JPH0482080B2 - - Google Patents

Info

Publication number
JPH0482080B2
JPH0482080B2 JP60093653A JP9365385A JPH0482080B2 JP H0482080 B2 JPH0482080 B2 JP H0482080B2 JP 60093653 A JP60093653 A JP 60093653A JP 9365385 A JP9365385 A JP 9365385A JP H0482080 B2 JPH0482080 B2 JP H0482080B2
Authority
JP
Japan
Prior art keywords
forming
metal
wiring board
melting point
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60093653A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61252699A (ja
Inventor
Osamu Myazawa
Akira Tomizawa
Ataru Yokono
Minoru Tanaka
Akira Murata
Fusaji Shoji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9365385A priority Critical patent/JPS61252699A/ja
Publication of JPS61252699A publication Critical patent/JPS61252699A/ja
Publication of JPH0482080B2 publication Critical patent/JPH0482080B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP9365385A 1985-05-02 1985-05-02 多層配線板の製造方法 Granted JPS61252699A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9365385A JPS61252699A (ja) 1985-05-02 1985-05-02 多層配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9365385A JPS61252699A (ja) 1985-05-02 1985-05-02 多層配線板の製造方法

Publications (2)

Publication Number Publication Date
JPS61252699A JPS61252699A (ja) 1986-11-10
JPH0482080B2 true JPH0482080B2 (en, 2012) 1992-12-25

Family

ID=14088337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9365385A Granted JPS61252699A (ja) 1985-05-02 1985-05-02 多層配線板の製造方法

Country Status (1)

Country Link
JP (1) JPS61252699A (en, 2012)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5028662A (en, 2012) * 1973-07-17 1975-03-24
JPS5633174Y2 (en, 2012) * 1973-07-17 1981-08-06
JPS5347927B2 (en, 2012) * 1973-06-08 1978-12-25
JPS544375A (en) * 1977-06-13 1979-01-13 Suwa Seikosha Kk Circuit substrate
JPS5446376A (en) * 1977-09-20 1979-04-12 Fujitsu Ltd Method of manufacturing multilayer printed board
JPS56150897A (en) * 1980-04-23 1981-11-21 Fujitsu Ltd Method of manufacturing multilayer printed board
JPS57109392A (en) * 1980-12-26 1982-07-07 Suwa Seikosha Kk Circuit mounting substrate
JPS58143559A (ja) * 1982-02-19 1983-08-26 Matsushita Electric Ind Co Ltd 多層構造半導体集積回路装置およびその製造方法

Also Published As

Publication number Publication date
JPS61252699A (ja) 1986-11-10

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