JPH0477662B2 - - Google Patents

Info

Publication number
JPH0477662B2
JPH0477662B2 JP59168213A JP16821384A JPH0477662B2 JP H0477662 B2 JPH0477662 B2 JP H0477662B2 JP 59168213 A JP59168213 A JP 59168213A JP 16821384 A JP16821384 A JP 16821384A JP H0477662 B2 JPH0477662 B2 JP H0477662B2
Authority
JP
Japan
Prior art keywords
metal foil
resin
belt
laminate
curing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59168213A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6144642A (ja
Inventor
Fumio Yamaguchi
Hisao Inami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Priority to JP59168213A priority Critical patent/JPS6144642A/ja
Publication of JPS6144642A publication Critical patent/JPS6144642A/ja
Publication of JPH0477662B2 publication Critical patent/JPH0477662B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Laminated Bodies (AREA)
JP59168213A 1984-08-10 1984-08-10 金属箔張り積層板の製造法 Granted JPS6144642A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59168213A JPS6144642A (ja) 1984-08-10 1984-08-10 金属箔張り積層板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59168213A JPS6144642A (ja) 1984-08-10 1984-08-10 金属箔張り積層板の製造法

Publications (2)

Publication Number Publication Date
JPS6144642A JPS6144642A (ja) 1986-03-04
JPH0477662B2 true JPH0477662B2 (OSRAM) 1992-12-09

Family

ID=15863881

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59168213A Granted JPS6144642A (ja) 1984-08-10 1984-08-10 金属箔張り積層板の製造法

Country Status (1)

Country Link
JP (1) JPS6144642A (OSRAM)

Also Published As

Publication number Publication date
JPS6144642A (ja) 1986-03-04

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