JPH0492633U - - Google Patents

Info

Publication number
JPH0492633U
JPH0492633U JP1990406312U JP40631290U JPH0492633U JP H0492633 U JPH0492633 U JP H0492633U JP 1990406312 U JP1990406312 U JP 1990406312U JP 40631290 U JP40631290 U JP 40631290U JP H0492633 U JPH0492633 U JP H0492633U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990406312U
Other versions
JPH071796Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990406312U priority Critical patent/JPH071796Y2/ja
Priority to KR1019910023959A priority patent/KR920013638A/ko
Priority to US07/815,323 priority patent/US5191908A/en
Publication of JPH0492633U publication Critical patent/JPH0492633U/ja
Application granted granted Critical
Publication of JPH071796Y2 publication Critical patent/JPH071796Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
JP1990406312U 1990-12-28 1990-12-28 浸漬型基板処理装置 Expired - Lifetime JPH071796Y2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1990406312U JPH071796Y2 (ja) 1990-12-28 1990-12-28 浸漬型基板処理装置
KR1019910023959A KR920013638A (ko) 1990-12-28 1991-12-23 침지형 기판처리 장치
US07/815,323 US5191908A (en) 1990-12-28 1991-12-27 Dipping type surface treatment apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990406312U JPH071796Y2 (ja) 1990-12-28 1990-12-28 浸漬型基板処理装置

Publications (2)

Publication Number Publication Date
JPH0492633U true JPH0492633U (ja) 1992-08-12
JPH071796Y2 JPH071796Y2 (ja) 1995-01-18

Family

ID=18515925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990406312U Expired - Lifetime JPH071796Y2 (ja) 1990-12-28 1990-12-28 浸漬型基板処理装置

Country Status (3)

Country Link
US (1) US5191908A (ja)
JP (1) JPH071796Y2 (ja)
KR (1) KR920013638A (ja)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3225441B2 (ja) * 1991-04-23 2001-11-05 東京エレクトロン株式会社 処理装置
JP2804210B2 (ja) * 1992-01-22 1998-09-24 ジャパン・フィールド株式会社 洗浄装置
JP3110218B2 (ja) * 1992-09-25 2000-11-20 三菱電機株式会社 半導体洗浄装置及び方法、ウエハカセット、専用グローブ並びにウエハ受け治具
JP3142195B2 (ja) * 1993-07-20 2001-03-07 大日本スクリーン製造株式会社 薬液供給装置
US5402807A (en) * 1993-07-21 1995-04-04 Moore; David R. Multi-modular device for wet-processing integrated circuits
JP2894535B2 (ja) * 1994-01-18 1999-05-24 信越半導体株式会社 ウェーハホルダー
US5531236A (en) * 1994-06-01 1996-07-02 Kempka; Steven N. Directed flow fluid rinse trough
US5772784A (en) * 1994-11-14 1998-06-30 Yieldup International Ultra-low particle semiconductor cleaner
US5746234A (en) * 1994-11-18 1998-05-05 Advanced Chemill Systems Method and apparatus for cleaning thin substrates
US5720813A (en) 1995-06-07 1998-02-24 Eamon P. McDonald Thin sheet handling system
TW333658B (en) * 1996-05-30 1998-06-11 Tokyo Electron Co Ltd The substrate processing method and substrate processing system
JPH10223585A (ja) 1997-02-04 1998-08-21 Canon Inc ウェハ処理装置及びその方法並びにｓｏｉウェハの製造方法
US6391067B2 (en) 1997-02-04 2002-05-21 Canon Kabushiki Kaisha Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus
US6068002A (en) 1997-04-02 2000-05-30 Tokyo Electron Limited Cleaning and drying apparatus, wafer processing system and wafer processing method
JPH1126423A (ja) * 1997-07-09 1999-01-29 Sugai:Kk 半導体ウエハ等の処理方法並びにその処理装置
US6695926B1 (en) * 1997-07-09 2004-02-24 Ses Co., Ltd. Treatment method of semiconductor wafers and the like and treatment system for the same
KR100707107B1 (ko) * 1997-07-17 2007-12-27 동경 엘렉트론 주식회사 세정.건조처리방법및장치
DE59908053D1 (de) * 1998-04-06 2004-01-29 Koerner Chemieanlagen Eingehauste Beizanlage
US6532975B1 (en) * 1999-08-13 2003-03-18 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
JP3212981B1 (ja) * 2000-05-01 2001-09-25 正則 茂木 弁の開閉位置出力装置
JP4100466B2 (ja) * 2000-12-25 2008-06-11 東京エレクトロン株式会社 液処理装置
US20050209721A1 (en) * 2003-11-06 2005-09-22 Applied Materials, Inc. Methods and apparatus for enhanced operation of substrate carrier handlers
US7720557B2 (en) 2003-11-06 2010-05-18 Applied Materials, Inc. Methods and apparatus for enhanced operation of substrate carrier handlers
US7218983B2 (en) * 2003-11-06 2007-05-15 Applied Materials, Inc. Method and apparatus for integrating large and small lot electronic device fabrication facilities
US8635784B2 (en) * 2005-10-04 2014-01-28 Applied Materials, Inc. Methods and apparatus for drying a substrate
JP5063138B2 (ja) * 2007-02-23 2012-10-31 株式会社Ｓｏｋｕｄｏ 基板現像方法および現像装置
JP5806811B2 (ja) * 2010-10-01 2015-11-10 株式会社日立国際電気 基板処理装置、基板処理方法および半導体装置の製造方法
AT15316U1 (de) * 2011-09-12 2017-06-15 Tms Transport- Und Montagesysteme Gmbh Reinigungsmaschine zum Reinigen industriell gefertigter Bauteile
DE102018105966A1 (de) * 2018-03-15 2019-09-19 Schaeffler Technologies AG & Co. KG Anlage und Verfahren zum Behandeln einer Oberfläche mindestens eines großformatigen Bauteils
US11194259B2 (en) * 2018-08-30 2021-12-07 Taiwan Semiconductor Manufacturing Co., Ltd. Equipment module with enhanced protection from airborne contaminants, and method of operation

