JPS63104435A - Semiconductor device - Google Patents

Abstract

PURPOSE:To increase the number of wiring parts to be used for electrical connection to a semiconductor pellet by using a tape carrier whose extraction electrodes are formed at the peripheral part of a film and its inside region. CONSTITUTION:At this semiconductor device the inside end of a wire 7 at a tape carrier 3 is connected to a bump electrode 2a at a semiconductor pellet 2; the wire is connected electrically to a wiring part 4 on a wiring substrate 1 through a bump electrode 8 at its external end. The bump electrode 8 acting an extraction electrode at the tape carrier 3 is formed not only at the peripheral part of a film 6 but also at its inside region; all the bump electrodes 8 are connected electrically to the wires 7. It a semiconductor device is manufactured by using this tape carrier 3, it is possible to increase the number of bump electrodes which can be formed as a unit of the tape carrier 3. As a result, it is possible to increase the number of wiring parts to be used for electrical connection to the semiconductor pellet.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a technique that is effective when applied to improving the performance of semiconductor devices.

[Conventional technology]

2. Description of the Related Art Some semiconductor devices are manufactured using so-called tape carriers for the purpose of automating their manufacturing and downsizing the devices. Regarding this semiconductor device, for example, on January 15, 1980, published by Industrial Research Institute Co., Ltd.
C implementation technology JPI43 has an explanation.

The tape carrier has a plurality of units of predetermined wiring to which semiconductor pellets can be attached, arranged in series on a long film made of, for example, polyimide resin.

One unit of the tape carrier generally consists of a substantially rectangular shape divided by a predetermined length in the length direction of the film, and the inner end of the wiring for bonding to the electrode of the semiconductor pellet is arranged in the center of the rectangle. A lead electrode for the above-mentioned wiring for drawing out conduction from the semiconductor pellet to the outside is provided on the peripheral edge thereof.

[Problem that the invention seeks to solve]

As mentioned above, in one unit of tape carrier, the extraction electrodes are arranged only at the periphery of the unit, so it is not possible to secure a sufficient number of extraction electrodes, which is why the tape carrier technology is highly integrated. The inventors have discovered that there is a problem in that it is difficult to apply this method to the manufacture of semiconductor devices.

An object of the present invention is to provide a technique that allows tape carriers to be easily applied to the manufacture of highly integrated semiconductor devices.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means for solving problems]

A brief overview of typical inventions disclosed in this application is as follows.

That is, a semiconductor device is manufactured using a tape carrier in which lead-out electrodes for drawing out conduction from wiring formed on a film constituting one unit are formed on the periphery of the film and its inner region. This is what we do.

[Effect]

According to the above-mentioned means, since a large number of extraction electrodes can be formed in one unit of the tape carrier, the number of wirings that can be used for electrical connection of semiconductor pellets can be increased, and the above object can be achieved. be.

〔Example〕

FIG. 1 is an enlarged plan view schematically showing one unit of a tape carrier applied to a semiconductor device according to an embodiment of the present invention, and FIG. 2 is an enlarged plan view schematically showing the semiconductor device of this embodiment. FIG.

The semiconductor device of this embodiment has semiconductor pellets 2 mounted on a wiring board 1 which is a so-called printed circuit board. The semiconductor pellet 2 is electrically connected to the wiring 4 of the wiring board 1 via a so-called tape carrier 3.

Next, the tape carrier 3 will be explained in detail.

One unit of the tape carrier 3 is shown in FIG. 1, and a large number of the units are arranged in a row in the left-right direction in the figure. As shown in FIG. 1, the unit has a wiring 7 made of copper foil in a predetermined shape adhered to a film 6 made of polyimide resin with an opening 5 formed in the center thereof. . The inner end of the wiring 7 extends beyond the film end of the opening, and the outer end thereof is connected to a bump electrode (lead electrode) 8.

