is a ceramic raw sheet by a well-known stamping method
A predetermined hole diameter is formed in 1a and 1b.
次に第１図（ｂ）に示す如く、前記各セラミック生シ
ート1a,1bの上面に配線用の導体4a,4bを被着する。Next, as shown in FIG. 1 (b), conductors 4a and 4b for wiring are attached to the upper surface of each of the raw ceramic sheets 1a and 1b.
前記配線用の導体4a,4bはタングステン（Ｗ）、モリ
ブデン（Mo）、マンガン（Mn）等の高融点金属より成
り、該高融点金属粉末に適当な有機溶剤、溶媒を添加混
合して得た金属ペーストをスクリーン印刷等の厚膜手法
を採用することによってセラミック生シート1a,1b上面
に印刷塗布される。The wiring conductors 4a and 4b are made of a high melting point metal such as tungsten (W), molybdenum (Mo), and manganese (Mn), and are obtained by adding a suitable organic solvent and a solvent to the high melting point metal powder. The metal paste is printed and applied on the upper surfaces of the ceramic raw sheets 1a and 1b by employing a thick film technique such as screen printing.
また、セラミック生シート1aの上面に金属ペーストを
印刷塗布する際、セラミック生シート1aに設けたスルー
ホール3a内にも金属ペーストが充填され、これが接続用
導体4cとなる。When the metal paste is printed on the upper surface of the ceramic raw sheet 1a, the metal paste is also filled in the through holes 3a provided in the ceramic raw sheet 1a, and this becomes the connection conductor 4c.
次に第１図（ｃ）に示すセラミック生シート1bの上に
セラミック生シート1aを重ねて生積層体とし、これによ
ってセラミック生シート1aの上面に設けた配線用導体4a
とセラミック生シート1bの上面に設けた配線用導体4bと
を接続用導体4cを介して電気的に接続する。Next, the green ceramic sheet 1a is superimposed on the green ceramic sheet 1b shown in FIG. 1 (c) to form a green laminate, whereby the wiring conductors 4a provided on the upper surface of the green ceramic sheet 1a are formed.
And the wiring conductor 4b provided on the upper surface of the ceramic raw sheet 1b are electrically connected via the connection conductor 4c.
また前記セラミック生シート1a,1bは積層され、生積
層体となされた後、50〜150Kg/cm2の圧力で加圧され、
これによってセラミック生シート1aと1bとは密着性を大
として接合する。Also, the ceramic green sheets 1a, 1b are stacked, after being made raw laminate is pressurized at a pressure of 50~150Kg / cm 2,
As a result, the ceramic raw sheets 1a and 1b are joined together with high adhesion.
尚、この場合、各セラミック生シート1a,1bには空気
抜き用の貫通孔2a,2bが形成されているためセラミック
生シート1aと1bの間に介在する空気は前記貫通孔2a,2b
を介して外部に導出されセラミック生シート1a,1b間に
空気を抱き込むことはない。In this case, since the through holes 2a and 2b for venting air are formed in each of the raw ceramic sheets 1a and 1b, the air interposed between the raw ceramic sheets 1a and 1b is removed by the through holes 2a and 2b.
And is not led out to the outside through the ceramic raw sheets 1a and 1b.
また前記生積層体を加圧する際、セラミック生シート
1a,1bの温度を50〜100℃としておくとセラミック生シー
ト1a,1bの密着性をより優れたものとなすことができ、
生積層体を加圧する際にはセラミック生シート1a,1bを5
0〜100℃の温度に加圧しておくことが好ましい。When pressing the green laminate, a ceramic green sheet
If the temperature of 1a, 1b is set to 50 to 100 ° C., the adhesion of the ceramic raw sheets 1a, 1b can be made more excellent,
When pressing the green laminate, the ceramic green sheets 1a and 1b
It is preferable to pressurize to a temperature of 0 to 100 ° C.
次に、前記加圧された生積層体は還元雰囲気中、約15
00℃の温度で焼成され、セラミック生シート1a,1bと配
線用導体4a,4b及び接続用導体4cとを焼結一体化させる
ことによってセラミック多層配線基板が完成する。Next, the pressed green laminate is placed in a reducing atmosphere for about 15 minutes.
It is fired at a temperature of 00 ° C., and the ceramic green sheets 1a and 1b are sintered and integrated with the wiring conductors 4a and 4b and the connection conductor 4c to complete the ceramic multilayer wiring board.
尚、前記生積層体を焼成しセラミック多層配線基板と
する際、生積層体を構成するセラミック生シート1a,1b
間には空気の抱き込みがないことから該抱き込まれた空
気の膨張によってセラミック多層配線基板に膨れが発生
することは一切なく、これによって配線用導体4a,4bに
断線が生じたり外観不良が発生したりすることは皆無と
なる。When firing the green laminate to form a ceramic multilayer wiring board, the ceramic green sheets 1a and 1b constituting the green laminate are used.
