JPH0476052U - - Google Patents
Info
- Publication number
- JPH0476052U JPH0476052U JP11968990U JP11968990U JPH0476052U JP H0476052 U JPH0476052 U JP H0476052U JP 11968990 U JP11968990 U JP 11968990U JP 11968990 U JP11968990 U JP 11968990U JP H0476052 U JPH0476052 U JP H0476052U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- leads
- semiconductor device
- cathode
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例によるリードの半
田メツキ装置の構成を示す正断面図、第２図は同
実施例における陽極と半導体装置の各リードとの
位置関係を平面図、第３図はクワツドフラツトパ
ツケージタイプの半導体装置を示す斜視図、第４
図は従来のリードの半田メツキ装置の概略構成を
示す正断面図である。
１……半導体装置、１ｂ，１ｂ，……リード、
１０……陰極、１３……陽極。
FIG. 1 is a front sectional view showing the structure of a lead soldering device according to an embodiment of this invention, FIG. 2 is a plan view showing the positional relationship between the anode and each lead of a semiconductor device in the same embodiment, and FIG. 4 is a perspective view showing a quad flat package type semiconductor device.
The figure is a front sectional view showing a schematic configuration of a conventional lead solder plating device. 1... Semiconductor device, 1b, 1b,... Lead,
10... cathode, 13... anode.
Claims (1)
リードに当接する陰極と、 前記各リードと離間して配設された陽極と、を
用いて半田メツキ液中にて前記各リードに半田メ
ツキを施すリードの半田メツキ装置において、 前記陽極は前記各リードの配設に沿つた対向面
を有しており、しかも前記各リードに対して前記
陰極と反対側に配設されていることを特徴とする
リードの半田メツキ装置。[Claims for Utility Model Registration] A cathode that contacts a plurality of leads disposed around the main body of a semiconductor device, and an anode disposed apart from each of the leads are used to immerse the semiconductor device in a solder plating solution. In the lead soldering device for soldering each lead, the anode has an opposing surface along the arrangement of the leads, and a surface opposite to the cathode with respect to each lead. A lead soldering device characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990119689U JPH0744025Y2 (en) | 1990-11-15 | 1990-11-15 | Lead solder plating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990119689U JPH0744025Y2 (en) | 1990-11-15 | 1990-11-15 | Lead solder plating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0476052U true JPH0476052U (en) | 1992-07-02 |
| JPH0744025Y2 JPH0744025Y2 (en) | 1995-10-09 |
Family
ID=31867632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990119689U Expired - Lifetime JPH0744025Y2 (en) | 1990-11-15 | 1990-11-15 | Lead solder plating equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0744025Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63263752A (en) * | 1987-04-22 | 1988-10-31 | Nec Corp | High-speed partially plating device |
| JPH02111898A (en) * | 1988-10-20 | 1990-04-24 | Mitsubishi Electric Corp | Producing device for semiconductor element |
-
1990
- 1990-11-15 JP JP1990119689U patent/JPH0744025Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63263752A (en) * | 1987-04-22 | 1988-10-31 | Nec Corp | High-speed partially plating device |
| JPH02111898A (en) * | 1988-10-20 | 1990-04-24 | Mitsubishi Electric Corp | Producing device for semiconductor element |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0744025Y2 (en) | 1995-10-09 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |