JPH0474858B2 - - Google Patents

Info

Publication number
JPH0474858B2
JPH0474858B2 JP63285062A JP28506288A JPH0474858B2 JP H0474858 B2 JPH0474858 B2 JP H0474858B2 JP 63285062 A JP63285062 A JP 63285062A JP 28506288 A JP28506288 A JP 28506288A JP H0474858 B2 JPH0474858 B2 JP H0474858B2
Authority
JP
Japan
Prior art keywords
pad
insulating film
interlayer insulating
wiring metal
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63285062A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0214527A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP63285062A priority Critical patent/JPH0214527A/ja
Publication of JPH0214527A publication Critical patent/JPH0214527A/ja
Publication of JPH0474858B2 publication Critical patent/JPH0474858B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
JP63285062A 1988-11-11 1988-11-11 Ｍｏｓ型半導体装置 Granted JPH0214527A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63285062A JPH0214527A (ja) 1988-11-11 1988-11-11 Ｍｏｓ型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63285062A JPH0214527A (ja) 1988-11-11 1988-11-11 Ｍｏｓ型半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP55163567A Division JPS5787145A (en) 1980-11-20 1980-11-20 Semiconductor device

Publications (2)

Publication Number Publication Date
JPH0214527A JPH0214527A (ja) 1990-01-18
JPH0474858B2 true JPH0474858B2 (enrdf_load_stackoverflow) 1992-11-27

Family

ID=17686667

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63285062A Granted JPH0214527A (ja) 1988-11-11 1988-11-11 Ｍｏｓ型半導体装置

Country Status (1)

Country Link
JP (1) JPH0214527A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9786616B2 (en) 2015-08-20 2017-10-10 Seiko Epson Corporation Semiconductor apparatus, method for manufacturing the same, electronic device, and moving body

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4498182B2 (ja) * 1996-03-13 2010-07-07 セイコーインスツル株式会社 半導体集積回路とその製造方法
JP3398609B2 (ja) * 1998-11-30 2003-04-21 シャープ株式会社 半導体装置
JP2005243907A (ja) 2004-02-26 2005-09-08 Renesas Technology Corp 半導体装置
JP2007005539A (ja) * 2005-06-23 2007-01-11 Seiko Epson Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9786616B2 (en) 2015-08-20 2017-10-10 Seiko Epson Corporation Semiconductor apparatus, method for manufacturing the same, electronic device, and moving body

Also Published As

Publication number Publication date
JPH0214527A (ja) 1990-01-18

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