JPH0478701B2 - - Google Patents
Info
- Publication number
- JPH0478701B2 JPH0478701B2 JP60126434A JP12643485A JPH0478701B2 JP H0478701 B2 JPH0478701 B2 JP H0478701B2 JP 60126434 A JP60126434 A JP 60126434A JP 12643485 A JP12643485 A JP 12643485A JP H0478701 B2 JPH0478701 B2 JP H0478701B2
- Authority
- JP
- Japan
- Prior art keywords
- lead material
- conductivity
- alloy
- semiconductor devices
- alloy lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 27
- 239000004065 semiconductor Substances 0.000 claims description 18
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 17
- 239000012535 impurity Substances 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000005097 cold rolling Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Conductive Materials (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60126434A JPS61284946A (ja) | 1985-06-11 | 1985-06-11 | 半導体装置用Cu合金リ−ド素材 |
JP3206445A JP2565029B2 (ja) | 1985-06-11 | 1991-07-23 | 半導体装置リード材 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60126434A JPS61284946A (ja) | 1985-06-11 | 1985-06-11 | 半導体装置用Cu合金リ−ド素材 |
JP3206445A JP2565029B2 (ja) | 1985-06-11 | 1991-07-23 | 半導体装置リード材 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3206445A Division JP2565029B2 (ja) | 1985-06-11 | 1991-07-23 | 半導体装置リード材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61284946A JPS61284946A (ja) | 1986-12-15 |
JPH0478701B2 true JPH0478701B2 (ko) | 1992-12-11 |
Family
ID=26462619
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60126434A Granted JPS61284946A (ja) | 1985-06-11 | 1985-06-11 | 半導体装置用Cu合金リ−ド素材 |
JP3206445A Expired - Lifetime JP2565029B2 (ja) | 1985-06-11 | 1991-07-23 | 半導体装置リード材 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3206445A Expired - Lifetime JP2565029B2 (ja) | 1985-06-11 | 1991-07-23 | 半導体装置リード材 |
Country Status (1)
Country | Link |
---|---|
JP (2) | JPS61284946A (ko) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005213629A (ja) * | 2004-02-02 | 2005-08-11 | Nikko Metal Manufacturing Co Ltd | 銅合金の熱処理方法と銅合金および素材 |
JP4756197B2 (ja) * | 2005-08-23 | 2011-08-24 | Dowaメタルテック株式会社 | Cu−Mg−P系銅合金およびその製造法 |
CN105745340A (zh) * | 2013-12-19 | 2016-07-06 | 住友电气工业株式会社 | 铜合金线、铜合金绞合线、电线、带端子电线及铜合金线的制造方法 |
JP6187630B1 (ja) * | 2016-03-30 | 2017-08-30 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品、端子、及び、バスバー |
CN107709585B (zh) | 2015-09-09 | 2020-12-04 | 三菱综合材料株式会社 | 电子电气设备用铜合金、电子电气设备用铜合金塑性加工材、电子电气设备用组件、端子及汇流条 |
JP6187629B1 (ja) * | 2016-03-30 | 2017-08-30 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品、端子、及び、バスバー |
CN107636179B (zh) | 2015-09-09 | 2020-06-16 | 三菱综合材料株式会社 | 电子电气设备用铜合金、电子电气设备用铜合金塑性加工材、电子电气设备用组件、端子及汇流条 |
WO2017043551A1 (ja) | 2015-09-09 | 2017-03-16 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品、端子、及び、バスバー |
US20180171437A1 (en) * | 2015-09-09 | 2018-06-21 | Mitsubishi Materials Corporation | Copper alloy for electronic/electrical device, copper alloy plastically-worked material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar |
US11203806B2 (en) | 2016-03-30 | 2021-12-21 | Mitsubishi Materials Corporation | Copper alloy for electronic and electrical equipment, copper alloy plate strip for electronic and electrical equipment, component for electronic and electrical equipment, terminal, busbar, and movable piece for relay |
