JPH0472692B2 - - Google Patents

Info

Publication number
JPH0472692B2
JPH0472692B2 JP59168211A JP16821184A JPH0472692B2 JP H0472692 B2 JPH0472692 B2 JP H0472692B2 JP 59168211 A JP59168211 A JP 59168211A JP 16821184 A JP16821184 A JP 16821184A JP H0472692 B2 JPH0472692 B2 JP H0472692B2
Authority
JP
Japan
Prior art keywords
metal foil
resin
curing
lower metal
adhesive tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59168211A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6144640A (ja
Inventor
Fumio Yamaguchi
Akinori Hisanaga
Hisao Inami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Priority to JP59168211A priority Critical patent/JPS6144640A/ja
Publication of JPS6144640A publication Critical patent/JPS6144640A/ja
Publication of JPH0472692B2 publication Critical patent/JPH0472692B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Laminated Bodies (AREA)
JP59168211A 1984-08-10 1984-08-10 金属箔張り積層板の製造における下面金属箔の汚損防止方法 Granted JPS6144640A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59168211A JPS6144640A (ja) 1984-08-10 1984-08-10 金属箔張り積層板の製造における下面金属箔の汚損防止方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59168211A JPS6144640A (ja) 1984-08-10 1984-08-10 金属箔張り積層板の製造における下面金属箔の汚損防止方法

Publications (2)

Publication Number Publication Date
JPS6144640A JPS6144640A (ja) 1986-03-04
JPH0472692B2 true JPH0472692B2 (OSRAM) 1992-11-18

Family

ID=15863843

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59168211A Granted JPS6144640A (ja) 1984-08-10 1984-08-10 金属箔張り積層板の製造における下面金属箔の汚損防止方法

Country Status (1)

Country Link
JP (1) JPS6144640A (OSRAM)

Also Published As

Publication number Publication date
JPS6144640A (ja) 1986-03-04

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