The semiconductor device of this embodiment is made by using the tape carrier 3 for electrical connection as described above. Specifically, as shown in FIG. The bump electrode 2a of the semiconductor pellet 2 is connected to the bump electrode 2a of the semiconductor pellet 2, and is electrically connected to the wiring 4 of the wiring board 1 via the bump electrode 8 at the outer end.

In this embodiment, the bump electrodes 8, which are the lead-out electrodes of the tape carrier 3, are formed not only on the peripheral edge of the film 60 but also on its inner region, and are arranged in two rows around the periphery. All of the bump electrodes 8 are electrically connected to the wiring 7 (in FIG. 1, only some of the bump electrodes are shown connected to the wiring 7,
Others are omitted).

As described above, according to this embodiment, the following effects can be obtained.

[1) Bump electrode 8 for drawing out conduction from the wiring 4 formed on the film 6 constituting one unit.
However, by manufacturing a semiconductor device using the tape carrier 3 formed on the peripheral edge of the film 6 and its inner region, it is possible to increase the number of bump electrodes that can be formed in one unit of the tape carrier 3. Therefore, the number of wiring lines that can be used for electrical connection of semiconductor pellets can be increased.

(2) According to (1) above, a highly integrated semiconductor device can be manufactured using the tape carrier 3.

(3) By forming the bump electrode 8 also in the inner region, the area can be enlarged, so that the bump electrode 8 can be made larger.

[4) According to (3) above, the electrical connection with the wiring 4 can be ensured, so reliability can be improved.

(5) By using the bump electrode 8 as the extraction electrode, alignment and connection with the wiring 4 can be easily and accurately achieved.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, in the above embodiment, the bump electrodes 8 are arranged in two rows around the film 6 constituting one unit of the tape carrier 3, but the bump electrodes 8 are not limited to this, and the bump electrodes 8 may be arranged in three or more rows. Needless to say, they may be formed in any arbitrary arrangement.

Furthermore, although the extraction electrode is made up of the bump electrode 8, it may have any shape as long as it can be connected to the wiring 4 without necessarily having the bump electrode 8.

The material and shape of the semiconductor device shown in the example and the tape carrier 3 applied thereto are as follows:
It goes without saying that the embodiments are not limited to those shown in the embodiments described above, and that various modifications can be made within the range that the intended purpose can be achieved.

In the above explanation, the invention made by the present inventor is mainly applied to a semiconductor device in which semiconductor pellets are mounted on a wiring board made of resin, which is the background field of application of the invention, but the invention is not limited to this. For example, if a semiconductor device can be manufactured using a tape carrier, it is an effective technique that can be applied to all semiconductor devices regardless of their package type.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

That is, a semiconductor device is manufactured using a tape carrier in which extraction electrodes for drawing out conduction from wiring formed on a film constituting one unit are formed on the peripheral edge of the film and its inner region. By doing so,
Since the number of extraction electrodes formed in one unit of the tape carrier can be increased, the number of wirings that can be used for electrical connection of semiconductor pellets can be increased, and as a result, by using the tape carrier, This makes it possible to manufacture highly integrated semiconductor devices.

[Brief explanation of the drawing]

FIG. 1 is an enlarged plan view schematically showing one unit of a tape carrier applied to a semiconductor device according to an embodiment of the present invention, and FIG.
It is a partial cross-sectional view at a position corresponding to the -■ line. 1... Wiring board, 2... Semiconductor pellet, 2a...
- Bump electrode, 3... Tape carrier, 4... Wiring, 5... Opening, 6... Film, 7... Wiring,
8... Bump electrode (lead electrode). Figure 1: Guu Co., Ltd. Lili-Shibo

Claims (1)

[Claims] 1. A semiconductor device in which semiconductor pellets are electrically connected using a tape carrier, in which an extraction electrode from a wiring formed on a film constituting one unit of the tape carrier is connected to the film. A semiconductor device formed in a peripheral portion and an inner region thereof. 2. The semiconductor device according to claim 1, wherein the electrode is a bump electrode.