JPH0474452U - - Google Patents
Info
- Publication number
- JPH0474452U JPH0474452U JP11689990U JP11689990U JPH0474452U JP H0474452 U JPH0474452 U JP H0474452U JP 11689990 U JP11689990 U JP 11689990U JP 11689990 U JP11689990 U JP 11689990U JP H0474452 U JPH0474452 U JP H0474452U
- Authority
- JP
- Japan
- Prior art keywords
- cathode
- main body
- semiconductor
- lead
- contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 5
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例によるリードの半
田メツキ装置の構成を示す正断面図、第２図は同
装置に半導体装置を載置した状態を示す平面図、
第３図は本実施例のリード（位置）と半田メツキ
厚との関係を説明する図、第４図は本実施例のリ
ード（位置）と剥離強度との関係を説明する図、
第５図は従来の半田メツキ治具を用いた半田メツ
キを説明する図、第６図はリードの半田メツキ厚
と剥離強度との関係を説明する図、第７図はリー
ドの半田メツキ厚とブリツジ発生率との関係を説
明する図である。
５……本体部、６……リード、１１……陰極、
１３……陽極。
FIG. 1 is a front cross-sectional view showing the structure of a lead soldering device according to an embodiment of the invention, and FIG. 2 is a plan view showing a state in which a semiconductor device is mounted on the device.
FIG. 3 is a diagram illustrating the relationship between the lead (position) and solder plating thickness in this embodiment, and FIG. 4 is a diagram illustrating the relationship between the lead (position) and peel strength in this embodiment,
Figure 5 is a diagram explaining solder plating using a conventional solder plating jig, Figure 6 is a diagram explaining the relationship between lead solder plating thickness and peel strength, and Figure 7 is a diagram explaining the relationship between lead solder plating thickness and peel strength. It is a figure explaining the relationship with a bridge occurrence rate. 5... Main body, 6... Lead, 11... Cathode,
13...Anode.
Claims (1)
ドに当接する陰極と、 前記半導体の本体部の角近傍で、該半導体に対
して延出方向の異なるリード間の間隙まで延設さ
れ、前記リードに対し、前記陰極の反対側に配設
される陽極と、 を具備し、半田メツキ液中にて前記陽極と前記陰
極との間に電流を流すことにより、前記リードに
半田を電析させることを特徴とするリードの半田
メツキ装置。[Claims for Utility Model Registration] A cathode that comes into contact with a plurality of leads arranged around a main body of a semiconductor; and a cathode that contacts a plurality of leads arranged around a main body of a semiconductor; and a cathode that contacts a plurality of leads disposed around a main body of a semiconductor; and a cathode that contacts a plurality of leads arranged around a main body of a semiconductor; an anode extending to a gap and disposed on the opposite side of the cathode with respect to the lead, and passing a current between the anode and the cathode in a soldering solution, A lead solder plating device characterized in that solder is electrodeposited onto the lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11689990U JP2530881Y2 (en) | 1990-11-07 | 1990-11-07 | Semiconductor device lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11689990U JP2530881Y2 (en) | 1990-11-07 | 1990-11-07 | Semiconductor device lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0474452U true JPH0474452U (en) | 1992-06-30 |
| JP2530881Y2 JP2530881Y2 (en) | 1997-04-02 |
Family
ID=31864753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11689990U Expired - Fee Related JP2530881Y2 (en) | 1990-11-07 | 1990-11-07 | Semiconductor device lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2530881Y2 (en) |
-
1990
- 1990-11-07 JP JP11689990U patent/JP2530881Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2530881Y2 (en) | 1997-04-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0474452U (en) | ||
| JPH0476052U (en) | ||
| JP2926497B2 (en) | Method for manufacturing semiconductor device | |
| JPS62104477U (en) | ||
| JPH02125351U (en) | ||
| JPH02136301U (en) | ||
| JPH01212490A (en) | Connecting structure of substrate | |
| JPH036842U (en) | ||
| JPS63188957U (en) | ||
| JPS61136530U (en) | ||
| JPH0275769U (en) | ||
| JPH036843U (en) | ||
| JPS60113161U (en) | Two-part silver brazed structure | |
| JPS59158545A (en) | Lead frame | |
| JPS6194356U (en) | ||
| JPS60169267U (en) | Anode device in electroplating equipment | |
| JPH01104738U (en) | ||
| JPH0442079U (en) | ||
| JPS63177043U (en) | ||
| JPS6054342U (en) | semiconductor equipment | |
| JPS63162539U (en) | ||
| JPH0269964U (en) | ||
| JPH08124802A (en) | Polar chip part | |
| JPH02118932U (en) | ||
| JPH0287371U (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |