JPH0472649U - - Google Patents
Info
- Publication number
- JPH0472649U JPH0472649U JP11631290U JP11631290U JPH0472649U JP H0472649 U JPH0472649 U JP H0472649U JP 11631290 U JP11631290 U JP 11631290U JP 11631290 U JP11631290 U JP 11631290U JP H0472649 U JPH0472649 U JP H0472649U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- view
- outer lead
- cross
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000004381 surface treatment Methods 0.000 claims 1
Description
第１図は本考案の一実施例の斜視図、第２図ａ
及びｂは本考案の表面実装型半導体装置を配線基
板に半田付けした斜視状態図、アウターリード部
の詳細図、第３図ａ及びｂは本考案の表面実装型
半導体装置用リードフレームの正面図ならびに断
面図、第４図は従来の半導装置の一例の斜視図、
第５図ａ及びｂは、従来の表面実装型半導体装置
用リードフレームの正面図ならびに断面図、第６
図は従来の表面実装型半導体装置の断面図、第７
図ａ及びｂは従来の表面実装型半導体装置を配線
基板上半田付けした斜視状態図ならびにアウター
リード部の詳細図である。
１……半導体容器、２……アウターリード、３
……タブ部、４……アウターリード（リードフレ
ーム）、４′……インナーリード、５……タイバ
ー、６……リードフレーム外枠、７……配線基板
、８……電極、９……アウターリード部先端部、
１０……アウターリード側部、１１……アウター
リード先端大府、１２……貫通孔。
Figure 1 is a perspective view of one embodiment of the present invention, Figure 2 a
3A and 3B are perspective views of the surface-mounted semiconductor device of the present invention soldered to a wiring board, a detailed view of the outer lead portion, and FIGS. 3a and 3b are front views of the lead frame for the surface-mounted semiconductor device of the present invention. and a sectional view, FIG. 4 is a perspective view of an example of a conventional semiconductor device,
5a and 5b are a front view and a cross-sectional view of a conventional lead frame for a surface-mounted semiconductor device, and FIG.
The figure is a cross-sectional view of a conventional surface-mounted semiconductor device.
Figures a and b are a perspective view of a conventional surface-mounted semiconductor device soldered onto a wiring board, and a detailed view of an outer lead portion. 1...Semiconductor container, 2...Outer lead, 3
...Tab portion, 4...Outer lead (lead frame), 4'...Inner lead, 5...Tie bar, 6...Lead frame outer frame, 7...Wiring board, 8...Electrode, 9...Outer Lead tip,
10... Outer lead side part, 11... Outer lead tip end, 12... Through hole.
Claims (1)
田メツキ表面処理が施された凹部を備えたことを
特徴とする半導体装置。 A semiconductor device characterized in that a cross section of a tip end of a surface-mounted outer lead is provided with a concave portion subjected to solder plating surface treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11631290U JPH0472649U (en) | 1990-11-06 | 1990-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11631290U JPH0472649U (en) | 1990-11-06 | 1990-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0472649U true JPH0472649U (en) | 1992-06-26 |
Family
ID=31864127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11631290U Pending JPH0472649U (en) | 1990-11-06 | 1990-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0472649U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003030259A1 (en) * | 2001-09-27 | 2003-04-10 | Hamamatsu Photonics K.K. | Semiconductor device and method of manufacturing the device |
-
1990
- 1990-11-06 JP JP11631290U patent/JPH0472649U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003030259A1 (en) * | 2001-09-27 | 2003-04-10 | Hamamatsu Photonics K.K. | Semiconductor device and method of manufacturing the device |
| CN100356560C (en) * | 2001-09-27 | 2007-12-19 | 浜松光子学株式会社 | Semiconductor device and method of manufacturing the device |