JPH01212490A - Connecting structure of substrate - Google Patents
Connecting structure of substrateInfo
- Publication number
- JPH01212490A JPH01212490A JP3725888A JP3725888A JPH01212490A JP H01212490 A JPH01212490 A JP H01212490A JP 3725888 A JP3725888 A JP 3725888A JP 3725888 A JP3725888 A JP 3725888A JP H01212490 A JPH01212490 A JP H01212490A
- Authority
- JP
- Japan
- Prior art keywords
- aluminum base
- flexible substrate
- substrate
- recess
- base substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 48
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 23
- 229910000679 solder Inorganic materials 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 abstract description 3
- 238000000926 separation method Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 239000011889 copper foil Substances 0.000 description 17
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、フレキシブル基板とアルミベース基板とを接
続する基板の接続構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a substrate connection structure for connecting a flexible substrate and an aluminum base substrate.
［従来の技術］
従来のこの種の基板の接続構造は、たとえば、第７図お
よび第８図に示すような構成からなっている。[Prior Art] A conventional connection structure of this type of board has a structure as shown in FIGS. 7 and 8, for example.
第７図および第８図において、１はアルミベース基板、
２はフレキシブル基板、３は半田、４は銅箔パターンで
ある。In FIGS. 7 and 8, 1 is an aluminum base substrate;
2 is a flexible substrate, 3 is solder, and 4 is a copper foil pattern.
すなわち、フレキシブル基板２の銅箔パターン４とこれ
に対向して密着されるアルミベース基板１の銅箔パター
ン４との間に存在する半田３によって電気的接続を得る
とともに、機械的接続も行なっている。That is, electrical connection is obtained by the solder 3 existing between the copper foil pattern 4 of the flexible substrate 2 and the copper foil pattern 4 of the aluminum base substrate 1 which is closely adhered to the flexible substrate 2, and a mechanical connection is also made. There is.
［発明が解決しようとする課題］
前述の第７図および第８図に示した従来の技術では、対
向する銅箔パターン４．４の間に存在する半田３の量が
少なく、電気的接続は得られるものの、十分な機械的接
続が得られなく、フレキシブル基板２が容易に剥離する
という問題点があった。[Problems to be Solved by the Invention] In the conventional technology shown in FIGS. 7 and 8 described above, the amount of solder 3 existing between the opposing copper foil patterns 4.4 is small, and the electrical connection is poor. Although this can be obtained, there is a problem that sufficient mechanical connection cannot be obtained and the flexible substrate 2 easily peels off.
本発明は、このような問題点を解決しようとするもので
ある。すなわち、本発明は、電気的接続はもちろんのこ
と、十分な機械的接続強度を得ることができて、フレキ
シブル基板の剥離を防止することができる基板の接続構
造を提供することを目的とするものである。The present invention attempts to solve these problems. That is, an object of the present invention is to provide a substrate connection structure that can obtain not only electrical connection but also sufficient mechanical connection strength and prevent peeling of the flexible substrate. It is.
［ａ題を解決するための手段］
上記目的を達成するために、本発明は、導電パターンを
露出させたフレキシブル基板の端部とアルミベース基板
とを電気的に接続する接続構造において、前記アルミベ
ース基板上の該フレキシブル基板と接続される部分に、
凹部による半田溜りを備えているものとした。[Means for Solving Problem A] In order to achieve the above object, the present invention provides a connection structure for electrically connecting an end of a flexible substrate with an exposed conductive pattern and an aluminum base substrate. In the part connected to the flexible board on the base board,
It is assumed that a solder pool is provided by a recessed portion.
