JPH0479476U - - Google Patents
Info
- Publication number
- JPH0479476U JPH0479476U JP12131790U JP12131790U JPH0479476U JP H0479476 U JPH0479476 U JP H0479476U JP 12131790 U JP12131790 U JP 12131790U JP 12131790 U JP12131790 U JP 12131790U JP H0479476 U JPH0479476 U JP H0479476U
- Authority
- JP
- Japan
- Prior art keywords
- thickness
- resin layer
- insulating resin
- vicinity
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 239000011295 pitch Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 4
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の配線基板の断面図、第２図は
半田マスクセツト状態を示す狭ピツチ部の拡大断
面図、第３図は、広いピツチ部の拡大断面図、第
４図は狭ピツチ部の半田印刷状態を示す拡大断面
図、第５図は広いピツチ部の半田印刷状態を示す
拡大断面図である。
１……絶縁基板、２……ランド、３……ソルダ
レジスト層、５……半田マスク。
Fig. 1 is a sectional view of the wiring board of the present invention, Fig. 2 is an enlarged sectional view of the narrow pitch part showing the solder mask set state, Fig. 3 is an enlarged sectional view of the wide pitch part, and Fig. 4 is an enlarged sectional view of the narrow pitch part. FIG. 5 is an enlarged sectional view showing the state of solder printing on a wide pitch portion. 1... Insulating substrate, 2... Land, 3... Solder resist layer, 5... Solder mask.
Claims (1)
リーン印刷法により半田印刷を行なう方式の配線
基板において、絶縁樹脂層の厚さを場所によつて
変えたことを特徴とする配線基板。 ２ 請求項第１項において、狭いランドピツチ部
や小さいランド部近辺は絶縁樹脂層の厚さをうす
く、広いランドピツチ部や大きいランド部近辺は
絶縁樹脂層の厚さを厚くしたことを特徴とする配
線基板。[Claims for Utility Model Registration] 1. A wiring board on which electronic components are mounted, which is solder-printed using a screen printing method, characterized in that the thickness of the insulating resin layer is varied depending on the location. wiring board. 2. The wiring according to claim 1, characterized in that the thickness of the insulating resin layer is thinner in the vicinity of narrow land pitches and small lands, and the thickness of the insulating resin layer is thicker in the vicinity of wide land pitches and large lands. substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12131790U JPH0479476U (en) | 1990-11-21 | 1990-11-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12131790U JPH0479476U (en) | 1990-11-21 | 1990-11-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0479476U true JPH0479476U (en) | 1992-07-10 |
Family
ID=31869177
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12131790U Pending JPH0479476U (en) | 1990-11-21 | 1990-11-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0479476U (en) |
-
1990
- 1990-11-21 JP JP12131790U patent/JPH0479476U/ja active Pending