JPH0478150A - Tab tape - Google Patents

Tab tape

Info

Publication number
JPH0478150A
JPH0478150A JP19245190A JP19245190A JPH0478150A JP H0478150 A JPH0478150 A JP H0478150A JP 19245190 A JP19245190 A JP 19245190A JP 19245190 A JP19245190 A JP 19245190A JP H0478150 A JPH0478150 A JP H0478150A
Authority
JP
Japan
Prior art keywords
inner leads
tab tape
oriented
way
directions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19245190A
Other languages
Japanese (ja)
Inventor
Takashi Yoshimori
吉森 崇
Isamu Iwabuchi
岩淵 勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Electronic Device Solutions Corp
Original Assignee
Toshiba Corp
Toshiba Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Microelectronics Corp filed Critical Toshiba Corp
Priority to JP19245190A priority Critical patent/JPH0478150A/en
Publication of JPH0478150A publication Critical patent/JPH0478150A/en
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To make a common TAB tape usable even when the size of chips and position of pads vary more or less by forming inner leads oriented in the same inward direction at nearly equal intervals in such a way that the length of the inner leads becomes longer toward central ones from those at both ends and the inner leads do not cross other inner leads oriented in other directions. CONSTITUTION:A plurality of inner leads 10a oriented in the same direction are formed inward at nearly equal intervals in such a way that the length of the inner leads becomes longer toward central ones from those at both ends and the inner leads do not cross other inner leads oriented in other directions. When this TAB tape is formed in such a way, bonding of the leads to chips having different sizes and shapes can be performed by using this TAB tape.

Description

【発明の詳細な説明】 〔発明の目的〕 (産業上の利用分野) 本発明はTABテープに関するものである。[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a TAB tape.

(従来の技術) 一般に、T A B <Tape Automated
 Bonding)技術は、例えばポリイミドからなる
フィルムに配線リードを形成し、このリードとチップの
パッドとをバンブを介して接続するものであって、ワイ
ヤボンディングに代る技術である。
(Prior art) Generally, T A B <Tape Automated
The bonding technique is an alternative to wire bonding, in which a wiring lead is formed on a film made of polyimide, for example, and the lead is connected to a pad of a chip via a bump.

従来、配線リードが形成されたフィルム、すなわちTA
Bテープは第6図に示すようにチップ20のサイズに合
ったインナリード10が設計され使用されてきている。
Conventionally, a film on which wiring leads are formed, that is, TA
The B tape has been designed and used with an inner lead 10 that matches the size of the chip 20, as shown in FIG.

(発明が解決しようとする課題) このような従来のTABテープについては、チップ20
のサイズもしくはバッド15の位置が多少でも異なる場
合に専用のTABテープを使用する必要があり、TAB
テープを共通に使用できないという問題がある。
(Problem to be Solved by the Invention) Regarding such conventional TAB tape, the chip 20
If the size or the position of the pad 15 differs even slightly, it is necessary to use a special TAB tape.
There is a problem that tapes cannot be used in common.

又、従来のTABテープを使用する場合は、チップ20
内のパッド位置に制約ができ、配置の自由化が困難であ
った。
Also, when using conventional TAB tape, tip 20
There were restrictions on the pad positions within the pad, making it difficult to free up the layout.

本発明は上記事情を考慮してなされたものであって、チ
ップサイズやパッド位置が多少異なっていても共通に使
用することのできるTABテープを提供をすることを目
的とする。
The present invention has been made in consideration of the above circumstances, and it is an object of the present invention to provide a TAB tape that can be commonly used even if the chip size and pad position are slightly different.

〔発明の構成〕[Structure of the invention]

(課題を解決するための手段) 本発明のTABテープは、同し向きの複数のインナリー
ドが他の向きのインナリードと交差することなく、ほぼ
同一の間隔を保ちながらその長さが端部から中央部に行
くにつれて増加するように中心部に向って形成されてい
ることを特徴とする。
(Means for Solving the Problems) In the TAB tape of the present invention, a plurality of inner leads oriented in the same direction do not intersect with inner leads oriented in other directions, and their lengths are extended to the ends while maintaining substantially the same spacing. It is characterized in that it is formed toward the center so that it increases as it goes from there to the center.

(作 用) このように構成された本発明のTABテープによれば、
同じ向きの複数のインナリードが他の向きのインナーリ
ードと交差することなく、ほぼ同一の間隔を保ちながら
その長さが端部から中央部に行くにつれて増加するよう
に中心部に向って形成されている。これにより、チップ
サイズやパッド位置が多少異なっていても共通に使用す
ることができる。
(Function) According to the TAB tape of the present invention configured as described above,
A plurality of inner leads oriented in the same direction do not intersect with inner leads oriented in other directions, and are formed toward the center so that their lengths increase from the ends to the center while maintaining approximately the same spacing. ing. This allows common use even if the chip size and pad position are slightly different.

(実施例) 第1図に本発明によるTABテープの一実施例を示す。(Example) FIG. 1 shows an embodiment of the TAB tape according to the present invention.

この実施例のTABテープは、同じ向きの複数のインナ
リード10aが他の向きのインナリード10b、10c
、10dと交差することなくほぼ同一の間隔を保ちなか
らその長さか端部から中央部に行くにつれて増加するよ
うに中心部に向って形成されている。
The TAB tape of this embodiment has a plurality of inner leads 10a facing the same direction and inner leads 10b, 10c facing other directions.
, 10d and are formed at approximately the same distance from each other, but their lengths increase from the ends toward the center.

このようにすることにより第2図(a)、  (b)に
示すようにサイズや形状か異なるチップ20へのボンデ
ィングを本実施例のTABテープを用いて行うことがで
きる。又、第5図(a)、  (b)。
By doing so, as shown in FIGS. 2(a) and 2(b), bonding to chips 20 having different sizes and shapes can be performed using the TAB tape of this embodiment. Also, Figures 5(a) and (b).

(C)1こ示すよう1こAS I C(八ppliea
LionSpeclf’ic Ic)用チップのように
チップサイズは異なっているがパッドピッチが同一のチ
ップ10a2Qb、2CICに関しては、本実施例のT
ABテープを用いることによりチップ20a、20b。
(C) 1 AS I C (8 ppliea) as shown here.
Regarding the chips 10a2Qb and 2CIC, which have different chip sizes but the same pad pitch, such as the LionSpeclf'ic IC chip, the T
Chips 20a, 20b by using AB tape.

20Cヘボンデイングが各々の専用のTABテープを用
いないでも可能となる。
20C head bonding is possible without using each dedicated TAB tape.

又、本実施例のTABテープを用いることにより第3図
及び第4図に示すようにパッド15の位置をチップ20
の周辺に置かなくてチップ20の内部に設けることも可
能となる。これにより、パッドの位置についての制限が
緩和され、レイアウトの制限から生じるチップの回路性
能の低下を可及的に防止することができる。
Furthermore, by using the TAB tape of this embodiment, the position of the pad 15 can be adjusted to the position of the chip 20 as shown in FIGS. 3 and 4.
It is also possible to provide it inside the chip 20 instead of around it. As a result, restrictions on pad positions are relaxed, and deterioration in chip circuit performance due to layout restrictions can be prevented as much as possible.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、チップのサイズやパッドの位置が多少
異なっている場合でも共通のTABテープを用いること
ができる。
According to the present invention, a common TAB tape can be used even if the chip sizes and pad positions are slightly different.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明によるTABテープの一実施例の平面図
、第2図乃至第5図は本発明の詳細な説明する図、第6
図は従来のTABテープの平面図である。 10a、10b、10c、1−Od−・・インナリード
、15・・・パッド、20・・・チップ。 気1 図
FIG. 1 is a plan view of an embodiment of the TAB tape according to the present invention, FIGS. 2 to 5 are detailed illustrations of the present invention, and FIG.
The figure is a plan view of a conventional TAB tape. 10a, 10b, 10c, 1-Od-...inner lead, 15...pad, 20...chip. Qi 1 figure

Claims (1)

【特許請求の範囲】[Claims] 同じ向きの複数のインナリードが他の向きのインナリー
ドと交差することなく、ほぼ同一の間隔を保ちながらそ
の長さが端部から中央部に行くにつれて増加するように
中心部に向って形成されていることを特徴とするTAB
テープ。
A plurality of inner leads oriented in the same direction do not intersect with inner leads oriented in other directions, and are formed toward the center so that their lengths increase from the ends to the center while maintaining approximately the same spacing. TAB characterized by
tape.
JP19245190A 1990-07-20 1990-07-20 Tab tape Pending JPH0478150A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19245190A JPH0478150A (en) 1990-07-20 1990-07-20 Tab tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19245190A JPH0478150A (en) 1990-07-20 1990-07-20 Tab tape

Publications (1)

Publication Number Publication Date
JPH0478150A true JPH0478150A (en) 1992-03-12

Family

ID=16291524

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19245190A Pending JPH0478150A (en) 1990-07-20 1990-07-20 Tab tape

Country Status (1)

Country Link
JP (1) JPH0478150A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0855879A (en) * 1994-08-16 1996-02-27 Nec Corp Tape for tab and manufacture of semiconductor device using tape for tab

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0855879A (en) * 1994-08-16 1996-02-27 Nec Corp Tape for tab and manufacture of semiconductor device using tape for tab

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