−［作 用］
本発明によれば、導電パターンを露出させたフレキシブ
ル基板の端部と電気的に接続されるアルミベース基板上
の銅箔パターン部に凹部を設けて半田溜り部を形成して
いるから、該凹部による半田溜り部に十分な半田量が存
在し、電気的接続については、もちろんのこと、十分な
機械的強度が得られて、フレキシブル基板のアルミベー
ス基板からの剥離が防止される。- [Function] According to the present invention, a solder pool is formed by providing a recess in the copper foil pattern on the aluminum base board that is electrically connected to the end of the flexible board with the conductive pattern exposed. Therefore, there is a sufficient amount of solder in the solder pool created by the recess, which provides not only electrical connection but also sufficient mechanical strength to prevent the flexible board from peeling off from the aluminum base board. Ru.
［実施例］
第１図および第２図は本発明の第１実施例を示している
。[Embodiment] FIGS. 1 and 2 show a first embodiment of the present invention.
第１図および第２図において、１はアルミベース基板、
２はフレキシブル基板、３は半田、４は導電パターンと
しての銅箔パターンである。また５は該アルミベース基
板１に設けられた凹部である。In Figures 1 and 2, 1 is an aluminum base substrate;
2 is a flexible substrate, 3 is solder, and 4 is a copper foil pattern as a conductive pattern. Further, 5 is a recess provided in the aluminum base substrate 1.
すなわち、フレキシブル基板２の露出しな銅箔パターン
４と対向するアルミベース基板１の銅箔パターン４の部
分には、銅箔パターン４を形成したのち、凹部５が設け
られ、この凹部５を含む溶着される銅箔パターン部に十
分な予備半田を付て半田溜りを形成するようにし、フレ
キシブル基板２の対応する銅箔パターン４を位置合わせ
し、レーザー等の加熱方式を用いて半田３を溶融させて
溶着を行なう。このように接続されたフレキシブル基板
２とアルミベース基板１との銅箔パターン４の間では、
凹部５により、半田３が溜っており、電気的接続が得ら
れると同時に十分な機械的接続がなされる。このため、
アルミベース基板１からのフレキシブル基板２の剥離が
防止された構造となっている。That is, after forming the copper foil pattern 4, a recess 5 is provided in a portion of the copper foil pattern 4 of the aluminum base substrate 1 that faces the exposed copper foil pattern 4 of the flexible substrate 2, and a concave portion 5 including the recess 5 is provided. Apply enough preliminary solder to the copper foil pattern to be welded to form a solder pool, align the corresponding copper foil pattern 4 on the flexible board 2, and melt the solder 3 using a heating method such as a laser. Then perform welding. Between the copper foil pattern 4 of the flexible substrate 2 and aluminum base substrate 1 connected in this way,
The solder 3 is collected in the recess 5, and an electrical connection is obtained as well as a sufficient mechanical connection. For this reason,
The structure prevents the flexible substrate 2 from peeling off from the aluminum base substrate 1.
第３図は本発明の第２実施例を示している。FIG. 3 shows a second embodiment of the invention.
この第２実施例では、フレキシブル基板２と接続される
アルミベース基板１上の銅箔パターン４の部分の凹部５
が複数設けられており、機械的接続強度が増加している
。In this second embodiment, a recess 5 in a portion of a copper foil pattern 4 on an aluminum base substrate 1 to be connected to a flexible substrate 2 is shown.
are provided, increasing mechanical connection strength.
、第４図は本発明の第３実施例を示している。, FIG. 4 shows a third embodiment of the invention.
この′ｓ３実施例では、フレキシブル基板２と接続され
るアルミベース基板１上の銅箔パターン４の部分を基板
端面で曲げることにより、段差を設けてそこに凹部５に
よる半田溜り部としている。In the 's3 embodiment, a portion of the copper foil pattern 4 on the aluminum base substrate 1 connected to the flexible substrate 2 is bent at the end face of the substrate to provide a step, and a recess 5 forms a solder pool there.
第５図および第６図は本発明の第４実施例を示している
。この第４実施例では、フレキシブル基板２と接続され
るアルミベース基板１上の銅箔パターン４の部分におい
て、その部分のみを凹部５とし、銅箔パターン間との間
に段差を設けることにより半田３の溜り部としている。5 and 6 show a fourth embodiment of the invention. In this fourth embodiment, in the portion of the copper foil pattern 4 on the aluminum base substrate 1 to be connected to the flexible substrate 2, only that portion is made into a recess 5, and a step is provided between the copper foil patterns to prevent soldering. This is the reservoir for 3.
