JPH047552B2 - - Google Patents
Info
- Publication number
- JPH047552B2 JPH047552B2 JP58135883A JP13588383A JPH047552B2 JP H047552 B2 JPH047552 B2 JP H047552B2 JP 58135883 A JP58135883 A JP 58135883A JP 13588383 A JP13588383 A JP 13588383A JP H047552 B2 JPH047552 B2 JP H047552B2
- Authority
- JP
- Japan
- Prior art keywords
- pin
- shape memory
- female contact
- connector
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 29
- 210000002105 tongue Anatomy 0.000 claims description 14
- 230000009466 transformation Effects 0.000 claims description 14
- 238000000034 method Methods 0.000 description 36
- 238000003780 insertion Methods 0.000 description 29
- 230000037431 insertion Effects 0.000 description 29
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 22
- 229910045601 alloy Inorganic materials 0.000 description 16
- 239000000956 alloy Substances 0.000 description 16
- 239000010408 film Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 14
- 229910000734 martensite Inorganic materials 0.000 description 13
- 230000003446 memory effect Effects 0.000 description 13
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 239000007788 liquid Substances 0.000 description 11
- 229910052757 nitrogen Inorganic materials 0.000 description 11
- 238000003486 chemical etching Methods 0.000 description 8
- 239000011888 foil Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000004544 sputter deposition Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 238000005304 joining Methods 0.000 description 5
- 238000007740 vapor deposition Methods 0.000 description 5
- 229910017535 Cu-Al-Ni Inorganic materials 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000005219 brazing Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 238000010791 quenching Methods 0.000 description 4
- 230000000171 quenching effect Effects 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 229910000990 Ni alloy Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910017532 Cu-Be Inorganic materials 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009760 electrical discharge machining Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910017777 Cu—Al—Zn Inorganic materials 0.000 description 1
- 229910017870 Cu—Ni—Al Inorganic materials 0.000 description 1
- 229910002551 Fe-Mn Inorganic materials 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 229910017309 Mo—Mn Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910008894 U—Mo Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910001000 nickel titanium Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58135883A JPS6028183A (ja) | 1983-07-27 | 1983-07-27 | コネクタ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58135883A JPS6028183A (ja) | 1983-07-27 | 1983-07-27 | コネクタ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6028183A JPS6028183A (ja) | 1985-02-13 |
| JPH047552B2 true JPH047552B2 (zh) | 1992-02-12 |
Family
ID=15162006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58135883A Granted JPS6028183A (ja) | 1983-07-27 | 1983-07-27 | コネクタ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6028183A (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6332475U (zh) * | 1986-08-18 | 1988-03-02 | ||
| DE102005027852A1 (de) * | 2005-06-16 | 2006-12-21 | Robert Bosch Gmbh | Anordnung und Verfahren zum elektrischen Anschluss einer elektronischen Schaltung in einem Gehäuse |
| JP4922777B2 (ja) * | 2007-01-31 | 2012-04-25 | 矢崎総業株式会社 | 金属板に対する端子の接続方法 |
| JP6056502B2 (ja) * | 2013-01-25 | 2017-01-11 | 株式会社オートネットワーク技術研究所 | ノイズフィルタ内蔵型コネクタ |
-
1983
- 1983-07-27 JP JP58135883A patent/JPS6028183A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6028183A (ja) | 1985-02-13 |
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