CN101901771A - Technology for combining external lead wire with ceramic base of ceramic small outline shell - Google Patents
Technology for combining external lead wire with ceramic base of ceramic small outline shell Download PDFInfo
- Publication number
- CN101901771A CN101901771A CN2010101895218A CN201010189521A CN101901771A CN 101901771 A CN101901771 A CN 101901771A CN 2010101895218 A CN2010101895218 A CN 2010101895218A CN 201010189521 A CN201010189521 A CN 201010189521A CN 101901771 A CN101901771 A CN 101901771A
- Authority
- CN
- China
- Prior art keywords
- ceramic
- base
- outer lead
- hole
- small outline
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses a technology for combining an external lead wire with a ceramic base of a ceramic small outline shell, which comprises the following steps of: drilling a through hole at an external lead wire arranging position on the base of the ceramic shell, wherein the through hole is vertical to the external lead wire, and the diameter of the through hole is less than and equal to the width of a pin of the external lead wire; printing metallized sizing agent at the lead wire arranging position on the ceramic base to form into a metallized zone; metallizing the through hole; performing the ceramic cutting to the base of the ceramic shell, so that the through hole is changed to be a semi-cylindrical groove; jointly burning a ceramic part and a metallized line; and welding the external lead wire and the ceramic base with welding material, wherein the braze welding temperature is 800-900 DEG C and the welding time is 1-2h. When braze welding, the solid welding material is melted to be liquid, flows at the metallized zone along the external lead wire, and forms into a certain welding material accumulation in the semi-cylindrical groove, wherein the accumulation area is larger than that of the existing technology, so that technology has the anti-tension intensity which is about 3 times of that of the existing combing technology.
Description
Technical field
The present invention relates to a kind of package of ic, is a kind of outer lead of ceramic small outline shell and the combined process of base of ceramic specifically.
Background technology
The outer lead width of ceramic small outline shell generally is no more than 0.40mm, and soldering length generally is no more than 1mm, and the soldering area of outer lead generally is no more than 0.40mm
2, in packing, leg scissors, shell installation process, when being subjected to bigger cross force as if outer lead, just may phenomenon appear tearing at the outer lead root therefore.
Summary of the invention
Goal of the invention: main purpose of the present invention is to overcome the deficiencies in the prior art, a kind of outer lead of ceramic small outline shell and the combined process of base of ceramic are provided, by via metal increasing stacked solder area, thereby strengthen the technology of base of ceramic and outer lead adhesion, the problem of tearing appears in solution outer lead root easily.
Technical scheme: in order to solve the problems of the technologies described above, the present invention has adopted following technical scheme:
The skill that combines of a kind of outer lead of ceramic small outline shell and base of ceramic, it comprises the steps:
(1) position of outer lead to be installed drills through the hole on the pedestal of ceramic package, and through hole is vertical with outer lead;
(2) the lead-in wire installation site forms metallized area with the printing of metallization slurry on base of ceramic;
(3) through hole is metallized;
(4) the ceramic package pedestal is carried out the green cutting, make through hole become the semicolumn groove;
(5) ceramic member and metal line are carried out high temperature co-firing, burning temperature altogether is 1600～1700 ℃, and the burning time is 8～10h altogether;
(6) utilize scolder to weld together outer lead and base of ceramic and get final product, brazing temperature is 800～900 ℃, weld time 1～2h.
The cross section of the through hole in the step (1) is circular, forms the semicolumn groove through step (4).
The diameter of through hole is smaller or equal to the pin widths of outer lead described in the step (1); Width between the outer lead pin itself is very little, if through-hole diameter greater than the pin widths of outer lead, the one, influence the electric capacity of adjacent two lead-in wires between the pins, the 2nd, scolder is excessive during soldering, causes the pins interconnection of adjacent two lead-in wires easily, influences rate of finished products.Described through hole is by numerical control drilling machine or program control puncher moulding.
In the step (2), described metallization slurry is mixed together by the tungsten powder solubilizer of 1.1～1.4 microns of fineness, and tungsten powder accounts for 70～90% of metallization slurry total weight, and solvent accounts for 10～30% of metallization slurry total weight; Described solvent comprises the component of following content: the polyvinyl butyral resin that accounts for solvent total weight 5～15%, account for the butyl carbitol of solvent total weight 30～50%, account for the surfactant of solvent total weight 5～15%, account for the terpineol of solvent total weight 30～50%.
