JPH0479466U - - Google Patents
Info
- Publication number
- JPH0479466U JPH0479466U JP12201590U JP12201590U JPH0479466U JP H0479466 U JPH0479466 U JP H0479466U JP 12201590 U JP12201590 U JP 12201590U JP 12201590 U JP12201590 U JP 12201590U JP H0479466 U JPH0479466 U JP H0479466U
- Authority
- JP
- Japan
- Prior art keywords
- hybrid
- circuit
- leadless
- protrusions
- pattern connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図Ａ，Ｂは本考案によるリードレスハイブ
リツトＩＣの実施例の斜視図、第２図Ａ，Ｂはリ
ードレスハイブリツトＩＣを実装するプリント配
線基板のパターン面の平面図、第３図は従来のハ
イブリツトＩＣの斜視図である。
図において、１はリードレスハイブリツトＩＣ
、２は回路部品、３はプラスチツク樹脂、４はセ
ラミツク基板、５は突起部、６は入出力パターン
、７はスルーホール、８はプリント配線基板、９
は突起部挿入孔、１０はランド、１１は従来ハイ
ブリツトＩＣ、１２はリードフレームである。
1A and B are perspective views of an embodiment of the leadless hybrid IC according to the present invention, FIGS. 2A and 2B are plan views of the patterned surface of the printed wiring board on which the leadless hybrid IC is mounted, and FIG. 3 1 is a perspective view of a conventional hybrid IC. In the figure, 1 is a leadless hybrid IC.
, 2 is a circuit component, 3 is a plastic resin, 4 is a ceramic substrate, 5 is a projection, 6 is an input/output pattern, 7 is a through hole, 8 is a printed wiring board, 9
10 is a projection insertion hole, 10 is a land, 11 is a conventional hybrid IC, and 12 is a lead frame.
Claims (1)
に複数の突起部を櫛形状に設け、前記突起部の平
面部の一面に回路に接続されたパターンを形成し
たことを特徴とするリードレスハイブリツドＩＣ
。 (2) 前記突起部の両側面に回路に接続したパタ
ーンを形成した請求項(1)記載のリードレスハイ
ブリツドＩＣ。[Claims for Utility Model Registration] (1) A plurality of protrusions are provided in a comb shape on one side of a ceramic substrate constituting a circuit, and a pattern connected to the circuit is formed on one surface of the flat part of the protrusions. A leadless hybrid IC that is characterized by
. (2) The leadless hybrid IC according to claim 1, wherein a pattern connected to a circuit is formed on both sides of the protrusion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12201590U JPH0479466U (en) | 1990-11-21 | 1990-11-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12201590U JPH0479466U (en) | 1990-11-21 | 1990-11-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0479466U true JPH0479466U (en) | 1992-07-10 |
Family
ID=31869820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12201590U Pending JPH0479466U (en) | 1990-11-21 | 1990-11-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0479466U (en) |
-
1990
- 1990-11-21 JP JP12201590U patent/JPH0479466U/ja active Pending