［発明の効果］
以上説明したように、本発明によれば、導電パターンを
露出させたフレキシブル基板の端部とアルミベース基板
とを電気的に接続する接続構造において、アルミベース
基板上のフレキシブル基板と接続される部分に凹部を設
けて半田溜り部を形成しているから、その凹部による半
田溜り部に十分な量の半田が存在していて、電気的接続
を得ると同時に十分な機械的接続強度が得られ、フレキ
シブル基板の剥離を防止できる効果がある。[Effects of the Invention] As explained above, according to the present invention, in a connection structure that electrically connects an end of a flexible substrate with an exposed conductive pattern and an aluminum base substrate, a flexible substrate on an aluminum base substrate is provided. Since a recess is provided in the part to be connected to form a solder pool, a sufficient amount of solder exists in the solder pool due to the recess, and at the same time an electrical connection is obtained, a sufficient mechanical connection is also achieved. It has the effect of providing strength and preventing peeling of the flexible substrate.
第１図は本発明の第１実施例を示した斜視図、第２図は
第１図の切断線Ａ−Ａ’ に沿う断面側面図、第３図は
本発明の第２実施例を示した断面側面図、第４図は同じ
く第３実施例を示した断面側面部、第５図は同じく第４
実施例を示した斜視図、第６図は３４５図の切断線Ｂ−
Ｂ′に沿）断面側面図、第７図は従来の技術の一例を示
した斜視図、第８図は第７図の切断線ｃ−ｃ’ に沿う
断面側面図である。
１・・・アルミベース基板
２・・・フレキシブル基板
３・・・半１） ４・・・銅箔パターン５・・・
凹部
第１図FIG. 1 is a perspective view showing a first embodiment of the present invention, FIG. 2 is a cross-sectional side view taken along section line AA' in FIG. 1, and FIG. 3 is a perspective view showing a second embodiment of the present invention. FIG. 4 is a cross-sectional side view showing the third embodiment, and FIG. 5 is a cross-sectional side view showing the fourth embodiment.
A perspective view showing the embodiment, FIG. 6 is taken along the cutting line B- in FIG. 345.
7 is a perspective view showing an example of the prior art, and FIG. 8 is a sectional side view taken along section line c-c' in FIG. 7. 1... Aluminum base board 2... Flexible board 3... Half 1) 4... Copper foil pattern 5...
Recess Figure 1
Claims (1)
とアルミベース基板とを電気的に接続する接続構造にお
いて、前記アルミベース基板上の該フレキシブル基板と
接続される部分に、凹部による半田溜り部を備えている
ことを特徴とする基板の接続構造。1. In a connection structure for electrically connecting an end of a flexible substrate with an exposed conductive pattern and an aluminum base substrate, a portion of the aluminum base substrate to be connected to the flexible substrate is provided with a solder pool formed by a recess. A board connection structure characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3725888A JPH01212490A (en) | 1988-02-19 | 1988-02-19 | Connecting structure of substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3725888A JPH01212490A (en) | 1988-02-19 | 1988-02-19 | Connecting structure of substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01212490A true JPH01212490A (en) | 1989-08-25 |
Family
ID=12492627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3725888A Pending JPH01212490A (en) | 1988-02-19 | 1988-02-19 | Connecting structure of substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01212490A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101901771A (en) * | 2010-06-01 | 2010-12-01 | 江苏省宜兴电子器件总厂 | Technology for combining external lead wire with ceramic base of ceramic small outline shell |
-
1988
- 1988-02-19 JP JP3725888A patent/JPH01212490A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101901771A (en) * | 2010-06-01 | 2010-12-01 | 江苏省宜兴电子器件总厂 | Technology for combining external lead wire with ceramic base of ceramic small outline shell |
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