Wherein, described surfactant is the surfactant of N-10 for the model that U.S. Union Carbide Corp produces; Described terpineol is that the model that U.S. imperial crown chemical industry Co., Ltd produces is the terpineol of #318.
In the step (3), to the method realization of via metal employing aperture filler.
In the step (6), the fusing point of described scolder is lower than the fusing point of ceramic member and metal lead wire; Described scolder is for being yellow gold, and content is Ag72Cu28.
Beneficial effect: advantage of the present invention:
(1) the present invention is when soldering, and solid-state scolder is molten into liquid state, trickles at metallized area along outer lead, and in the semicolumn groove, form certain stacked solder, because of its stacked area bigger than existing technology, so when adopting the method, the tensile strength of outer lead is about 3 times of existing combination.
(2) hole wall metallization also plays that bonding region is corresponding with outer lead to be electrically connected effect simultaneously, omits side printing process in the former technology, has improved production efficiency.
(3) the side printing in the existing technology adopts manual mode para-linkage district and outer lead to be electrically connected, and all adopts automation equipment among the present invention, has improved finished product rate and efficient.
Embodiment:
It is base-material that the base of ceramic of ceramic small outline shell adopts 92% aluminium oxide, through operation moulding such as ball milling, batch mixing, curtain coating, punching, forming through holes, printing, hole wall metallization, lamination, cutting, cutting, sintering; Outer lead adopts 4J42 iron-nickel alloy material, through mould punching or etching method moulding; Base of ceramic soldering and outer lead weld with the Ag72Cu28 silver-copper brazing alloy.
Among the following embodiment, surfactant N-10 is available from U.S. Union Carbide Corp (U.S. Union Carbide), and the #318 terpineol is available from U.S. imperial crown chemical industry Co., Ltd (U.S. Crown chemica).
Embodiment 1:
(1) position of outer lead to be installed drills through the hole on the pedestal of ceramic package, and through hole is vertical with outer lead, and through hole is a manhole, and the diameter of through hole is smaller or equal to the pin widths of outer lead; Through hole is by numerical control drilling machine or program control puncher moulding, and the through hole hole wall is smooth, does not have broken porcelain particle.
(2) the lead-in wire installation site forms metallized area with the printing of metallization slurry on base of ceramic.In the step (2), described metallization slurry is mixed together by the tungsten powder solubilizer of 1.3 microns of fineness, and tungsten powder accounts for 80% of metallization slurry total weight, and solvent accounts for 20% of metallization slurry total weight;
Described solvent comprises the component of following content: account for the polyvinyl butyral resin of solvent total weight 10%, account for the butyl carbitol of solvent total weight 40%, account for the surfactant of solvent total weight 10%, account for the terpineol of solvent total weight 40%.
(3) through hole is metallized; Via metal employing aperture filler is realized that uniformity is answered in the through-hole wall hanging, should not have too much damaged (causing disconnection or formation layering between the levels), do not have and obviously pile up or the obstruction through hole; Should avoid the pollution between the two adjacent through holes simultaneously in order to avoid cause short circuit or decreasing insulating.
(4) the ceramic package pedestal is carried out the green cutting, make through hole become the semicolumn groove;
(5) ceramic member and metal line are carried out high temperature co-firing, burning temperature altogether is 1640 ℃, and the time is 8 hours.
(6) outer lead and base of ceramic are utilized the yellow gold welding, yellow gold content is Ag72Cu28.Brazing temperature is 850 ℃, and the time is 1 hour.In welding process, the semicolumn groove that melting solder trickles naturally and forms to through hole.
Embodiment 2:
(1) position of outer lead to be installed drills through the hole on the pedestal of ceramic package, and through hole is vertical with outer lead, and through hole is a manhole, and the diameter of through hole is smaller or equal to the pin widths of outer lead; Through hole is by numerical control drilling machine or program control puncher moulding, and the through hole hole wall is smooth, does not have broken porcelain particle.
(2) the lead-in wire installation site forms metallized area with the printing of metallization slurry on base of ceramic.In the step (2), described metallization slurry is mixed together by the tungsten powder solubilizer of 1.2 microns of fineness, and tungsten powder accounts for 70% of metallization slurry total weight, and solvent accounts for 30% of metallization slurry total weight;
Described solvent comprises the component of following content: account for the polyvinyl butyral resin of solvent total weight 5%, account for the butyl carbitol of solvent total weight 45%, account for the surfactant of solvent total weight 8%, account for the terpineol of solvent total weight 42%.