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5181467A (ja) * 1975-01-10 1976-07-16 Hitachi Ltd Senjoso
JPS6085529A (ja) * 1983-10-17 1985-05-15 Mitsubishi Electric Corp 半導体ウエ−ハ薬液処理装置
JPS62198122A (ja) * 1986-02-26 1987-09-01 Hitachi Ltd 半導体処理装置
JPS63248449A (ja) * 1987-04-03 1988-10-14 Tadahiro Omi ドラフトチヤンバ
JPH01226157A (ja) * 1988-03-07 1989-09-08 Kyushu Electron Metal Co Ltd 半導体基板の乾燥方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2181177A (en) * 1937-05-26 1939-11-28 Howard C Davis Process of deposition
US3893869A (en) * 1974-05-31 1975-07-08 Rca Corp Megasonic cleaning system
GB2018831A (en) * 1978-03-30 1979-10-24 Price Bros Ltd Improvements in cleaning equipment
JPS6014244A (ja) * 1983-07-06 1985-01-24 Fujitsu Ltd マスク洗浄装置
US4520834A (en) * 1983-11-08 1985-06-04 Dicicco Paolo S Apparatus for processing articles in a series of process solution containers
US4839979A (en) * 1987-07-13 1989-06-20 Sea Search, Inc. Spear gun tip assembly and method of use thereof
JPH01238022A (ja) * 1988-03-17 1989-09-22 Marine Instr Co Ltd 半導体処理装置
JPH01261829A (ja) * 1988-04-13 1989-10-18 Sumitomo Electric Ind Ltd 有機金属気相エピタキシー用基板の前処理方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5181467A (ja) * 1975-01-10 1976-07-16 Hitachi Ltd Senjoso
JPS6085529A (ja) * 1983-10-17 1985-05-15 Mitsubishi Electric Corp 半導体ウエ−ハ薬液処理装置
JPS62198122A (ja) * 1986-02-26 1987-09-01 Hitachi Ltd 半導体処理装置
JPS63248449A (ja) * 1987-04-03 1988-10-14 Tadahiro Omi ドラフトチヤンバ
JPH01226157A (ja) * 1988-03-07 1989-09-08 Kyushu Electron Metal Co Ltd 半導体基板の乾燥方法

Also Published As

Publication number Publication date
JPH071796Y2 (ja) 1995-01-18
KR920013638A (ko) 1992-07-29
US5191908A (en) 1993-03-09

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term