JPH048617Y2 - - Google Patents
Info
- Publication number
- JPH048617Y2 JPH048617Y2 JP2478385U JP2478385U JPH048617Y2 JP H048617 Y2 JPH048617 Y2 JP H048617Y2 JP 2478385 U JP2478385 U JP 2478385U JP 2478385 U JP2478385 U JP 2478385U JP H048617 Y2 JPH048617 Y2 JP H048617Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- frame
- circuit board
- twisted
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011888 foil Substances 0.000 claims description 15
- 238000005476 soldering Methods 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2478385U JPH048617Y2 (en, 2012) | 1985-02-25 | 1985-02-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2478385U JPH048617Y2 (en, 2012) | 1985-02-25 | 1985-02-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61141773U JPS61141773U (en, 2012) | 1986-09-02 |
JPH048617Y2 true JPH048617Y2 (en, 2012) | 1992-03-04 |
Family
ID=30519261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2478385U Expired JPH048617Y2 (en, 2012) | 1985-02-25 | 1985-02-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH048617Y2 (en, 2012) |
-
1985
- 1985-02-25 JP JP2478385U patent/JPH048617Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS61141773U (en, 2012) | 1986-09-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6295726B1 (en) | Method of manufacturing surface-mountable SIL hybrid circuit | |
JPH048617Y2 (en, 2012) | ||
JP2531600Y2 (ja) | 基板接続用コネクタ | |
JPH0349415Y2 (en, 2012) | ||
JPS593499Y2 (ja) | プリント基板の導通端子構造 | |
JPH0319241Y2 (en, 2012) | ||
JPS5939418Y2 (ja) | 回路基板装置 | |
JPH0638470Y2 (ja) | 測定端子の取付構造 | |
JPS6330126Y2 (en, 2012) | ||
JPH0126154Y2 (en, 2012) | ||
JP2679365B2 (ja) | 表裏箔接続部品 | |
JP2584115B2 (ja) | パワー回路配線用プリント基板 | |
JP2937151B2 (ja) | 表面実装部品用グランドケース及び半導体装置 | |
JPH10163593A (ja) | プリント基板のアース方法 | |
JPH0430785Y2 (en, 2012) | ||
JPH0311815Y2 (en, 2012) | ||
JP2797849B2 (ja) | サーフェイスマウント用コネクタ | |
EP0303370A3 (en) | Circuit board component spacer | |
JP2643487B2 (ja) | 表面実装用のコンデンサ | |
JPH06302933A (ja) | チップ部品の実装構造 | |
JPS6361796B2 (en, 2012) | ||
JPS63158770A (ja) | ジヤツク取付装置 | |
JPH0545916U (ja) | プリント配線板の中継端子実装装置 | |
JPH0656977U (ja) | 基板用コネクタ | |
JPS6163092A (ja) | プリント基板への部品接続装置 |