(3) through hole is metallized; Via metal employing aperture filler is realized that uniformity is answered in the through-hole wall hanging, should not have too much damaged (causing disconnection or formation layering between the levels), do not have and obviously pile up or the obstruction through hole; Should avoid the pollution between the two adjacent through holes simultaneously in order to avoid cause short circuit or decreasing insulating.
(4) the ceramic package pedestal is carried out the green cutting, make through hole become the semicolumn groove;
(5) ceramic member and metal line are carried out high temperature co-firing, burning temperature altogether is 1600 ℃, and the time is 9 hours;
(6) outer lead and base of ceramic are utilized the yellow gold welding, yellow gold content is Ag72Cu28.Brazing temperature is 800 ℃, and the time is 1.5 hours.In welding process, the semicolumn groove that melting solder trickles naturally and forms to through hole.
Embodiment 3:
(1) position of outer lead to be installed drills through the hole on the pedestal of ceramic package, and through hole is vertical with outer lead, and through hole is a manhole, and the diameter of through hole is smaller or equal to the pin widths of outer lead; Through hole is by numerical control drilling machine or program control puncher moulding, and the through hole hole wall is smooth, does not have broken porcelain particle.
(2) the lead-in wire installation site forms metallized area with the printing of metallization slurry on base of ceramic.In the step (2), described metallization slurry is mixed together by the tungsten powder solubilizer of 1.4 microns of fineness, and tungsten powder accounts for 90% of metallization slurry total weight, and solvent accounts for 10% of metallization slurry total weight;
Described solvent comprises the component of following content: account for the polyvinyl butyral resin of solvent total weight 12%, account for the butyl carbitol of solvent total weight 43%, account for the surfactant of solvent total weight 15%, account for the terpineol of solvent total weight 30%.
(3) through hole is metallized; Via metal employing aperture filler is realized that uniformity is answered in the through-hole wall hanging, should not have too much damaged (causing disconnection or formation layering between the levels), do not have and obviously pile up or the obstruction through hole; Should avoid the pollution between the two adjacent through holes simultaneously in order to avoid cause short circuit or decreasing insulating.
(4) the ceramic package pedestal is carried out the green cutting, make through hole become the semicolumn groove;
(5) ceramic member and metal line are carried out high temperature co-firing, burning temperature altogether is 1700 ℃, and the time is 10 hours;
(6) outer lead and base of ceramic are utilized the yellow gold welding, yellow gold content is Ag72Cu28.Brazing temperature is 900 ℃, and the time is 2 hours.In welding process, the semicolumn groove that melting solder trickles naturally and forms to through hole.
Claims (10)
1. the combined process of the outer lead of a ceramic small outline shell and base of ceramic is characterized in that, it comprises the steps:
(1) position of outer lead to be installed drills through the hole on the pedestal of ceramic package, and through hole is vertical with outer lead;
(2) the lead-in wire installation site forms metallized area with the printing of metallization slurry on base of ceramic;
(3) through hole is metallized;
(4) the ceramic package pedestal is carried out the green cutting, make through hole become the semicolumn groove;
(5) ceramic member and metal line are carried out high temperature co-firing, burning temperature altogether is 1600～1700 ℃, and the burning time is 8～10h altogether;
(6) utilize scolder to weld together outer lead and base of ceramic and get final product, brazing temperature is 800～900 ℃, weld time 1～2h.
2. the outer lead of a kind of ceramic small outline shell according to claim 1 and the combined process of base of ceramic is characterized in that: the cross section of the through hole in the step (1) is circular, forms the semicolumn groove through step (4).
3. the outer lead of a kind of ceramic small outline shell according to claim 1 and the combined process of base of ceramic is characterized in that, the diameter of through hole is smaller or equal to the pin widths of outer lead described in the step (1).
4. the outer lead of a kind of ceramic small outline shell according to claim 1 and the combined process of base of ceramic is characterized in that, described through hole is by numerical control drilling machine or program control puncher moulding.