WO2017170733A1 (ja) | 2016-03-30 | 2017-10-05 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、バスバー、及び、リレー用可動片 |
MX2020009869A (es) | 2018-03-30 | 2020-10-12 | Mitsubishi Materials Corp | Aleacion de cobre para dispositivo electronico/electrico, material en lamina/tira de aleacion de cobre para dispositivo electronico/electrico, componente para dispositivo electronico/electrico, terminal, y barra colectora. |
JP6780187B2 (ja) | 2018-03-30 | 2020-11-04 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS572851A (en) * | 1980-06-06 | 1982-01-08 | Nippon Mining Co Ltd | Copper alloy for lead material of semiconductor device |
JPS57108235A (en) * | 1980-12-24 | 1982-07-06 | Sumitomo Electric Ind Ltd | Copper alloy for lead frame |
JPS6039139A (ja) * | 1983-08-12 | 1985-02-28 | Mitsui Mining & Smelting Co Ltd | 耐軟化高伝導性銅合金 |
JPS6046340A (ja) * | 1983-08-23 | 1985-03-13 | Furukawa Electric Co Ltd:The | リ−ドフレ−ム用銅合金 |
JPS6075541A (ja) * | 1983-09-30 | 1985-04-27 | Tatsuta Electric Wire & Cable Co Ltd | 耐熱性、機械的特性及び導電性に優れた銅合金 |
JPS60114556A (ja) * | 1983-11-24 | 1985-06-21 | Mitsui Mining & Smelting Co Ltd | 銅基合金の製造方法 |
JPS60245754A (ja) * | 1984-05-22 | 1985-12-05 | Nippon Mining Co Ltd | 高力高導電銅合金 |
JPS61119660A (ja) * | 1984-11-16 | 1986-06-06 | Nippon Mining Co Ltd | 高力高導電性銅基合金の製造方法 |
JPS61266540A (ja) * | 1985-05-21 | 1986-11-26 | Mitsubishi Electric Corp | 銅基合金 |
JPS61266541A (ja) * | 1985-05-21 | 1986-11-26 | Mitsubishi Electric Corp | 銅基合金 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5324917B2 (ko) * | 1972-05-31 | 1978-07-24 | ||
JPS52103316A (en) * | 1976-02-27 | 1977-08-30 | Furukawa Electric Co Ltd:The | Heat-resisting copper alloy having excellent electrical conductivity a nd thermal conductivity |
-
1985
- 1985-06-11 JP JP60126434A patent/JPS61284946A/ja active Granted
-
1991
- 1991-07-23 JP JP3206445A patent/JP2565029B2/ja not_active Expired - Lifetime
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS572851A (en) * | 1980-06-06 | 1982-01-08 | Nippon Mining Co Ltd | Copper alloy for lead material of semiconductor device |
JPS57108235A (en) * | 1980-12-24 | 1982-07-06 | Sumitomo Electric Ind Ltd | Copper alloy for lead frame |
JPS6039139A (ja) * | 1983-08-12 | 1985-02-28 | Mitsui Mining & Smelting Co Ltd | 耐軟化高伝導性銅合金 |
JPS6046340A (ja) * | 1983-08-23 | 1985-03-13 | Furukawa Electric Co Ltd:The | リ−ドフレ−ム用銅合金 |
JPS6075541A (ja) * | 1983-09-30 | 1985-04-27 | Tatsuta Electric Wire & Cable Co Ltd | 耐熱性、機械的特性及び導電性に優れた銅合金 |
JPS60114556A (ja) * | 1983-11-24 | 1985-06-21 | Mitsui Mining & Smelting Co Ltd | 銅基合金の製造方法 |
JPS60245754A (ja) * | 1984-05-22 | 1985-12-05 | Nippon Mining Co Ltd | 高力高導電銅合金 |
JPS61119660A (ja) * | 1984-11-16 | 1986-06-06 | Nippon Mining Co Ltd | 高力高導電性銅基合金の製造方法 |
JPS61266540A (ja) * | 1985-05-21 | 1986-11-26 | Mitsubishi Electric Corp | 銅基合金 |
JPS61266541A (ja) * | 1985-05-21 | 1986-11-26 | Mitsubishi Electric Corp | 銅基合金 |
Also Published As
Publication number | Publication date |
---|---|
JP2565029B2 (ja) | 1996-12-18 |
JPS61284946A (ja) | 1986-12-15 |
JPH05306421A (ja) | 1993-11-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |