JP2861406B2 - Manufacturing method of ceramic multilayer wiring board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a ceramic multilayer wiring board, and more particularly to a method of manufacturing a ceramic multilayer wiring board manufactured by a green sheet method.

[0002]

2. Description of the Related Art A conventional method of manufacturing a ceramic substrate is disclosed in Japanese Patent Application Laid-Open No. 62-134997, in which powder such as alumina or glass is mixed with a solvent to obtain mud purple, and this mud is slip-cast. A green sheet is formed by a method, and this is cut into a predetermined shape. Then, a through hole for connecting the upper and lower sides of the green sheet is formed by punching, and a conductor pattern paste and a via fill paste are embedded in the through hole by a printing method.
Further, a predetermined number of the green sheets are laminated, pressurized and heated and pressed, and then debinding and firing are performed.

[0003]

[SUMMARY OF THE INVENTION The method of manufacturing a conventional ceramic multilayer wiring base provisional described above, since the performing Suruho Le shaped formation, via fill process, 1. 1. Through-hole leakage 2. Avi open due to missing conductor base before lamination. Since the conductive paste acts as a pillar, the via holes are curved, the green sheet itself is not pressed, and the shrinkage ratio varies.

[0004]

Means for Solving the Problems The present invention, the green sheet circuit Bataan is formed by laminating a plurality, which was thermocompression bonding to form a laminate, between predetermined said circuit pattern
Ceramic multilayer wiring made by inserting conductive pins and conducting
The method of manufacturing a group slope is configured to include a first step of heating the laminated body, and a second step to insert the conductor pins heated pressurized.

[0005]

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view showing an embodiment of the present invention.

[0007] FIG. 2 is a perspective view showing an <br/> example of a laminated green sheet of the present embodiment. 1 and 2, a green sheet 1 is a sheet provided with a conductor wiring 2, and a plurality of the green sheets 1 are laminated and thermocompressed by a hot press machine to form a laminate 3. At this time, there is no through-hole formation step because there is no through-hole formation step. Further, since there is no via-filling step, the pressure applied to the green sheet 1 itself can be stabilized. Then, the conductor pins 4 are inserted into the laminate. At this time, since the conductor pins are heated to a high temperature in advance and the laminate is also heated in the same manner, the pins can be easily inserted.

After the above steps, the excess conductor pins 4 protruding up and down are cut, and the laminate 3 is subjected to binder removal and firing.

[0009]

As described above, according to the present invention, there is no need to form a through hole and to fill a via hole by inserting a conductor pin after lamination and thermocompression bonding. for that reason,
Since the press pressure is not applied to the green sheet due to the formation of through holes, via holes missing, via openings, and via paste curvature, there is an effect of eliminating problems such as variations in shrinkage.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.

FIG. 2 is a perspective view showing an example of lamination of green sheets of the present embodiment.

[Explanation of symbols]

 1 green sheet 2 conductor wiring 3 laminate 4 conductor pin

Claims (1)

(57) [Claims] 1. A green sheet on which a circuit pattern is formed is laminated in plural, and the green sheets are thermocompression-bonded to form a laminate .
Conductive pins are inserted between the predetermined circuit patterns to
In the method for manufacturing a ceramic multilayer wiring base slope,
The first step and the ceramic multilayer wiring base slope method for producing comprising a second step to insert the conductor pins hot pressurized heating said laminate.