5. the outer lead of a kind of ceramic small outline shell according to claim 1 and the combined process of base of ceramic, it is characterized in that, in the step (2), described metallization slurry is mixed together by the tungsten powder solubilizer of 1.1～1.4 microns of fineness, tungsten powder accounts for 70～90% of metallization slurry total weight, and solvent accounts for 10～30% of metallization slurry total weight;
Described solvent comprises the component of following content: the polyvinyl butyral resin that accounts for solvent total weight 5～15%, account for the butyl carbitol of solvent total weight 30～50%, account for the surfactant of solvent total weight 5～15%, account for the terpineol of solvent total weight 30～50%.
6. the outer lead of a kind of ceramic small outline shell according to claim 5 and the combined process of base of ceramic is characterized in that, described surfactant is the surfactant of N-10 for the model that U.S. Union Carbide Corp produces.
7. the outer lead of a kind of ceramic small outline shell according to claim 5 and the combined process of base of ceramic is characterized in that, described terpineol is that the model that U.S. imperial crown chemical industry Co., Ltd produces is the terpineol of #318.
8. the outer lead of a kind of ceramic small outline shell according to claim 1 and the combined process of base of ceramic is characterized in that, in the step (3), to the method realization of via metal employing aperture filler.
9. the outer lead of a kind of ceramic small outline shell according to claim 1 and the combined process of base of ceramic is characterized in that, in the step (6), the fusing point of described scolder is lower than the fusing point of ceramic member and metal lead wire.
10. the outer lead of a kind of ceramic small outline shell according to claim 9 and the combined process of base of ceramic is characterized in that, described scolder is for being yellow gold, and content is Ag72Cu28.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010189521 CN101901771B (en) | 2010-06-01 | 2010-06-01 | Technology for combining external lead wire with ceramic base of ceramic small outline shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010189521 CN101901771B (en) | 2010-06-01 | 2010-06-01 | Technology for combining external lead wire with ceramic base of ceramic small outline shell |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101901771A true CN101901771A (en) | 2010-12-01 |
| CN101901771B CN101901771B (en) | 2012-03-21 |
Family
ID=43227198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010189521 Active CN101901771B (en) | 2010-06-01 | 2010-06-01 | Technology for combining external lead wire with ceramic base of ceramic small outline shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101901771B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102709646A (en) * | 2012-06-28 | 2012-10-03 | 苏州市新诚氏电子有限公司 | Aluminum oxide ceramic substrate 1W 13dB attenuation sheet |
| CN103187316A (en) * | 2013-03-12 | 2013-07-03 | 江苏省宜兴电子器件总厂 | Hole wall metalizing process during production of ceramic shells |
| CN103681593A (en) * | 2013-12-02 | 2014-03-26 | 江苏省宜兴电子器件总厂 | Leadless ceramic chip carrier packaging structure and process for manufacturing same |
| CN107481989A (en) * | 2017-06-26 | 2017-12-15 | 中国电子科技集团公司第五十五研究所 | A kind of high bending fatigue strength ceramic package outer lead and preparation method |
| CN114178647A (en) * | 2021-11-18 | 2022-03-15 | 西安赛尔电子材料科技有限公司 | Controllable flow process method for brazing filler metal |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01212490A (en) * | 1988-02-19 | 1989-08-25 | Canon Inc | Connecting structure of substrate |
| JP2001160666A (en) * | 1999-11-30 | 2001-06-12 | Murata Mfg Co Ltd | Module board and manufacturing method |
| CN1305338A (en) * | 1999-10-25 | 2001-07-25 | 株式会社村田制作所 | Module substrate and its manufacturing method |
| CN1426271A (en) * | 2001-12-05 | 2003-06-25 | 株式会社村田制作所 | Circuit board device and its mounting method |
-
2010
- 2010-06-01 CN CN 201010189521 patent/CN101901771B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01212490A (en) * | 1988-02-19 | 1989-08-25 | Canon Inc | Connecting structure of substrate |
| CN1305338A (en) * | 1999-10-25 | 2001-07-25 | 株式会社村田制作所 | Module substrate and its manufacturing method |
| JP2001160666A (en) * | 1999-11-30 | 2001-06-12 | Murata Mfg Co Ltd | Module board and manufacturing method |