Since no air is entrapped in between, the swelling of the air does not cause any swelling of the ceramic multilayer wiring board, thereby causing disconnection of the wiring conductors 4a and 4b and poor appearance. And nothing will happen.
また本発明は上述の実施例に限定されるものではな
く、本発明の要旨を逸脱しない範囲であれば種々の変更
は可能であり、例えばセラミック生シートを３枚以上重
ねてセラミック多層配線基板としてもよい。この場合、
セラミック生シートを一枚重ねるたびに所定圧力で加圧
し、重ねたセラミック生シートとその下部にあるセラミ
ック生シートとの間に介在する空気を重ねたセラミック
生シートの貫通孔を介して導出させれば全てのセラミッ
ク生シート間に空気を抱き込むことはない。Further, the present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the gist of the present invention. For example, three or more ceramic green sheets are stacked to form a ceramic multilayer wiring board. Is also good. in this case,
Each time one ceramic green sheet is stacked, it is pressurized at a predetermined pressure, and the air interposed between the stacked ceramic green sheet and the ceramic green sheet below it is led out through the through hole of the stacked ceramic green sheet. No air is trapped between all the raw ceramic sheets.
（発明の効果） 本発明のセラミック多層配線基板の製造方法によれば
配線用導体を有するセラミック生シートに空気抜き用の
貫通孔を設けたことから該セラミック生シートを複数枚
積層しても各セラミック生シート間に空気を抱き込むこ
とは一切なく、抱き込まれた空気の膨張によってセラミ
ック多層配線基板に膨れが発生するのを皆無となして配
線用導体の断線及び外観不良の発生を有効に防止するこ
とが可能となる。(Effect of the Invention) According to the method for manufacturing a ceramic multilayer wiring board of the present invention, a through-hole for venting air is provided in a ceramic green sheet having a wiring conductor. There is no air trapped between the raw sheets, and the expansion of the trapped air eliminates any swelling of the ceramic multilayer wiring board, effectively preventing the disconnection of the wiring conductor and the appearance defect. It is possible to do.
第１図（ａ）（ｂ）（ｃ）は本発明のセラミック多層配
線基板の製造方法を説明するための各工程毎の断面図で
ある。 1a,1b……セラミック生シート 2a……空気抜き用貫通孔 4a,4b……配線用導体FIGS. 1 (a), 1 (b) and 1 (c) are cross-sectional views for explaining each step of a method for manufacturing a ceramic multilayer wiring board according to the present invention. 1a, 1b: Ceramic raw sheet 2a: Air vent through hole 4a, 4b: Wiring conductor
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) B28B 11/02 H01L 21/72 B28B 1/16 H05K 3/46 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 6 , DB name) B28B 11/02 H01L 21/72 B28B 1/16 H05K 3/46
Claims (1)
体が充填された0.15〜0.35mmのスルーホールと0.5〜1.5
mmの空気抜き用の貫通孔を有するセラミック生シートを
複数枚、積層して生積層体を得ると共に、該生積層体を
50〜100℃に加熱しつつ加圧し、セラミック生シート間
に介在する空気を前記貫通孔を介して外部に導出させ、
しかる後、前記生積層体を焼成し、焼結一体化させるこ
とを特徴とするセラミック多層配線基板の製造方法。1. A wiring conductor on the upper surface, a through hole of 0.15 to 0.35 mm filled with a connecting conductor in the thickness direction, and a wiring conductor of 0.5 to 1.5 mm.
While obtaining a green laminate by stacking a plurality of ceramic raw sheets having through holes for air release of mm,
Pressurizing while heating to 50 to 100 ° C., let air intervening between the ceramic raw sheets be led out through the through holes,
Thereafter, the green laminate is fired and sintered and integrated to produce a ceramic multilayer wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25018189A JP2893116B2 (en) | 1989-09-26 | 1989-09-26 | Manufacturing method of ceramic multilayer wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25018189A JP2893116B2 (en) | 1989-09-26 | 1989-09-26 | Manufacturing method of ceramic multilayer wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03112606A JPH03112606A (en) | 1991-05-14 |
| JP2893116B2 true JP2893116B2 (en) | 1999-05-17 |
Family
ID=17204023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25018189A Expired - Lifetime JP2893116B2 (en) | 1989-09-26 | 1989-09-26 | Manufacturing method of ceramic multilayer wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2893116B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100818461B1 (en) * | 2006-09-19 | 2008-04-01 | 삼성전기주식회사 | Multi-layer ceramic substrate and method of manufacturing the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113543493B (en) * | 2021-07-12 | 2023-05-09 | 上海嘉捷通电路科技股份有限公司 | Preparation method of Z-direction interconnection printed circuit board |
-
1989
- 1989-09-26 JP JP25018189A patent/JP2893116B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100818461B1 (en) * | 2006-09-19 | 2008-04-01 | 삼성전기주식회사 | Multi-layer ceramic substrate and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03112606A (en) | 1991-05-14 |
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