| CN1426271A (en) * | 2001-12-05 | 2003-06-25 | 株式会社村田制作所 | Circuit board device and its mounting method |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102709646A (en) * | 2012-06-28 | 2012-10-03 | 苏州市新诚氏电子有限公司 | Aluminum oxide ceramic substrate 1W 13dB attenuation sheet |
| CN103187316A (en) * | 2013-03-12 | 2013-07-03 | 江苏省宜兴电子器件总厂 | Hole wall metalizing process during production of ceramic shells |
| WO2014139187A1 (en) * | 2013-03-12 | 2014-09-18 | 江苏省宜兴电子器件总厂 | Hole wall metalizing process during production of ceramic shells |
| CN103187316B (en) * | 2013-03-12 | 2016-04-20 | 江苏省宜兴电子器件总厂 | The via hole technique in a kind of ceramic package production |
| CN103681593A (en) * | 2013-12-02 | 2014-03-26 | 江苏省宜兴电子器件总厂 | Leadless ceramic chip carrier packaging structure and process for manufacturing same |
| CN107481989A (en) * | 2017-06-26 | 2017-12-15 | 中国电子科技集团公司第五十五研究所 | A kind of high bending fatigue strength ceramic package outer lead and preparation method |
| CN114178647A (en) * | 2021-11-18 | 2022-03-15 | 西安赛尔电子材料科技有限公司 | Controllable flow process method for brazing filler metal |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101901771B (en) | 2012-03-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101901771B (en) | Technology for combining external lead wire with ceramic base of ceramic small outline shell | |
| CN104388861B (en) | A kind of polycrystalline series LED manufacture method of fine silver billon bonding line | |
| CN101626005B (en) | Bonding filamentary silver and preparation method thereof | |
| CN107256834B (en) | A kind of bonding semiconductor technique based on palladium copper wire | |
| CN105014259A (en) | Seamless flux-cored wire and processing method thereof | |
| TW201516018A (en) | Method of manufacturing conductive metallization layer on ceramic substrate | |
| CN111283302A (en) | Electric arc additive manufacturing device and process for coaxial wire feeding and powder feeding consumable electrode | |
| CN101707295A (en) | Copper-aluminium explosion composite electrical T type copper-aluminium bimetal binding clip and explosion welding method | |
| CN107912069A (en) | Leaded carriers structure without die attached pad and the encapsulation being consequently formed | |
| CN104282637B (en) | Flip chip semiconductor package structure | |
| KR101633170B1 (en) | Solder,aluminum electric wire body and motor using the same | |
| CN104393392B (en) | Preparation method of microwave and millimeter-wave strip transmission line | |
| CN102800765A (en) | Light emitting diode (LED) packaging structure and packaging process for same | |
| CN105290653A (en) | Manufacturing method for rosin soldering tin bar | |
| CN104191101B (en) | A kind of clean Sn-Zn solder of few shortcoming containing palladium and preparation method thereof | |
| CN102044445B (en) | Method for manufacturing lead frame of no-lead semiconductor package (QFN) | |
| CN107516653A (en) | Small size quad flat non-pin type encapsulates interlayer interconnection structure and manufacture method | |
| CN104851755B (en) | Fuse and its production method | |
| CN203339210U (en) | LED eutectic packaging pedestal, | |
| CN111872510A (en) | Laser tin soldering welding tip structure and using method thereof | |
| CN102054813B (en) | Encapsulation substrate unit bodies with plated through holes and manufacturing method thereof | |
| CN105290652A (en) | Preparation method of silver-added soldering tin | |
| CN204209357U (en) | A kind of suspended fuse type fuse | |
| CN105551899B (en) | A kind of manufacturing process of fuse integrated formula binding post | |
| KR100772937B1 (en) | Process for manufacturing time-delay micro-fuse and a micro-fuse manufactured therefrom |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 214221 No. 200 Dingshan North Road, Dingshu Town, Yixing City, Jiangsu Province Patentee after: Jiangsu Yixing electronic device General Factory Co., Ltd. Address before: 214221 No. 200 Dingshan North Road, Dingshu Town, Yixing City, Jiangsu Province Patentee before: Yixing Electronic Device Factory, Jiangsu Province |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 214221 No. 200 Dingshan North Road, Dingshu Town, Yixing City, Jiangsu Province Patentee after: Jiangsu Yixing electronic device General Factory Co., Ltd. Address before: 214221 No. 200 Dingshan North Road, Dingshu Town, Yixing City, Jiangsu Province Patentee before: Yixing Electronic Device Factory, Jiangsu Province |